JPS6112676Y2 - - Google Patents
Info
- Publication number
- JPS6112676Y2 JPS6112676Y2 JP3556880U JP3556880U JPS6112676Y2 JP S6112676 Y2 JPS6112676 Y2 JP S6112676Y2 JP 3556880 U JP3556880 U JP 3556880U JP 3556880 U JP3556880 U JP 3556880U JP S6112676 Y2 JPS6112676 Y2 JP S6112676Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- frame
- resin molding
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 238000000465 moulding Methods 0.000 claims description 15
- 238000005507 spraying Methods 0.000 claims description 5
- 239000013043 chemical agent Substances 0.000 claims 1
- 239000006082 mold release agent Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3556880U JPS6112676Y2 (forum.php) | 1980-03-17 | 1980-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3556880U JPS6112676Y2 (forum.php) | 1980-03-17 | 1980-03-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56137451U JPS56137451U (forum.php) | 1981-10-17 |
| JPS6112676Y2 true JPS6112676Y2 (forum.php) | 1986-04-19 |
Family
ID=29631195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3556880U Expired JPS6112676Y2 (forum.php) | 1980-03-17 | 1980-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6112676Y2 (forum.php) |
-
1980
- 1980-03-17 JP JP3556880U patent/JPS6112676Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56137451U (forum.php) | 1981-10-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6112676Y2 (forum.php) | ||
| JPH0195010A (ja) | 成形金型のクリーニング方法 | |
| JPH02129933A (ja) | Ｉｃカード用のモジュールの製造方法 | |
| US20060068527A1 (en) | Molded stiffener for thin substrates | |
| JP2581113B2 (ja) | 半導体装置のモールド方法および装置 | |
| JPH0324341Y2 (forum.php) | ||
| JPH0222255Y2 (forum.php) | ||
| JPH0510359Y2 (forum.php) | ||
| JP2514818B2 (ja) | 集積回路基板の樹脂封止方法 | |
| JPH03280554A (ja) | 半導体装置の製造方法 | |
| JPS5918675Y2 (ja) | 半導体装置のモ−ルド装置 | |
| JPH0510360Y2 (forum.php) | ||
| JPH03167810A (ja) | 注型金型装置 | |
| JPH02135765A (ja) | 半導体装置用リードフレーム | |
| JPS5874341U (ja) | 半導体装置の樹脂モ−ルド装置 | |
| JPS638130Y2 (forum.php) | ||
| JPS55159932A (en) | Preparation of wooden top board | |
| JP3499269B2 (ja) | カバーフレームと樹脂封止方法 | |
| JPS629720Y2 (forum.php) | ||
| JPH0812877B2 (ja) | 樹脂封止型半導体装置の製造方法 | |
| JPS6130280Y2 (forum.php) | ||
| JPH04179242A (ja) | 半導体素子の封止方法 | |
| JPH0513484A (ja) | 半導体装置の製造方法 | |
| JPS556840A (en) | Optical semiconductor device and resin sealing method of the same | |
| JPH10178137A (ja) | 樹脂モールド型半導体装置の製造方法 |