JPS6115580B2 - - Google Patents

Info

Publication number
JPS6115580B2
JPS6115580B2 JP53045754A JP4575478A JPS6115580B2 JP S6115580 B2 JPS6115580 B2 JP S6115580B2 JP 53045754 A JP53045754 A JP 53045754A JP 4575478 A JP4575478 A JP 4575478A JP S6115580 B2 JPS6115580 B2 JP S6115580B2
Authority
JP
Japan
Prior art keywords
resin
metal film
film
bonding
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53045754A
Other languages
English (en)
Japanese (ja)
Other versions
JPS54137971A (en
Inventor
Kenji Myajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP4575478A priority Critical patent/JPS54137971A/ja
Publication of JPS54137971A publication Critical patent/JPS54137971A/ja
Publication of JPS6115580B2 publication Critical patent/JPS6115580B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/884—
    • H10W74/00—
    • H10W90/754—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP4575478A 1978-04-18 1978-04-18 Resin-sealed type semiconductor device Granted JPS54137971A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4575478A JPS54137971A (en) 1978-04-18 1978-04-18 Resin-sealed type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4575478A JPS54137971A (en) 1978-04-18 1978-04-18 Resin-sealed type semiconductor device

Publications (2)

Publication Number Publication Date
JPS54137971A JPS54137971A (en) 1979-10-26
JPS6115580B2 true JPS6115580B2 (cg-RX-API-DMAC10.html) 1986-04-24

Family

ID=12728079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4575478A Granted JPS54137971A (en) 1978-04-18 1978-04-18 Resin-sealed type semiconductor device

Country Status (1)

Country Link
JP (1) JPS54137971A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01110742A (ja) * 1987-10-23 1989-04-27 Ibiden Co Ltd 電子部品搭載用両面フィルムキャリア
JPH01183837A (ja) * 1988-01-18 1989-07-21 Texas Instr Japan Ltd 半導体装置
JP2794212B2 (ja) * 1989-12-11 1998-09-03 イビデン株式会社 電子部品搭載用基板

Also Published As

Publication number Publication date
JPS54137971A (en) 1979-10-26

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