JPS61144890A - Ｌｅｄランプのレンズの製造方法 - Google Patents

Ｌｅｄランプのレンズの製造方法

Info

Publication number
JPS61144890A
JPS61144890A JP59267772A JP26777284A JPS61144890A JP S61144890 A JPS61144890 A JP S61144890A JP 59267772 A JP59267772 A JP 59267772A JP 26777284 A JP26777284 A JP 26777284A JP S61144890 A JPS61144890 A JP S61144890A
Authority
JP
Japan
Prior art keywords
lens
chip
frame
led chip
resin material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59267772A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0422354B2 (enExample
Inventor
Tomio Nakaya
中矢　富夫
Hoichiro Kashiwara
柏原　鳳一郎
Osamu Waki
脇　脩
Toshihide Kawamura
河村　俊秀
Hiroo Sakai
酒井　弘生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP59267772A priority Critical patent/JPS61144890A/ja
Publication of JPS61144890A publication Critical patent/JPS61144890A/ja
Publication of JPH0422354B2 publication Critical patent/JPH0422354B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)
JP59267772A 1984-12-19 1984-12-19 Ｌｅｄランプのレンズの製造方法 Granted JPS61144890A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59267772A JPS61144890A (ja) 1984-12-19 1984-12-19 Ｌｅｄランプのレンズの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59267772A JPS61144890A (ja) 1984-12-19 1984-12-19 Ｌｅｄランプのレンズの製造方法

Publications (2)

Publication Number Publication Date
JPS61144890A true JPS61144890A (ja) 1986-07-02
JPH0422354B2 JPH0422354B2 (enExample) 1992-04-16

Family

ID=17449370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59267772A Granted JPS61144890A (ja) 1984-12-19 1984-12-19 Ｌｅｄランプのレンズの製造方法

Country Status (1)

Country Link
JP (1) JPS61144890A (enExample)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07231120A (ja) * 1994-02-18 1995-08-29 Rohm Co Ltd 発光装置とその製造方法およびｌｅｄヘッドの製造方法
DE19631736A1 (de) * 1996-08-06 1998-02-12 Stm Sensor Technologie Muenche Verfahren und Vorrichtung zum Herstellen von Linsen mikrooptischer Systeme sowie Lichtsender/Lichtempfängersystem
KR20030033273A (ko) * 2001-10-19 2003-05-01 (주) 나노옵토테크놀러지 칩형 엘. 디. 엠
JP2004087812A (ja) * 2002-08-27 2004-03-18 Sanyo Electric Co Ltd 発光体
JP2006310856A (ja) * 2005-04-27 2006-11-09 Samsung Electro Mech Co Ltd 発光ダイオードを利用したｌｃｄバックライトユニット
JP2007123891A (ja) * 2005-10-27 2007-05-17 Lg Innotek Co Ltd 発光ダイオードパッケージ及びその製造方法
WO2007083481A1 (ja) * 2006-01-19 2007-07-26 Rohm Co., Ltd. 半導体表示装置及び半導体表示装置の製造方法
WO2007086229A1 (ja) 2006-01-26 2007-08-02 Sony Corporation 光源装置、表示装置
JP2007242792A (ja) * 2006-03-07 2007-09-20 Avago Technologies Ecbu Ip (Singapore) Pte Ltd 発光ダイオード
JP2008021650A (ja) * 2006-07-10 2008-01-31 Samsung Electro-Mechanics Co Ltd 直下方式バックライト装置
JP2012089848A (ja) * 2010-10-21 2012-05-10 Semileds Optoelectronics Co Ltd 発光ダイオード（ｌｅｄ）パッケージ及びその製造方法
JP2014029341A (ja) * 2013-09-17 2014-02-13 Nikon Corp 受発光ユニット、光学式エンコーダ
US9142734B2 (en) 2003-02-26 2015-09-22 Cree, Inc. Composite white light source and method for fabricating
WO2016180816A1 (de) * 2015-05-13 2016-11-17 Osram Opto Semiconductors Gmbh Verfahren zum herstellen einer linse für eine optoelektronische leuchtvorrichtung
US9666772B2 (en) 2003-04-30 2017-05-30 Cree, Inc. High powered light emitter packages with compact optics
US10615324B2 (en) 2013-06-14 2020-04-07 Cree Huizhou Solid State Lighting Company Limited Tiny 6 pin side view surface mount LED

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07231120A (ja) * 1994-02-18 1995-08-29 Rohm Co Ltd 発光装置とその製造方法およびｌｅｄヘッドの製造方法
DE19631736A1 (de) * 1996-08-06 1998-02-12 Stm Sensor Technologie Muenche Verfahren und Vorrichtung zum Herstellen von Linsen mikrooptischer Systeme sowie Lichtsender/Lichtempfängersystem
EP0827214A1 (de) * 1996-08-06 1998-03-04 STM Sensor Technologie München GmbH Verfahren und Vorrichtung zum Herstellen von Linsen mikrooptischer Systeme sowie Lichtsender/Lichtempfängersysteme
US5945041A (en) * 1996-08-06 1999-08-31 Stm Sensor Technologie Munchen Gmbh Method and device for producing lenses of microoptical systems and optical emitter/receiver system
KR20030033273A (ko) * 2001-10-19 2003-05-01 (주) 나노옵토테크놀러지 칩형 엘. 디. 엠
JP2004087812A (ja) * 2002-08-27 2004-03-18 Sanyo Electric Co Ltd 発光体
US9142734B2 (en) 2003-02-26 2015-09-22 Cree, Inc. Composite white light source and method for fabricating
US9666772B2 (en) 2003-04-30 2017-05-30 Cree, Inc. High powered light emitter packages with compact optics
US8148897B2 (en) 2005-04-27 2012-04-03 Samsung Electro-Mechanics Co., Ltd. Backlight unit for LCD using LED
JP2006310856A (ja) * 2005-04-27 2006-11-09 Samsung Electro Mech Co Ltd 発光ダイオードを利用したｌｃｄバックライトユニット
US9012947B2 (en) 2005-10-27 2015-04-21 Lg Innotek Co., Ltd. Light emitting diode package and method of manufacturing the same
US8963188B2 (en) 2005-10-27 2015-02-24 Lg Innotek Co., Ltd. Light emitting diode package and method of manufacturing the same
JP2007123891A (ja) * 2005-10-27 2007-05-17 Lg Innotek Co Ltd 発光ダイオードパッケージ及びその製造方法
US9054283B2 (en) 2005-10-27 2015-06-09 Lg Innotek Co., Ltd. Light emitting diode package and method of manufacturing the same
WO2007083481A1 (ja) * 2006-01-19 2007-07-26 Rohm Co., Ltd. 半導体表示装置及び半導体表示装置の製造方法
JPWO2007083481A1 (ja) * 2006-01-19 2009-06-11 ローム株式会社 半導体表示装置及び半導体表示装置の製造方法
WO2007086229A1 (ja) 2006-01-26 2007-08-02 Sony Corporation 光源装置、表示装置
JP2007242792A (ja) * 2006-03-07 2007-09-20 Avago Technologies Ecbu Ip (Singapore) Pte Ltd 発光ダイオード
US7887225B2 (en) 2006-07-10 2011-02-15 Samsung Led Co., Ltd. Direct-type backlight unit having surface light source
JP2008021650A (ja) * 2006-07-10 2008-01-31 Samsung Electro-Mechanics Co Ltd 直下方式バックライト装置
JP2012089848A (ja) * 2010-10-21 2012-05-10 Semileds Optoelectronics Co Ltd 発光ダイオード（ｌｅｄ）パッケージ及びその製造方法
US10615324B2 (en) 2013-06-14 2020-04-07 Cree Huizhou Solid State Lighting Company Limited Tiny 6 pin side view surface mount LED
JP2014029341A (ja) * 2013-09-17 2014-02-13 Nikon Corp 受発光ユニット、光学式エンコーダ
WO2016180816A1 (de) * 2015-05-13 2016-11-17 Osram Opto Semiconductors Gmbh Verfahren zum herstellen einer linse für eine optoelektronische leuchtvorrichtung

Also Published As

Publication number Publication date
JPH0422354B2 (enExample) 1992-04-16

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