JPS61159638A - レジストパタ−ンの形成方法 - Google Patents
レジストパタ−ンの形成方法Info
- Publication number
- JPS61159638A JPS61159638A JP13685A JP13685A JPS61159638A JP S61159638 A JPS61159638 A JP S61159638A JP 13685 A JP13685 A JP 13685A JP 13685 A JP13685 A JP 13685A JP S61159638 A JPS61159638 A JP S61159638A
- Authority
- JP
- Japan
- Prior art keywords
- monochlorobenzene
- substrate
- resist
- lmr
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000015572 biosynthetic process Effects 0.000 title 1
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 229920003986 novolac Polymers 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 9
- -1 naphthoquinonediazide sulfonic acid ester Chemical class 0.000 claims description 5
- 230000005865 ionizing radiation Effects 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 abstract description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 239000011877 solvent mixture Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 5
- 238000010894 electron beam technology Methods 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 241000233805 Phoenix Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229940117955 isoamyl acetate Drugs 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/325—Non-aqueous compositions
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13685A JPS61159638A (ja) | 1985-01-07 | 1985-01-07 | レジストパタ−ンの形成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13685A JPS61159638A (ja) | 1985-01-07 | 1985-01-07 | レジストパタ−ンの形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61159638A true JPS61159638A (ja) | 1986-07-19 |
JPH0342658B2 JPH0342658B2 (enrdf_load_stackoverflow) | 1991-06-27 |
Family
ID=11465613
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13685A Granted JPS61159638A (ja) | 1985-01-07 | 1985-01-07 | レジストパタ−ンの形成方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61159638A (enrdf_load_stackoverflow) |
-
1985
- 1985-01-07 JP JP13685A patent/JPS61159638A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0342658B2 (enrdf_load_stackoverflow) | 1991-06-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |