JPS6155771B2 - - Google Patents
Info
- Publication number
- JPS6155771B2 JPS6155771B2 JP7919879A JP7919879A JPS6155771B2 JP S6155771 B2 JPS6155771 B2 JP S6155771B2 JP 7919879 A JP7919879 A JP 7919879A JP 7919879 A JP7919879 A JP 7919879A JP S6155771 B2 JPS6155771 B2 JP S6155771B2
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- package
- pellet
- ceramic package
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7919879A JPS564253A (en) | 1979-06-25 | 1979-06-25 | Device for assembling electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7919879A JPS564253A (en) | 1979-06-25 | 1979-06-25 | Device for assembling electronic parts |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13404385A Division JPS6116536A (ja) | 1985-06-21 | 1985-06-21 | ペレツトボンデイング装置 |
| JP22631587A Division JPS6372132A (ja) | 1987-09-11 | 1987-09-11 | 半導体ペレットの取り付け方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS564253A JPS564253A (en) | 1981-01-17 |
| JPS6155771B2 true JPS6155771B2 (cg-RX-API-DMAC7.html) | 1986-11-29 |
Family
ID=13683262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7919879A Granted JPS564253A (en) | 1979-06-25 | 1979-06-25 | Device for assembling electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS564253A (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57178333A (en) * | 1981-04-27 | 1982-11-02 | Hitachi Ltd | Pellet bonder |
| JPS60130130A (ja) * | 1983-12-19 | 1985-07-11 | Marine Instr Co Ltd | サ−マル基板のダイボンデイング方法 |
-
1979
- 1979-06-25 JP JP7919879A patent/JPS564253A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS564253A (en) | 1981-01-17 |
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