JPS564253A - Device for assembling electronic parts - Google Patents

Device for assembling electronic parts

Info

Publication number
JPS564253A
JPS564253A JP7919879A JP7919879A JPS564253A JP S564253 A JPS564253 A JP S564253A JP 7919879 A JP7919879 A JP 7919879A JP 7919879 A JP7919879 A JP 7919879A JP S564253 A JPS564253 A JP S564253A
Authority
JP
Japan
Prior art keywords
base
opening
pellet
guide
moved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7919879A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6155771B2 (cg-RX-API-DMAC7.html
Inventor
Toshikazu Oshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7919879A priority Critical patent/JPS564253A/ja
Publication of JPS564253A publication Critical patent/JPS564253A/ja
Publication of JPS6155771B2 publication Critical patent/JPS6155771B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP7919879A 1979-06-25 1979-06-25 Device for assembling electronic parts Granted JPS564253A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7919879A JPS564253A (en) 1979-06-25 1979-06-25 Device for assembling electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7919879A JPS564253A (en) 1979-06-25 1979-06-25 Device for assembling electronic parts

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP13404385A Division JPS6116536A (ja) 1985-06-21 1985-06-21 ペレツトボンデイング装置
JP22631587A Division JPS6372132A (ja) 1987-09-11 1987-09-11 半導体ペレットの取り付け方法

Publications (2)

Publication Number Publication Date
JPS564253A true JPS564253A (en) 1981-01-17
JPS6155771B2 JPS6155771B2 (cg-RX-API-DMAC7.html) 1986-11-29

Family

ID=13683262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7919879A Granted JPS564253A (en) 1979-06-25 1979-06-25 Device for assembling electronic parts

Country Status (1)

Country Link
JP (1) JPS564253A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178333A (en) * 1981-04-27 1982-11-02 Hitachi Ltd Pellet bonder
JPS60130130A (ja) * 1983-12-19 1985-07-11 Marine Instr Co Ltd サ−マル基板のダイボンデイング方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178333A (en) * 1981-04-27 1982-11-02 Hitachi Ltd Pellet bonder
JPS60130130A (ja) * 1983-12-19 1985-07-11 Marine Instr Co Ltd サ−マル基板のダイボンデイング方法

Also Published As

Publication number Publication date
JPS6155771B2 (cg-RX-API-DMAC7.html) 1986-11-29

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