JPS61160933A - 現像処理装置 - Google Patents

現像処理装置

Info

Publication number
JPS61160933A
JPS61160933A JP117085A JP117085A JPS61160933A JP S61160933 A JPS61160933 A JP S61160933A JP 117085 A JP117085 A JP 117085A JP 117085 A JP117085 A JP 117085A JP S61160933 A JPS61160933 A JP S61160933A
Authority
JP
Japan
Prior art keywords
waste
exhaust
piping
development processing
trap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP117085A
Other languages
English (en)
Japanese (ja)
Other versions
JPH045259B2 (enrdf_load_stackoverflow
Inventor
Hidemi Amai
秀美 天井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP117085A priority Critical patent/JPS61160933A/ja
Publication of JPS61160933A publication Critical patent/JPS61160933A/ja
Publication of JPH045259B2 publication Critical patent/JPH045259B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP117085A 1985-01-08 1985-01-08 現像処理装置 Granted JPS61160933A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP117085A JPS61160933A (ja) 1985-01-08 1985-01-08 現像処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP117085A JPS61160933A (ja) 1985-01-08 1985-01-08 現像処理装置

Publications (2)

Publication Number Publication Date
JPS61160933A true JPS61160933A (ja) 1986-07-21
JPH045259B2 JPH045259B2 (enrdf_load_stackoverflow) 1992-01-30

Family

ID=11493958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP117085A Granted JPS61160933A (ja) 1985-01-08 1985-01-08 現像処理装置

Country Status (1)

Country Link
JP (1) JPS61160933A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63168025A (ja) * 1986-12-29 1988-07-12 Tokyo Electron Ltd 現像方法
US5088922A (en) * 1990-01-23 1992-02-18 Tokyo Electron Sagami Limited Heat-treatment apparatus having exhaust system
JP2002187249A (ja) * 2000-12-19 2002-07-02 Think Laboratory Co Ltd グラビア印刷用被製版ロールの製作・リサイクル処理・製版をマルチに行う方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5666044A (en) * 1979-11-05 1981-06-04 Toshiba Corp Semiconductor device
JPS5850738A (ja) * 1981-09-21 1983-03-25 Toshiba Corp レジストの塗布及び現像装置
JPS614576A (ja) * 1984-06-15 1986-01-10 Hoya Corp スプレ−方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5666044A (en) * 1979-11-05 1981-06-04 Toshiba Corp Semiconductor device
JPS5850738A (ja) * 1981-09-21 1983-03-25 Toshiba Corp レジストの塗布及び現像装置
JPS614576A (ja) * 1984-06-15 1986-01-10 Hoya Corp スプレ−方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63168025A (ja) * 1986-12-29 1988-07-12 Tokyo Electron Ltd 現像方法
US5088922A (en) * 1990-01-23 1992-02-18 Tokyo Electron Sagami Limited Heat-treatment apparatus having exhaust system
JP2002187249A (ja) * 2000-12-19 2002-07-02 Think Laboratory Co Ltd グラビア印刷用被製版ロールの製作・リサイクル処理・製版をマルチに行う方法

Also Published As

Publication number Publication date
JPH045259B2 (enrdf_load_stackoverflow) 1992-01-30

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term