JPS61159368A - ウエ−ハ用ラツプ機における砥粒スラリ−供給装置 - Google Patents
ウエ−ハ用ラツプ機における砥粒スラリ−供給装置Info
- Publication number
- JPS61159368A JPS61159368A JP59281264A JP28126484A JPS61159368A JP S61159368 A JPS61159368 A JP S61159368A JP 59281264 A JP59281264 A JP 59281264A JP 28126484 A JP28126484 A JP 28126484A JP S61159368 A JPS61159368 A JP S61159368A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- slurry
- thickness
- surface plate
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59281264A JPS61159368A (ja) | 1984-12-28 | 1984-12-28 | ウエ−ハ用ラツプ機における砥粒スラリ−供給装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59281264A JPS61159368A (ja) | 1984-12-28 | 1984-12-28 | ウエ−ハ用ラツプ機における砥粒スラリ−供給装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61159368A true JPS61159368A (ja) | 1986-07-19 |
| JPS6359822B2 JPS6359822B2 (cg-RX-API-DMAC7.html) | 1988-11-21 |
Family
ID=17636648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59281264A Granted JPS61159368A (ja) | 1984-12-28 | 1984-12-28 | ウエ−ハ用ラツプ機における砥粒スラリ−供給装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61159368A (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0798080A1 (en) * | 1996-03-27 | 1997-10-01 | Shin-Etsu Handotai Company Limited | Lapping apparatus and method |
-
1984
- 1984-12-28 JP JP59281264A patent/JPS61159368A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0798080A1 (en) * | 1996-03-27 | 1997-10-01 | Shin-Etsu Handotai Company Limited | Lapping apparatus and method |
| US5800251A (en) * | 1996-03-27 | 1998-09-01 | Shin-Etsu Handotai Co., Ltd. | Apparatus and method of lapping works |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6359822B2 (cg-RX-API-DMAC7.html) | 1988-11-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6106369A (en) | Polishing system | |
| JP2527232B2 (ja) | 研磨装置 | |
| CN101262981B (zh) | 抛光方法和抛光装置以及用于控制抛光装置的程序 | |
| JP2628915B2 (ja) | 研磨布のドレッシング装置 | |
| CN206169865U (zh) | 一种双面研磨抛光机 | |
| TW202216363A (zh) | 研磨頭清洗裝置 | |
| JP2002254299A (ja) | ウエーハ研磨方法 | |
| JPS61159368A (ja) | ウエ−ハ用ラツプ機における砥粒スラリ−供給装置 | |
| CN108098564A (zh) | 一种半导体晶圆用化学机械抛光设备 | |
| JP3644805B2 (ja) | 基板洗浄装置 | |
| JP4476398B2 (ja) | ウェーハ研磨装置及び研磨状態検出方法 | |
| JPH0225748B2 (cg-RX-API-DMAC7.html) | ||
| JPH0225747B2 (cg-RX-API-DMAC7.html) | ||
| JP3644806B2 (ja) | 基板洗浄方法及びその装置 | |
| JPH0659623B2 (ja) | ウェハのメカノケミカルポリシング加工方法および装置 | |
| JPS58122732A (ja) | ウエハの洗浄方法 | |
| CN112207634A (zh) | 在线检测抛光垫下方气泡的方法 | |
| US2443789A (en) | Grinding wheel truing apparatus | |
| JP2012223852A (ja) | 両面研磨装置および研磨方法 | |
| KR100646656B1 (ko) | 패드 컨디셔너용 에러검출장치 | |
| CN215700701U (zh) | 一种晶片抛光设备的装载装置 | |
| CN208147613U (zh) | 用于双面研磨机的尺寸控制系统 | |
| CN107662153A (zh) | 一种自动抛光机 | |
| JPH02255184A (ja) | 電気洗濯機の運転方法 | |
| US2264163A (en) | Lapping machine |