JPS5132177A - Riidoresumoorudotoranjisuta - Google Patents

Riidoresumoorudotoranjisuta

Info

Publication number
JPS5132177A
JPS5132177A JP10541374A JP10541374A JPS5132177A JP S5132177 A JPS5132177 A JP S5132177A JP 10541374 A JP10541374 A JP 10541374A JP 10541374 A JP10541374 A JP 10541374A JP S5132177 A JPS5132177 A JP S5132177A
Authority
JP
Japan
Prior art keywords
riidoresumoorudotoranjisuta
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10541374A
Other languages
English (en)
Inventor
Satoshi Sugii
Shinzaburo Kamei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP10541374A priority Critical patent/JPS5132177A/ja
Publication of JPS5132177A publication Critical patent/JPS5132177A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP10541374A 1974-09-11 1974-09-11 Riidoresumoorudotoranjisuta Pending JPS5132177A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10541374A JPS5132177A (ja) 1974-09-11 1974-09-11 Riidoresumoorudotoranjisuta

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10541374A JPS5132177A (ja) 1974-09-11 1974-09-11 Riidoresumoorudotoranjisuta

Publications (1)

Publication Number Publication Date
JPS5132177A true JPS5132177A (ja) 1976-03-18

Family

ID=14406910

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10541374A Pending JPS5132177A (ja) 1974-09-11 1974-09-11 Riidoresumoorudotoranjisuta

Country Status (1)

Country Link
JP (1) JPS5132177A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53111122U (ja) * 1977-02-14 1978-09-05
JPS5414659U (ja) * 1977-07-01 1979-01-30

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53111122U (ja) * 1977-02-14 1978-09-05
JPS5414659U (ja) * 1977-07-01 1979-01-30
JPS6116702Y2 (ja) * 1977-07-01 1986-05-22

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