JPS61152513A - テ−ピング装置 - Google Patents
テ−ピング装置Info
- Publication number
- JPS61152513A JPS61152513A JP27212184A JP27212184A JPS61152513A JP S61152513 A JPS61152513 A JP S61152513A JP 27212184 A JP27212184 A JP 27212184A JP 27212184 A JP27212184 A JP 27212184A JP S61152513 A JPS61152513 A JP S61152513A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- taping
- wheel
- equal intervals
- feed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004080 punching Methods 0.000 claims description 28
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 17
- 238000003780 insertion Methods 0.000 description 8
- 230000037431 insertion Effects 0.000 description 8
- 238000002788 crimping Methods 0.000 description 7
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Package Closures (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27212184A JPS61152513A (ja) | 1984-12-25 | 1984-12-25 | テ−ピング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27212184A JPS61152513A (ja) | 1984-12-25 | 1984-12-25 | テ−ピング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61152513A true JPS61152513A (ja) | 1986-07-11 |
| JPH0150642B2 JPH0150642B2 (enrdf_load_stackoverflow) | 1989-10-31 |
Family
ID=17509379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27212184A Granted JPS61152513A (ja) | 1984-12-25 | 1984-12-25 | テ−ピング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61152513A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63258717A (ja) * | 1987-04-10 | 1988-10-26 | ホ−プ精機株式会社 | ヒユ−ズクリツプのテ−ピング装置 |
| JPH0245908U (enrdf_load_stackoverflow) * | 1988-09-20 | 1990-03-29 | ||
| JP2023122618A (ja) * | 2022-02-23 | 2023-09-04 | 河南富▲馳▼科技有限公司 | 貼付装置 |
-
1984
- 1984-12-25 JP JP27212184A patent/JPS61152513A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63258717A (ja) * | 1987-04-10 | 1988-10-26 | ホ−プ精機株式会社 | ヒユ−ズクリツプのテ−ピング装置 |
| JPH0245908U (enrdf_load_stackoverflow) * | 1988-09-20 | 1990-03-29 | ||
| JP2023122618A (ja) * | 2022-02-23 | 2023-09-04 | 河南富▲馳▼科技有限公司 | 貼付装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0150642B2 (enrdf_load_stackoverflow) | 1989-10-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |