JPS6116702Y2 - - Google Patents
Info
- Publication number
- JPS6116702Y2 JPS6116702Y2 JP1977087997U JP8799777U JPS6116702Y2 JP S6116702 Y2 JPS6116702 Y2 JP S6116702Y2 JP 1977087997 U JP1977087997 U JP 1977087997U JP 8799777 U JP8799777 U JP 8799777U JP S6116702 Y2 JPS6116702 Y2 JP S6116702Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- external
- external lead
- terminal
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 15
- 238000007789 sealing Methods 0.000 description 12
- 238000004806 packaging method and process Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977087997U JPS6116702Y2 (nl) | 1977-07-01 | 1977-07-01 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977087997U JPS6116702Y2 (nl) | 1977-07-01 | 1977-07-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5414659U JPS5414659U (nl) | 1979-01-30 |
JPS6116702Y2 true JPS6116702Y2 (nl) | 1986-05-22 |
Family
ID=29014052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1977087997U Expired JPS6116702Y2 (nl) | 1977-07-01 | 1977-07-01 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6116702Y2 (nl) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58122457U (ja) * | 1982-02-12 | 1983-08-20 | 新電元工業株式会社 | 半導体装置 |
JPS58162642U (ja) * | 1982-04-22 | 1983-10-29 | 新電元工業株式会社 | 半導体装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5132177A (ja) * | 1974-09-11 | 1976-03-18 | Matsushita Electric Ind Co Ltd | Riidoresumoorudotoranjisuta |
-
1977
- 1977-07-01 JP JP1977087997U patent/JPS6116702Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5132177A (ja) * | 1974-09-11 | 1976-03-18 | Matsushita Electric Ind Co Ltd | Riidoresumoorudotoranjisuta |
Also Published As
Publication number | Publication date |
---|---|
JPS5414659U (nl) | 1979-01-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5939779A (en) | Bottom lead semiconductor chip stack package | |
JP2000133767A (ja) | 積層化半導体パッケ―ジ及びその製造方法 | |
KR19980055817A (ko) | 버텀리드 반도체 패키지 및 그 제조 방법 | |
JP2000329632A (ja) | 圧力センサーモジュール及び圧力センサーモジュールの製造方法 | |
JPS63258050A (ja) | 半導体装置 | |
JPS6116702Y2 (nl) | ||
JPS6238863B2 (nl) | ||
JP3259377B2 (ja) | 半導体装置 | |
JPS63296252A (ja) | 樹脂封止型半導体装置 | |
JP2001035961A (ja) | 半導体装置及びその製造方法 | |
JPH01196153A (ja) | 樹脂封止半導体装置 | |
JP2629853B2 (ja) | 半導体装置 | |
JPS5916357A (ja) | 半導体装置 | |
JPH0547954A (ja) | 樹脂封止型半導体装置 | |
JP3082507U (ja) | ダブルサイドチップパッケージ | |
JPH07211850A (ja) | 半導体装置 | |
JPH0653399A (ja) | 樹脂封止型半導体装置 | |
JPH0366150A (ja) | 半導体集積回路装置 | |
JPH0378245A (ja) | Icパッケージ | |
JPS6236299Y2 (nl) | ||
KR0152934B1 (ko) | 반도체 패키지 | |
JP2679687B2 (ja) | 樹脂封止型半導体装置 | |
JPH05243448A (ja) | 集積回路用パッケージ | |
KR0138302Y1 (ko) | 와이어 본딩이 용이한 반도체 장치 | |
JPH02303056A (ja) | 半導体集積回路の製造方法 |