JPS6112680Y2 - - Google Patents
Info
- Publication number
- JPS6112680Y2 JPS6112680Y2 JP1977116980U JP11698077U JPS6112680Y2 JP S6112680 Y2 JPS6112680 Y2 JP S6112680Y2 JP 1977116980 U JP1977116980 U JP 1977116980U JP 11698077 U JP11698077 U JP 11698077U JP S6112680 Y2 JPS6112680 Y2 JP S6112680Y2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic frame
- sealing
- semiconductor device
- metallized layer
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Microwave Amplifiers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977116980U JPS6112680Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1977-08-31 | 1977-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977116980U JPS6112680Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1977-08-31 | 1977-08-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5443971U JPS5443971U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1979-03-26 |
| JPS6112680Y2 true JPS6112680Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1986-04-19 |
Family
ID=29070005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977116980U Expired JPS6112680Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1977-08-31 | 1977-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6112680Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53120262U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1977-03-01 | 1978-09-25 | ||
| JP2716605B2 (ja) * | 1991-07-31 | 1998-02-18 | 三菱電機株式会社 | マイクロ波モジュール |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5730298B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1974-01-18 | 1982-06-28 | ||
| JPS52104571A (en) * | 1976-02-28 | 1977-09-02 | Sekisui Plastics | Process for manufacture of expandable thermoplastic resin particle |
-
1977
- 1977-08-31 JP JP1977116980U patent/JPS6112680Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5443971U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1979-03-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5656857A (en) | Semiconductor device with insulating resin layer and substrate having low sheet resistance | |
| US3946428A (en) | Encapsulation package for a semiconductor element | |
| US4276558A (en) | Hermetically sealed active microwave integrated circuit | |
| KR20180071976A (ko) | 향상된 비디오 대역폭을 갖는 rf 전력 증폭기용 다중 베이스밴드 터미네이션 컴포넌트 | |
| JP2020535701A (ja) | バイアスストリップを有するrf増幅器パッケージ | |
| US4067040A (en) | Semiconductor device | |
| JP2001085569A (ja) | 高周波回路装置 | |
| US4298846A (en) | Semiconductor device | |
| US5126827A (en) | Semiconductor chip header having particular surface metallization | |
| JPS6112680Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| US6982479B2 (en) | Semiconductor package with leadframe inductors | |
| KR900001246B1 (ko) | 반도체장치 | |
| JP2991168B2 (ja) | 半導体装置およびその製造方法 | |
| JP7666175B2 (ja) | 半導体装置およびパッケージ | |
| US6627982B2 (en) | Electric connection structure for electronic power devices, and method of connection | |
| EP3493257A1 (en) | Silicon shielding for baseband termination and rf performance enhancement | |
| JPH10321762A (ja) | 半導体装置 | |
| JP4164013B2 (ja) | 半導体装置 | |
| JPS588582B2 (ja) | トランジスタ用同軸形パツケ−ジ | |
| JPS61168939A (ja) | マイクロ波集積回路用外囲器 | |
| JPS5919360A (ja) | 電界効果トランジスタ | |
| JPS61172376A (ja) | 半導体装置 | |
| JP3105573B2 (ja) | マイクロ波帯半導体装置用パッケージ | |
| JPH04162751A (ja) | 高周波半導体装置 | |
| JP2701644B2 (ja) | 半導体装置 |