JPS61168991A - 印刷回路基板 - Google Patents

印刷回路基板

Info

Publication number
JPS61168991A
JPS61168991A JP1060285A JP1060285A JPS61168991A JP S61168991 A JPS61168991 A JP S61168991A JP 1060285 A JP1060285 A JP 1060285A JP 1060285 A JP1060285 A JP 1060285A JP S61168991 A JPS61168991 A JP S61168991A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
core material
resin
ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1060285A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0416037B2 (enrdf_load_stackoverflow
Inventor
千 庸夫
匡弘 松本
太郎 山崎
佐野 友泰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osaka Soda Co Ltd
Original Assignee
Osaka Soda Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osaka Soda Co Ltd filed Critical Osaka Soda Co Ltd
Priority to JP1060285A priority Critical patent/JPS61168991A/ja
Publication of JPS61168991A publication Critical patent/JPS61168991A/ja
Publication of JPH0416037B2 publication Critical patent/JPH0416037B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP1060285A 1985-01-22 1985-01-22 印刷回路基板 Granted JPS61168991A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1060285A JPS61168991A (ja) 1985-01-22 1985-01-22 印刷回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1060285A JPS61168991A (ja) 1985-01-22 1985-01-22 印刷回路基板

Publications (2)

Publication Number Publication Date
JPS61168991A true JPS61168991A (ja) 1986-07-30
JPH0416037B2 JPH0416037B2 (enrdf_load_stackoverflow) 1992-03-19

Family

ID=11754791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1060285A Granted JPS61168991A (ja) 1985-01-22 1985-01-22 印刷回路基板

Country Status (1)

Country Link
JP (1) JPS61168991A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63227785A (ja) * 1987-03-13 1988-09-22 Meiban Kogei Kk パタ−ンの形成方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61107792A (ja) * 1984-10-31 1986-05-26 東芝シリコ−ン株式会社 回路基布の形成方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61107792A (ja) * 1984-10-31 1986-05-26 東芝シリコ−ン株式会社 回路基布の形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63227785A (ja) * 1987-03-13 1988-09-22 Meiban Kogei Kk パタ−ンの形成方法

Also Published As

Publication number Publication date
JPH0416037B2 (enrdf_load_stackoverflow) 1992-03-19

Similar Documents

Publication Publication Date Title
GB1482773A (en) Printed circuit boards
KR20090038994A (ko) 부도체를 지지체로 사용하는 도전성 양면테이프
JPS61107792A (ja) 回路基布の形成方法
JPS61168991A (ja) 印刷回路基板
CN1816250A (zh) 电子部件安装基板
JPS60200590A (ja) 印刷回路基板及びその製法
JP2659490B2 (ja) 印刷回路用積層板
JPH11340635A (ja) 電子回路内蔵多層プリント配線板
JPH0441443B2 (enrdf_load_stackoverflow)
CN207671977U (zh) 一种与金属高结合力的导电胶膜及其产品
JP2779649B2 (ja) 印刷配線板の製造方法
JP2634592B2 (ja) 低抵抗付回路基板およびその製造法
JPS61224393A (ja) メッキ回路基板の製法
JPH01150387A (ja) プリント配線板
JP2508389B2 (ja) 積層板およびその製造法
JPH02252294A (ja) 多層板の製造法
JPS5866385A (ja) 印刷配線用基板の製造方法
JP3088817B2 (ja) 耐燃性銅張積層板
JPH01150388A (ja) 多層配線板
JP3064020B2 (ja) 印刷抵抗内蔵多層プリント配線板の製造方法
JPS6039883A (ja) 可撓性配線基板
JPS63272097A (ja) 多層回路基板の製造法
JPH0422357B2 (enrdf_load_stackoverflow)
JPS63226996A (ja) 多層配線基板の製造方法
JPH04170084A (ja) プリント配線板の製造方法