JPS61172393A - 電子部品搭載用基板およびその製造方法 - Google Patents

電子部品搭載用基板およびその製造方法

Info

Publication number
JPS61172393A
JPS61172393A JP60013052A JP1305285A JPS61172393A JP S61172393 A JPS61172393 A JP S61172393A JP 60013052 A JP60013052 A JP 60013052A JP 1305285 A JP1305285 A JP 1305285A JP S61172393 A JPS61172393 A JP S61172393A
Authority
JP
Japan
Prior art keywords
substrate
recess
metal plate
mounting
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60013052A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0376795B2 (enExample
Inventor
矢津　一
勝美 馬渕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP60013052A priority Critical patent/JPS61172393A/ja
Publication of JPS61172393A publication Critical patent/JPS61172393A/ja
Publication of JPH0376795B2 publication Critical patent/JPH0376795B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP60013052A 1985-01-26 1985-01-26 電子部品搭載用基板およびその製造方法 Granted JPS61172393A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60013052A JPS61172393A (ja) 1985-01-26 1985-01-26 電子部品搭載用基板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60013052A JPS61172393A (ja) 1985-01-26 1985-01-26 電子部品搭載用基板およびその製造方法

Publications (2)

Publication Number Publication Date
JPS61172393A true JPS61172393A (ja) 1986-08-04
JPH0376795B2 JPH0376795B2 (enExample) 1991-12-06

Family

ID=11822356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60013052A Granted JPS61172393A (ja) 1985-01-26 1985-01-26 電子部品搭載用基板およびその製造方法

Country Status (1)

Country Link
JP (1) JPS61172393A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01112739A (ja) * 1987-10-27 1989-05-01 Matsushita Electric Works Ltd 電子部品実装用プリント配線板
JPH0379440U (enExample) * 1989-12-01 1991-08-13
JP2007311510A (ja) * 2006-05-18 2007-11-29 Ngk Spark Plug Co Ltd 配線基板
JP2010258260A (ja) * 2009-04-27 2010-11-11 Nec Corp 放熱プリント基板
JP2014146723A (ja) * 2013-01-30 2014-08-14 Hitachi Power Semiconductor Device Ltd パワー半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946086A (ja) * 1982-09-09 1984-03-15 イビデン株式会社 プリント配線基板とその製造方法
JPS5946087A (ja) * 1982-09-09 1984-03-15 イビデン株式会社 プリント配線基板
JPS5967687A (ja) * 1982-10-12 1984-04-17 イビデン株式会社 プリント配線基板
JPS5967686A (ja) * 1982-10-12 1984-04-17 イビデン株式会社 プリント配線基板とその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946086A (ja) * 1982-09-09 1984-03-15 イビデン株式会社 プリント配線基板とその製造方法
JPS5946087A (ja) * 1982-09-09 1984-03-15 イビデン株式会社 プリント配線基板
JPS5967687A (ja) * 1982-10-12 1984-04-17 イビデン株式会社 プリント配線基板
JPS5967686A (ja) * 1982-10-12 1984-04-17 イビデン株式会社 プリント配線基板とその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01112739A (ja) * 1987-10-27 1989-05-01 Matsushita Electric Works Ltd 電子部品実装用プリント配線板
JPH0379440U (enExample) * 1989-12-01 1991-08-13
JP2007311510A (ja) * 2006-05-18 2007-11-29 Ngk Spark Plug Co Ltd 配線基板
JP2010258260A (ja) * 2009-04-27 2010-11-11 Nec Corp 放熱プリント基板
JP2014146723A (ja) * 2013-01-30 2014-08-14 Hitachi Power Semiconductor Device Ltd パワー半導体装置

Also Published As

Publication number Publication date
JPH0376795B2 (enExample) 1991-12-06

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