JPS5721840A - Positioning device for dip type integrated circuit device - Google Patents

Positioning device for dip type integrated circuit device

Info

Publication number
JPS5721840A
JPS5721840A JP9605080A JP9605080A JPS5721840A JP S5721840 A JPS5721840 A JP S5721840A JP 9605080 A JP9605080 A JP 9605080A JP 9605080 A JP9605080 A JP 9605080A JP S5721840 A JPS5721840 A JP S5721840A
Authority
JP
Japan
Prior art keywords
container
dip type
integrated circuit
leads
type integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9605080A
Other languages
Japanese (ja)
Inventor
Satoshi Takabayashi
Yoshiaki Fukui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9605080A priority Critical patent/JPS5721840A/en
Publication of JPS5721840A publication Critical patent/JPS5721840A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To enhance the accuracy of the relative position between an external lead of a DIP type container and a chip by providing a rail longitudinally movably placing the container, a positioning pawl having inverted V-shaped groove for pressing the bnet of the external lead of the container and a feeding pawl. CONSTITUTION:A DIP type integrated circuit device container having a ceramic base 1, leads 2, and low melting point glass 3 is placed on a rail 6 moving the container, both shoulders at the bent of the leads 2 are pressed by a positioning pawl 4 provided with oblique surfaces 5 as reference surface, and the container is moved by a feeding pawl 7. Thus, the container is positioned with both shoulders at the bents of the external leads of the DIP type IC, and desired position accuracy can be obtained without disturbing the assembling.
JP9605080A 1980-07-14 1980-07-14 Positioning device for dip type integrated circuit device Pending JPS5721840A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9605080A JPS5721840A (en) 1980-07-14 1980-07-14 Positioning device for dip type integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9605080A JPS5721840A (en) 1980-07-14 1980-07-14 Positioning device for dip type integrated circuit device

Publications (1)

Publication Number Publication Date
JPS5721840A true JPS5721840A (en) 1982-02-04

Family

ID=14154630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9605080A Pending JPS5721840A (en) 1980-07-14 1980-07-14 Positioning device for dip type integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5721840A (en)

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