JPS6116536A - ペレツトボンデイング装置 - Google Patents

ペレツトボンデイング装置

Info

Publication number
JPS6116536A
JPS6116536A JP13404385A JP13404385A JPS6116536A JP S6116536 A JPS6116536 A JP S6116536A JP 13404385 A JP13404385 A JP 13404385A JP 13404385 A JP13404385 A JP 13404385A JP S6116536 A JPS6116536 A JP S6116536A
Authority
JP
Japan
Prior art keywords
cavity
pellet
package
package base
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13404385A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6156615B2 (cg-RX-API-DMAC7.html
Inventor
Toshikazu Oshino
押野　利和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13404385A priority Critical patent/JPS6116536A/ja
Publication of JPS6116536A publication Critical patent/JPS6116536A/ja
Publication of JPS6156615B2 publication Critical patent/JPS6156615B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP13404385A 1985-06-21 1985-06-21 ペレツトボンデイング装置 Granted JPS6116536A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13404385A JPS6116536A (ja) 1985-06-21 1985-06-21 ペレツトボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13404385A JPS6116536A (ja) 1985-06-21 1985-06-21 ペレツトボンデイング装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP7919879A Division JPS564253A (en) 1979-06-25 1979-06-25 Device for assembling electronic parts

Publications (2)

Publication Number Publication Date
JPS6116536A true JPS6116536A (ja) 1986-01-24
JPS6156615B2 JPS6156615B2 (cg-RX-API-DMAC7.html) 1986-12-03

Family

ID=15119031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13404385A Granted JPS6116536A (ja) 1985-06-21 1985-06-21 ペレツトボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6116536A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01121927U (cg-RX-API-DMAC7.html) * 1988-02-12 1989-08-18

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50157069A (cg-RX-API-DMAC7.html) * 1974-06-07 1975-12-18

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50157069A (cg-RX-API-DMAC7.html) * 1974-06-07 1975-12-18

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01121927U (cg-RX-API-DMAC7.html) * 1988-02-12 1989-08-18

Also Published As

Publication number Publication date
JPS6156615B2 (cg-RX-API-DMAC7.html) 1986-12-03

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