JPS61142046A - 小片ワ−クのピツクアツプ装置 - Google Patents

小片ワ−クのピツクアツプ装置

Info

Publication number
JPS61142046A
JPS61142046A JP26489484A JP26489484A JPS61142046A JP S61142046 A JPS61142046 A JP S61142046A JP 26489484 A JP26489484 A JP 26489484A JP 26489484 A JP26489484 A JP 26489484A JP S61142046 A JPS61142046 A JP S61142046A
Authority
JP
Japan
Prior art keywords
pin
suction nozzle
lever
rod
push
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26489484A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0416302B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Hideo Kimura
英夫 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Machinery Inc
Original Assignee
Nichiden Machinery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichiden Machinery Ltd filed Critical Nichiden Machinery Ltd
Priority to JP26489484A priority Critical patent/JPS61142046A/ja
Publication of JPS61142046A publication Critical patent/JPS61142046A/ja
Publication of JPH0416302B2 publication Critical patent/JPH0416302B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Feeding Of Workpieces (AREA)
  • Specific Conveyance Elements (AREA)
  • Die Bonding (AREA)
JP26489484A 1984-12-14 1984-12-14 小片ワ−クのピツクアツプ装置 Granted JPS61142046A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26489484A JPS61142046A (ja) 1984-12-14 1984-12-14 小片ワ−クのピツクアツプ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26489484A JPS61142046A (ja) 1984-12-14 1984-12-14 小片ワ−クのピツクアツプ装置

Publications (2)

Publication Number Publication Date
JPS61142046A true JPS61142046A (ja) 1986-06-28
JPH0416302B2 JPH0416302B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-03-23

Family

ID=17409700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26489484A Granted JPS61142046A (ja) 1984-12-14 1984-12-14 小片ワ−クのピツクアツプ装置

Country Status (1)

Country Link
JP (1) JPS61142046A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63150134A (ja) * 1986-12-16 1988-06-22 Matsushita Electric Ind Co Ltd 微小物体の自動供給方法
JP2023075867A (ja) * 2021-11-19 2023-05-31 日本ファインテック株式会社 チップ剥離装置及びテーピングマシン

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63150134A (ja) * 1986-12-16 1988-06-22 Matsushita Electric Ind Co Ltd 微小物体の自動供給方法
JP2023075867A (ja) * 2021-11-19 2023-05-31 日本ファインテック株式会社 チップ剥離装置及びテーピングマシン

Also Published As

Publication number Publication date
JPH0416302B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-03-23

Similar Documents

Publication Publication Date Title
JP3433218B2 (ja) 電子部品装着装置
JPS6372138A (ja) シリコンウエハ−の位置決め装置
JPH08255804A (ja) 半導体製造装置
JP4939984B2 (ja) 電子回路部品装着装置
JPS61142046A (ja) 小片ワ−クのピツクアツプ装置
KR100251432B1 (ko) 다이 밀어 올리기 장치
KR100217285B1 (ko) 다이이송장치
US4593462A (en) Apparatus for automatically mounting chip-type circuit elements on substrate
JP2565961B2 (ja) スライシングマシンのウエハ回収装置
JPS6317249Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0325406Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR940002759B1 (ko) 이너리이드 본딩장치
JPS6057942A (ja) ペレツトマウント装置
JP2625948B2 (ja) 電子部品実装装置および電子部品実装方法
JPH06169002A (ja) ボンダにおけるウエハからのチップ供給装置
JP3079501B2 (ja) ダイ突き上げ装置の調整装置
JPH0117838B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN85109034A (zh) 用于在基片上自动安装芯片式电路元件的设备
JP2591022B2 (ja) 電子部品移載装置
JPH0671155B2 (ja) 電子部品の突上げ装置
JPH079380A (ja) 吸着ノズルの圧力供給装置
JPH0722234B2 (ja) チップ部品装着装置
JPS6132813B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2578934B2 (ja) ダイボンディング装置
JPH0732190B2 (ja) 半導体ペレットのピックアップ方法