JPS6112676Y2 - - Google Patents

Description

[Detailed Description of the Invention] This invention relates to a resin molding device for electronic components such as semiconductor devices.

Generally, semiconductor devices such as ICs and transistors are often resin molded. For example, as shown in FIGS. 1 and 2, resin molded transistors are
After integrating the lead frame 1 and the heat sink frame 2, a pellet 4 is mounted on each heat sink 3, and the electrode of the pellet 4 and the corresponding lead 6 are connected with a thin metal wire 7. Each heat sink 3
Key points of the lead portion 5 are molded with a resin 8 such as epoxy resin. In addition, lead frame 1 has 3 pieces 1
The heat sink frame 2 is made by integrating a plurality of lead parts 5 of a set by a tie bar part 9, and the heat sink frame 2 is made by integrating a plurality of heat sink plates 3 by a connecting part 10. This integration is achieved by caulking the center lead 6' of the lead portion 5 to the end surface of the heat sink plate 3. When molding with the resin 8 is completed, the tie bar portions 9 and connecting portions 10 of each frame 1, 2 are cut and removed to obtain a plurality of transistors at once.

By the way, regarding the molding of the resin 8, this is a resin molding device 1 consisting of an upper mold 11 and a lower mold 12 as shown in FIGS. 3 to 5.
I was using 3. That is, the upper mold 11 has a mold chamber 11a on the lower surface, and the lower mold 12 has a mold chamber 12a on the upper surface. The mold chambers 11a and 12a together form a set of sealed mold chambers 14. and,
Liquid resin is press-fitted into the plurality of mold chambers 14, and this press-fitting is performed through each gate 15 provided on a part of the mating surfaces of the upper and lower molds 11 and 12. The tip of this gate 15 is inside the mold chamber 14.
The opening is about 0.2mm in size, and the base end is the upper mold 11.
It is connected to a runner 17 which communicates with a pot portion 16 for press-fitting the resin. That is, the liquid resin press-fitted from the pot portion 16 into the runner 17 is press-fitted from each gate 15 into each mold chamber 14. Then, when the resin hardens, the upper
The lower molds 11 and 12 are removed, and the frames 1 and 2 that have been resin-molded at predetermined locations are taken out from the resin molding device 13. Furthermore, frames 1 and 2
When the frame 2 is taken out from the resin molding device 13, the resin 8a remaining on the gate 15 and the runner 17 is taken out together with the frame 2 as shown in FIG. 6, but this remaining resin 8a applies an external force. It can be easily removed.

By the way, when resin molding is performed by the method described above, the resin molding device 1 for the frames 1 and 2 after resin molding is placed in the mold chambers 11a and 12a formed in the upper mold 11 and the lower mold 12.
A release agent is sprayed on the mold in advance so that it can be easily removed from the mold.

However, the mold chambers 11a, 1 of this mold release agent
Since the spraying into the mold chambers 11a and 12a is carried out manually by the operator, the workability is poor and at the same time it is difficult to uniformly spray the mold release agent into the mold chambers 11a and 12a. I had a lot of flaws.

In view of the above-mentioned drawbacks of the conventional methods, this invention installs a nozzle at a predetermined location of the upper mold and/or lower mold to spray a mold release agent into the mold chamber provided in the upper mold and/or lower mold. The present invention is to provide a resin molding apparatus, and the details of this invention will be described below with reference to embodiments shown in the drawings.

That is, as shown in FIG.
A mold release pin 23 as shown in FIG. A nozzle 24 for spraying the agent is provided.

Prior to resin molding using this device 22, the mold chamber 21a of the lower mold 21 is
A knockout pin 23 located at the bottom of the mold protrudes from the surface of the lower mold 21, and a nozzle 24 provided at the tip of the knockout pin 23 enters the mold chambers 20a and 21a provided in the upper mold 20 and the lower mold 21. The mold release agent is automatically sprayed in the direction of the mold.

In addition to being provided at the tip of the knockout pin 23 as described above, the nozzle 24 for spraying the mold release agent provided in this molding device 22 is used for positioning the frame when placing the frame on the lower mold 21, for example. In order to do this, it may be provided on a projection 25 formed at a predetermined location on the lower mold 21, or may be separately provided at an arbitrary position on the upper mold 20, the lower mold 21, or both. Furthermore, the nozzle can also be configured to be rotatable like a sprinkler.

As explained above, according to this invention, the mold release agent can be automatically and almost uniformly sprayed into the mold chamber provided in the upper mold and/or the lower mold prior to resin molding, and The work of spraying the mold release agent into the mold chamber can be easily performed.

[Brief explanation of the drawing]

Figure 1 is a partial plan view of a typical resin-molded transistor in the process of being manufactured, and Figure 2 is a partial plan view of a typical resin-molded transistor in the process of being manufactured.
3 is a plan view of the conventional example, FIG. 4 is a partially enlarged sectional view showing the state in which the frame of the conventional device is set, FIG. 5 is a sectional view taken along the line shown in FIG. 4,
Fig. 6 is a partial plan view of the transistor in a resin-molded state, Fig. 7 is a sectional view showing an embodiment of this invention, and Fig. 8 is a state in which a nozzle according to this invention is installed on a knockout pin. It is a partially enlarged sectional view showing. 20... Upper mold, 21... Lower mold, 20a, 2
1a...mold chamber, 22...resin molding device, 23...knockout pin, 24...nozzle.

Claims (1)

[Scope of utility model registration request] An upper mold, a lower mold disposed opposite to the upper mold, and a mold chamber formed in the upper mold and/or the lower mold to release the mold. 1. A resin molding device comprising a knockout pin having a nozzle for spraying a chemical agent.