JPH0446555U - - Google Patents
Info
- Publication number
- JPH0446555U JPH0446555U JP1990087703U JP8770390U JPH0446555U JP H0446555 U JPH0446555 U JP H0446555U JP 1990087703 U JP1990087703 U JP 1990087703U JP 8770390 U JP8770390 U JP 8770390U JP H0446555 U JPH0446555 U JP H0446555U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation fin
- semiconductor chip
- package
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
第１図は、本考案の一実施例を示す断面図、第
２図は、半導体チツプの平面図、第３図は、従来
例を示す断面図である。 １……ＩＣパツケージ、２……チツプ搭載基板
、５……キヤツプ、６……半導体チツプ、８……
放熱フイン。
２図は、半導体チツプの平面図、第３図は、従来
例を示す断面図である。 １……ＩＣパツケージ、２……チツプ搭載基板
、５……キヤツプ、６……半導体チツプ、８……
放熱フイン。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 熱伝導性の基板に半導体チツプを搭載した
ＩＣパツケージにおいて、前記基板に放熱フイン
をその下端部にて取り付け、前記半導体チツプで
発生した熱を前記放熱フインを介して放出するよ
うになされた放熱構造であつて、 前記放熱フインは、その中心胴体部の断面積が
下端部から上端部に向けて徐々に拡大するように
構成されたことを特徴とするＩＣパツケージの放
熱構造。 (2) 前記中心胴体部の下端部の断面積が前記半
導体チツプの前記基盤への取付面積よりも大であ
ることを特徴とする請求項１記載のＩＣパツケー
ジの放熱構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990087703U JPH0446555U (ja) | 1990-08-22 | 1990-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990087703U JPH0446555U (ja) | 1990-08-22 | 1990-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0446555U true JPH0446555U (ja) | 1992-04-21 |
Family
ID=31820298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990087703U Pending JPH0446555U (ja) | 1990-08-22 | 1990-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0446555U (ja) |
-
1990
- 1990-08-22 JP JP1990087703U patent/JPH0446555U/ja active Pending