JPS61126967A - フラツクス塗布装置 - Google Patents

フラツクス塗布装置

Info

Publication number
JPS61126967A
JPS61126967A JP24941184A JP24941184A JPS61126967A JP S61126967 A JPS61126967 A JP S61126967A JP 24941184 A JP24941184 A JP 24941184A JP 24941184 A JP24941184 A JP 24941184A JP S61126967 A JPS61126967 A JP S61126967A
Authority
JP
Japan
Prior art keywords
foaming
flux
chambers
tank
nozzles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24941184A
Other languages
English (en)
Japanese (ja)
Other versions
JPH021593B2 (OSRAM
Inventor
Kiyoshi Suzuki
清 鈴木
Teruo Okano
輝男 岡野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
Original Assignee
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Priority to JP24941184A priority Critical patent/JPS61126967A/ja
Publication of JPS61126967A publication Critical patent/JPS61126967A/ja
Publication of JPH021593B2 publication Critical patent/JPH021593B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP24941184A 1984-11-26 1984-11-26 フラツクス塗布装置 Granted JPS61126967A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24941184A JPS61126967A (ja) 1984-11-26 1984-11-26 フラツクス塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24941184A JPS61126967A (ja) 1984-11-26 1984-11-26 フラツクス塗布装置

Publications (2)

Publication Number Publication Date
JPS61126967A true JPS61126967A (ja) 1986-06-14
JPH021593B2 JPH021593B2 (OSRAM) 1990-01-12

Family

ID=17192570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24941184A Granted JPS61126967A (ja) 1984-11-26 1984-11-26 フラツクス塗布装置

Country Status (1)

Country Link
JP (1) JPS61126967A (OSRAM)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01249295A (ja) * 1988-02-19 1989-10-04 Electrovert Ltd 泡フラックス装置
CN109175589A (zh) * 2018-09-19 2019-01-11 北京实验工厂有限责任公司 高效助焊剂涂刷系统
CN110238478A (zh) * 2018-03-08 2019-09-17 Lg电子株式会社 太阳能电池板的焊剂涂覆装置和方法及互连器附接设备

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01249295A (ja) * 1988-02-19 1989-10-04 Electrovert Ltd 泡フラックス装置
CN110238478A (zh) * 2018-03-08 2019-09-17 Lg电子株式会社 太阳能电池板的焊剂涂覆装置和方法及互连器附接设备
CN109175589A (zh) * 2018-09-19 2019-01-11 北京实验工厂有限责任公司 高效助焊剂涂刷系统

Also Published As

Publication number Publication date
JPH021593B2 (OSRAM) 1990-01-12

Similar Documents

Publication Publication Date Title
ATE100735T1 (de) Vorrichtung und verfahren zum beschichten von leiterplatten.
DE59304008D1 (de) Verfahren und vorrichtung zum übertragen von abdrucken von einem träger auf ein substrat
TW345520B (en) Method for mounting components and components mounting apparatus capable of shortening mounting tact time
US4275656A (en) Bubble printing method
JPH07231155A (ja) プリント配線板のエッチング装置及びエッチング方法
US5858312A (en) Gas excitation device
KR101362292B1 (ko) 개선된 필름 양면 코팅 장치 및 방법
JPH021593B2 (OSRAM)
JP4480134B2 (ja) 塗布膜形成方法及びその装置
CA2051214A1 (en) Vacuum Film Forming Apparatus
EP0329372A3 (en) Foam fluxer
JP4644941B2 (ja) 電子部品実装装置
KR20130136076A (ko) 개선된 필름 양면 코팅 장치 및 방법
JP2003063644A (ja) 搬送装置
EP0045909B1 (en) A soldering method and apparatus
JPS5239286A (en) Ship mooring apparatus using adsorption boards
JP2808271B2 (ja) 複数群のワークに対する同時スクリーン印刷方法及びそのスクリーン印刷機
US11707944B2 (en) Substrate treating apparatus and inkjet apparatus
KR930014836A (ko) 액체공급장치
JPH10113595A (ja) 塗布装置
JPH02277281A (ja) プリント板のエッチング方法及びその装置
GB1268540A (en) An installation for and method of making multi-layer cakes
JP3662627B2 (ja) フラックス塗布装置
JPS57190767A (en) Soldering method for chip parts
JPS6193855A (ja) 塗布装置