JPS61130326A - 半導体封止用エポキシ樹脂組成物 - Google Patents

半導体封止用エポキシ樹脂組成物

Info

Publication number
JPS61130326A
JPS61130326A JP25051184A JP25051184A JPS61130326A JP S61130326 A JPS61130326 A JP S61130326A JP 25051184 A JP25051184 A JP 25051184A JP 25051184 A JP25051184 A JP 25051184A JP S61130326 A JPS61130326 A JP S61130326A
Authority
JP
Japan
Prior art keywords
epoxy resin
inorganic filler
coupling agent
silane coupling
silane compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25051184A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6325009B2 (enExample
Inventor
Shuichi Kita
喜多　修市
Takamitsu Fujimoto
隆光 藤本
Yuzo Kanegae
鐘ケ江　裕三
Norimoto Moriwaki
森脇　紀元
Torahiko Ando
虎彦 安藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP25051184A priority Critical patent/JPS61130326A/ja
Publication of JPS61130326A publication Critical patent/JPS61130326A/ja
Publication of JPS6325009B2 publication Critical patent/JPS6325009B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP25051184A 1984-11-29 1984-11-29 半導体封止用エポキシ樹脂組成物 Granted JPS61130326A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25051184A JPS61130326A (ja) 1984-11-29 1984-11-29 半導体封止用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25051184A JPS61130326A (ja) 1984-11-29 1984-11-29 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS61130326A true JPS61130326A (ja) 1986-06-18
JPS6325009B2 JPS6325009B2 (enExample) 1988-05-24

Family

ID=17208974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25051184A Granted JPS61130326A (ja) 1984-11-29 1984-11-29 半導体封止用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS61130326A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63202621A (ja) * 1987-02-18 1988-08-22 Matsushita Electric Works Ltd エポキシ樹脂成形材料
JPH0276248A (ja) * 1988-09-12 1990-03-15 Nitto Denko Corp 半導体装置
JPH02110126A (ja) * 1988-10-19 1990-04-23 Oki Electric Ind Co Ltd 樹脂封止半導体装置
US5571851A (en) * 1994-01-28 1996-11-05 J.M. Huber Corporation Reinforcing fillers for plastics systems
JP2007217683A (ja) * 2006-01-19 2007-08-30 Hitachi Chem Co Ltd エポキシ樹脂組成物及び電子部品装置
JP2011001519A (ja) * 2009-06-22 2011-01-06 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP2016008280A (ja) * 2014-06-25 2016-01-18 味の素株式会社 樹脂組成物

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63202621A (ja) * 1987-02-18 1988-08-22 Matsushita Electric Works Ltd エポキシ樹脂成形材料
JPH0276248A (ja) * 1988-09-12 1990-03-15 Nitto Denko Corp 半導体装置
JPH02110126A (ja) * 1988-10-19 1990-04-23 Oki Electric Ind Co Ltd 樹脂封止半導体装置
US5571851A (en) * 1994-01-28 1996-11-05 J.M. Huber Corporation Reinforcing fillers for plastics systems
JP2007217683A (ja) * 2006-01-19 2007-08-30 Hitachi Chem Co Ltd エポキシ樹脂組成物及び電子部品装置
JP2011001519A (ja) * 2009-06-22 2011-01-06 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP2016008280A (ja) * 2014-06-25 2016-01-18 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
JPS6325009B2 (enExample) 1988-05-24

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