JPS61148004A - ダイシング装置 - Google Patents
ダイシング装置Info
- Publication number
- JPS61148004A JPS61148004A JP60264741A JP26474185A JPS61148004A JP S61148004 A JPS61148004 A JP S61148004A JP 60264741 A JP60264741 A JP 60264741A JP 26474185 A JP26474185 A JP 26474185A JP S61148004 A JPS61148004 A JP S61148004A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- plate
- cleaning water
- cooling water
- water supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60264741A JPS61148004A (ja) | 1985-11-27 | 1985-11-27 | ダイシング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60264741A JPS61148004A (ja) | 1985-11-27 | 1985-11-27 | ダイシング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61148004A true JPS61148004A (ja) | 1986-07-05 |
JPH0158047B2 JPH0158047B2 (enrdf_load_stackoverflow) | 1989-12-08 |
Family
ID=17407530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60264741A Granted JPS61148004A (ja) | 1985-11-27 | 1985-11-27 | ダイシング装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61148004A (enrdf_load_stackoverflow) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0426708U (enrdf_load_stackoverflow) * | 1990-06-26 | 1992-03-03 | ||
JP2007188974A (ja) * | 2006-01-11 | 2007-07-26 | Tokyo Seimitsu Co Ltd | ダイシング装置 |
WO2013051375A1 (ja) * | 2011-10-05 | 2013-04-11 | シャープ株式会社 | ダイシング装置及び半導体装置の製造方法 |
JP2013225612A (ja) * | 2012-04-23 | 2013-10-31 | Disco Abrasive Syst Ltd | ウェーハの加工方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015208796A (ja) * | 2014-04-24 | 2015-11-24 | 株式会社ディスコ | バイト切削装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1063904A (en) * | 1963-07-13 | 1967-04-05 | Waldrich Werkzeugmasch | Method and apparatus for cooling machine tools |
JPS4858771A (enrdf_load_stackoverflow) * | 1971-11-22 | 1973-08-17 | ||
JPS48104255U (enrdf_load_stackoverflow) * | 1972-03-11 | 1973-12-05 | ||
JPS4894985A (enrdf_load_stackoverflow) * | 1972-03-17 | 1973-12-06 | ||
JPS493291A (enrdf_load_stackoverflow) * | 1972-04-22 | 1974-01-12 | ||
JPS4916072A (enrdf_load_stackoverflow) * | 1972-04-10 | 1974-02-13 | ||
JPS6112373A (ja) * | 1984-06-29 | 1986-01-20 | Tokyo Electric Co Ltd | 印字機 |
-
1985
- 1985-11-27 JP JP60264741A patent/JPS61148004A/ja active Granted
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1063904A (en) * | 1963-07-13 | 1967-04-05 | Waldrich Werkzeugmasch | Method and apparatus for cooling machine tools |
JPS4858771A (enrdf_load_stackoverflow) * | 1971-11-22 | 1973-08-17 | ||
JPS48104255U (enrdf_load_stackoverflow) * | 1972-03-11 | 1973-12-05 | ||
JPS4894985A (enrdf_load_stackoverflow) * | 1972-03-17 | 1973-12-06 | ||
JPS4916072A (enrdf_load_stackoverflow) * | 1972-04-10 | 1974-02-13 | ||
JPS493291A (enrdf_load_stackoverflow) * | 1972-04-22 | 1974-01-12 | ||
JPS6112373A (ja) * | 1984-06-29 | 1986-01-20 | Tokyo Electric Co Ltd | 印字機 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0426708U (enrdf_load_stackoverflow) * | 1990-06-26 | 1992-03-03 | ||
JP2007188974A (ja) * | 2006-01-11 | 2007-07-26 | Tokyo Seimitsu Co Ltd | ダイシング装置 |
WO2013051375A1 (ja) * | 2011-10-05 | 2013-04-11 | シャープ株式会社 | ダイシング装置及び半導体装置の製造方法 |
JP2013225612A (ja) * | 2012-04-23 | 2013-10-31 | Disco Abrasive Syst Ltd | ウェーハの加工方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0158047B2 (enrdf_load_stackoverflow) | 1989-12-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6112373B2 (enrdf_load_stackoverflow) | ||
JP6144107B2 (ja) | ウェーハの切削方法 | |
TW202006810A (zh) | 半導體晶圓的加工方法 | |
JP4354769B2 (ja) | ウェーハの研磨方法 | |
JP2000173954A5 (enrdf_load_stackoverflow) | ||
JPS58184727A (ja) | シリコンウェ−ハの面を研削する方法 | |
JPH0145978B2 (enrdf_load_stackoverflow) | ||
JP2014054713A (ja) | ウェーハの加工方法 | |
JPS61148004A (ja) | ダイシング装置 | |
JP2003273053A (ja) | 平面研削方法 | |
WO2000075983A1 (en) | A method for dicing wafers with laser scribing | |
JP2003197564A (ja) | 低誘電体絶縁材料を積層した基板のダイシング方法 | |
CN100509223C (zh) | 切削刀片及切削刀片的制造方法 | |
JP7327974B2 (ja) | ウェーハの分割方法 | |
JPH06275712A (ja) | ダイシング装置 | |
JP2008130929A (ja) | 半導体装置の製造方法及び半導体装置 | |
JPH06188308A (ja) | ダイシングブレード | |
JP5860216B2 (ja) | ウエーハの面取り部除去方法 | |
JPS5932056B2 (ja) | 半導体装置の製造方法 | |
KR102680920B1 (ko) | 피가공물의 절삭 방법 | |
KR102858924B1 (ko) | 웨이퍼의 분할 방법 | |
JPS60216565A (ja) | ウエハのダイシング方法 | |
JPH03294160A (ja) | 研削砥石および研削装置 | |
TWI864238B (zh) | 修整器板 | |
JP2006059914A (ja) | 半導体装置の製造方法及び半導体装置 |