JPH0149035B2 - - Google Patents
Info
- Publication number
- JPH0149035B2 JPH0149035B2 JP26189784A JP26189784A JPH0149035B2 JP H0149035 B2 JPH0149035 B2 JP H0149035B2 JP 26189784 A JP26189784 A JP 26189784A JP 26189784 A JP26189784 A JP 26189784A JP H0149035 B2 JPH0149035 B2 JP H0149035B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- plating
- adhesive
- wiring board
- resist layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 34
- 238000007747 plating Methods 0.000 claims description 32
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 239000003054 catalyst Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000007772 electroless plating Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- CMMUKUYEPRGBFB-UHFFFAOYSA-L dichromic acid Chemical compound O[Cr](=O)(=O)O[Cr](O)(=O)=O CMMUKUYEPRGBFB-UHFFFAOYSA-L 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26189784A JPS61140197A (ja) | 1984-12-13 | 1984-12-13 | 多層印刷配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26189784A JPS61140197A (ja) | 1984-12-13 | 1984-12-13 | 多層印刷配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61140197A JPS61140197A (ja) | 1986-06-27 |
| JPH0149035B2 true JPH0149035B2 (enrdf_load_stackoverflow) | 1989-10-23 |
Family
ID=17368274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26189784A Granted JPS61140197A (ja) | 1984-12-13 | 1984-12-13 | 多層印刷配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61140197A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2513526B2 (ja) * | 1990-08-08 | 1996-07-03 | 日立エーアイシー株式会社 | 多層配線板の製造方法 |
-
1984
- 1984-12-13 JP JP26189784A patent/JPS61140197A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61140197A (ja) | 1986-06-27 |
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