JPS61158206A - バルン整合器の製造方法 - Google Patents

バルン整合器の製造方法

Info

Publication number
JPS61158206A
JPS61158206A JP27584684A JP27584684A JPS61158206A JP S61158206 A JPS61158206 A JP S61158206A JP 27584684 A JP27584684 A JP 27584684A JP 27584684 A JP27584684 A JP 27584684A JP S61158206 A JPS61158206 A JP S61158206A
Authority
JP
Japan
Prior art keywords
printed wiring
matching device
board
coil
balloon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27584684A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0257728B2 (enrdf_load_stackoverflow
Inventor
Takuji Kotani
卓司 小谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SMK Corp
Original Assignee
SMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SMK Corp filed Critical SMK Corp
Priority to JP27584684A priority Critical patent/JPS61158206A/ja
Publication of JPS61158206A publication Critical patent/JPS61158206A/ja
Publication of JPH0257728B2 publication Critical patent/JPH0257728B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Coils Or Transformers For Communication (AREA)
  • Non-Reversible Transmitting Devices (AREA)
JP27584684A 1984-12-29 1984-12-29 バルン整合器の製造方法 Granted JPS61158206A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27584684A JPS61158206A (ja) 1984-12-29 1984-12-29 バルン整合器の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27584684A JPS61158206A (ja) 1984-12-29 1984-12-29 バルン整合器の製造方法

Publications (2)

Publication Number Publication Date
JPS61158206A true JPS61158206A (ja) 1986-07-17
JPH0257728B2 JPH0257728B2 (enrdf_load_stackoverflow) 1990-12-05

Family

ID=17561247

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27584684A Granted JPS61158206A (ja) 1984-12-29 1984-12-29 バルン整合器の製造方法

Country Status (1)

Country Link
JP (1) JPS61158206A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738546A (en) * 1994-12-01 1998-04-14 Adc Telecommunications, Inc. Printed circuit board mounted jack

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738546A (en) * 1994-12-01 1998-04-14 Adc Telecommunications, Inc. Printed circuit board mounted jack

Also Published As

Publication number Publication date
JPH0257728B2 (enrdf_load_stackoverflow) 1990-12-05

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