JPS61125768A - 脆性材料の切断方法 - Google Patents
脆性材料の切断方法Info
- Publication number
- JPS61125768A JPS61125768A JP24539184A JP24539184A JPS61125768A JP S61125768 A JPS61125768 A JP S61125768A JP 24539184 A JP24539184 A JP 24539184A JP 24539184 A JP24539184 A JP 24539184A JP S61125768 A JPS61125768 A JP S61125768A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- cutting
- cut
- slit nozzle
- machining fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24539184A JPS61125768A (ja) | 1984-11-20 | 1984-11-20 | 脆性材料の切断方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24539184A JPS61125768A (ja) | 1984-11-20 | 1984-11-20 | 脆性材料の切断方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29822192A Division JPH0639095B2 (ja) | 1992-10-12 | 1992-10-12 | 脆性材料の切断装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61125768A true JPS61125768A (ja) | 1986-06-13 |
JPH0520227B2 JPH0520227B2 (enrdf_load_stackoverflow) | 1993-03-18 |
Family
ID=17132956
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24539184A Granted JPS61125768A (ja) | 1984-11-20 | 1984-11-20 | 脆性材料の切断方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61125768A (enrdf_load_stackoverflow) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1989010825A1 (fr) * | 1988-05-09 | 1989-11-16 | Charles Hauser | Dispositif pour l'amelioration du sciage d'une piece en tranches fines |
US5269285A (en) * | 1991-11-29 | 1993-12-14 | Shin-Etsu Handotai Company, Ltd. | Wire saw and slicing method using the same |
JP2006305685A (ja) * | 2005-04-28 | 2006-11-09 | Komatsu Electronic Metals Co Ltd | ワイヤソー装置およびワイヤソー装置用のガイドバー並びにワイヤソー装置用のスラリ供給装置。 |
JP2008213111A (ja) * | 2007-03-06 | 2008-09-18 | Sharp Corp | マルチワイヤーソーおよびスラリー供給方法 |
JP2009142986A (ja) * | 2003-10-27 | 2009-07-02 | Mitsubishi Electric Corp | マルチワイヤソー |
CN102085641A (zh) * | 2010-07-22 | 2011-06-08 | 杭州精功机电研究所有限公司 | 多线切割机用防跳线喷砂装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5279395A (en) * | 1975-12-25 | 1977-07-04 | Mitsubishi Heavy Ind Ltd | Surface polishing device of thin film sheet |
JPS57193349U (enrdf_load_stackoverflow) * | 1981-06-02 | 1982-12-08 |
-
1984
- 1984-11-20 JP JP24539184A patent/JPS61125768A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5279395A (en) * | 1975-12-25 | 1977-07-04 | Mitsubishi Heavy Ind Ltd | Surface polishing device of thin film sheet |
JPS57193349U (enrdf_load_stackoverflow) * | 1981-06-02 | 1982-12-08 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1989010825A1 (fr) * | 1988-05-09 | 1989-11-16 | Charles Hauser | Dispositif pour l'amelioration du sciage d'une piece en tranches fines |
US5269285A (en) * | 1991-11-29 | 1993-12-14 | Shin-Etsu Handotai Company, Ltd. | Wire saw and slicing method using the same |
JP2009142986A (ja) * | 2003-10-27 | 2009-07-02 | Mitsubishi Electric Corp | マルチワイヤソー |
JP2006305685A (ja) * | 2005-04-28 | 2006-11-09 | Komatsu Electronic Metals Co Ltd | ワイヤソー装置およびワイヤソー装置用のガイドバー並びにワイヤソー装置用のスラリ供給装置。 |
JP2008213111A (ja) * | 2007-03-06 | 2008-09-18 | Sharp Corp | マルチワイヤーソーおよびスラリー供給方法 |
CN102085641A (zh) * | 2010-07-22 | 2011-06-08 | 杭州精功机电研究所有限公司 | 多线切割机用防跳线喷砂装置 |
CN102085641B (zh) | 2010-07-22 | 2012-06-20 | 杭州精功机电研究所有限公司 | 多线切割机用防跳线喷砂装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0520227B2 (enrdf_load_stackoverflow) | 1993-03-18 |
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