JPS61140197A - 多層印刷配線板の製造方法 - Google Patents
多層印刷配線板の製造方法Info
- Publication number
- JPS61140197A JPS61140197A JP26189784A JP26189784A JPS61140197A JP S61140197 A JPS61140197 A JP S61140197A JP 26189784 A JP26189784 A JP 26189784A JP 26189784 A JP26189784 A JP 26189784A JP S61140197 A JPS61140197 A JP S61140197A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- plating
- layer
- adhesive
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 33
- 238000007747 plating Methods 0.000 claims description 33
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 239000003054 catalyst Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 7
- 238000007772 electroless plating Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 238000007788 roughening Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000009413 insulation Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical compound [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26189784A JPS61140197A (ja) | 1984-12-13 | 1984-12-13 | 多層印刷配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26189784A JPS61140197A (ja) | 1984-12-13 | 1984-12-13 | 多層印刷配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61140197A true JPS61140197A (ja) | 1986-06-27 |
| JPH0149035B2 JPH0149035B2 (enrdf_load_stackoverflow) | 1989-10-23 |
Family
ID=17368274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26189784A Granted JPS61140197A (ja) | 1984-12-13 | 1984-12-13 | 多層印刷配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61140197A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0493094A (ja) * | 1990-08-08 | 1992-03-25 | Hitachi Aic Inc | 多層配線板の製造方法 |
-
1984
- 1984-12-13 JP JP26189784A patent/JPS61140197A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0493094A (ja) * | 1990-08-08 | 1992-03-25 | Hitachi Aic Inc | 多層配線板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0149035B2 (enrdf_load_stackoverflow) | 1989-10-23 |
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