JPH0247057U - - Google Patents
Info
- Publication number
- JPH0247057U JPH0247057U JP12641888U JP12641888U JPH0247057U JP H0247057 U JPH0247057 U JP H0247057U JP 12641888 U JP12641888 U JP 12641888U JP 12641888 U JP12641888 U JP 12641888U JP H0247057 U JPH0247057 U JP H0247057U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- resin
- semiconductor device
- chip
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図ａ
〜ｃは第１図の側面図、平面図及び正面図、第３
図ａ〜ｃは従来の樹脂封止型半導体装置の一例の
側面図、平面図及び正面図である。 ２……樹脂封止部、３……放熱フイン兼用リー
ド端子、４……リード端子、５……Ｔｒチツプ、
６……実装基板、７……凹部。
〜ｃは第１図の側面図、平面図及び正面図、第３
図ａ〜ｃは従来の樹脂封止型半導体装置の一例の
側面図、平面図及び正面図である。 ２……樹脂封止部、３……放熱フイン兼用リー
ド端子、４……リード端子、５……Ｔｒチツプ、
６……実装基板、７……凹部。
Claims (1)
- 半導体チツプを搭載するチツプ搭載部とシング
ルインラインのリード端子を有する樹脂封止型半
導体装置において、前記チツプ搭載部が両側に一
体で延在して凹部の先で直角に折曲られる側部を
有し、かつ該側部が前記リード端子の実装基板捜
入方向に対応する先端部で前記リード端子と反対
方向にＬ字型の形状を有することを特徴とする樹
脂封止型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12641888U JPH0247057U (ja) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12641888U JPH0247057U (ja) | 1988-09-27 | 1988-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247057U true JPH0247057U (ja) | 1990-03-30 |
Family
ID=31377924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12641888U Pending JPH0247057U (ja) | 1988-09-27 | 1988-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247057U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04117250U (ja) * | 1991-03-29 | 1992-10-20 | スズキ株式会社 | 終減速装置のブリーザ |
-
1988
- 1988-09-27 JP JP12641888U patent/JPH0247057U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04117250U (ja) * | 1991-03-29 | 1992-10-20 | スズキ株式会社 | 終減速装置のブリーザ |
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