JPS61171257U - - Google Patents

Info

Publication number
JPS61171257U
JPS61171257U JP1985054506U JP5450685U JPS61171257U JP S61171257 U JPS61171257 U JP S61171257U JP 1985054506 U JP1985054506 U JP 1985054506U JP 5450685 U JP5450685 U JP 5450685U JP S61171257 U JPS61171257 U JP S61171257U
Authority
JP
Japan
Prior art keywords
package
chip
utility
model registration
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985054506U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985054506U priority Critical patent/JPS61171257U/ja
Publication of JPS61171257U publication Critical patent/JPS61171257U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/1515Shape
    • H01L2924/15153Shape the die mounting substrate comprising a recess for hosting the device

Description

【図面の簡単な説明】
第1図はこの考案の一実施例によるパツケージ
の一部断面側面図、第2図および第3図はそれぞ
れ従来例を示す図である。 1……ICチツプ、2……チツプ取付用フレー
ム、3……導体部分、4……金線ワイヤ、5……
ICピン、6……パツケージ、7……封止用蓋、
8……凹凸形の放熱フイン。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) ICチツプを内蔵するパツケージ自体の表
    面に放熱用フインを直接形成したことを特徴とす
    るICパツケージ。 (2) ICチツプのパツケージへの取付け方向を
    放熱用フインが形成される上面側としたことを特
    徴とする実用新案登録請求の範囲第1項記載のI
    Cパツケージ。 (3) ICチツプのパツケージへの取付け面側を
    チツプ取付用フレームと一体化したことを特徴と
    する実用新案登録請求の範囲第2項記載のICパ
    ツケージ。
JP1985054506U 1985-04-10 1985-04-10 Pending JPS61171257U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985054506U JPS61171257U (ja) 1985-04-10 1985-04-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985054506U JPS61171257U (ja) 1985-04-10 1985-04-10

Publications (1)

Publication Number Publication Date
JPS61171257U true JPS61171257U (ja) 1986-10-24

Family

ID=30576328

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985054506U Pending JPS61171257U (ja) 1985-04-10 1985-04-10

Country Status (1)

Country Link
JP (1) JPS61171257U (ja)

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