CN102990792A - 一种八英寸硅单晶硅片多线切割机及其切割方法 - Google Patents
一种八英寸硅单晶硅片多线切割机及其切割方法 Download PDFInfo
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- CN102990792A CN102990792A CN2012104972145A CN201210497214A CN102990792A CN 102990792 A CN102990792 A CN 102990792A CN 2012104972145 A CN2012104972145 A CN 2012104972145A CN 201210497214 A CN201210497214 A CN 201210497214A CN 102990792 A CN102990792 A CN 102990792A
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 22
- 239000010703 silicon Substances 0.000 claims abstract description 22
- 235000012431 wafers Nutrition 0.000 claims abstract description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052742 iron Inorganic materials 0.000 claims abstract description 5
- 238000005520 cutting process Methods 0.000 claims description 37
- 239000004570 mortar (masonry) Substances 0.000 claims description 22
- 239000002173 cutting fluid Substances 0.000 claims description 8
- 239000013078 crystal Substances 0.000 claims description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000011084 recovery Methods 0.000 claims description 2
- 239000002002 slurry Substances 0.000 abstract 3
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103331828A (zh) * | 2013-05-31 | 2013-10-02 | 阳光硅谷电子科技有限公司 | 一种超大直径硅棒的切割工艺 |
CN103817810A (zh) * | 2014-03-11 | 2014-05-28 | 山西潞安太阳能科技有限责任公司 | 一种ntc-pv800硅片切割机硅片切割方法 |
CN103950121A (zh) * | 2014-04-16 | 2014-07-30 | 唐山晶玉科技有限公司 | 一种多线切割机专用挡砂装置 |
CN104441288A (zh) * | 2014-10-31 | 2015-03-25 | 镇江环太硅科技有限公司 | 一种太阳能硅片加工切割设备和方法 |
CN106181590A (zh) * | 2016-07-27 | 2016-12-07 | 成都青洋电子材料有限公司 | 一种高纯硅晶体材料精度研磨工艺 |
CN107030908A (zh) * | 2017-05-15 | 2017-08-11 | 天津市环欧半导体材料技术有限公司 | 一种八英寸半导体硅片细线细砂化切割工艺 |
CN108437244A (zh) * | 2018-03-22 | 2018-08-24 | 山东大学 | 光伏多晶硅电池片的游离-固结磨粒复合线锯切割方法 |
CN113843904A (zh) * | 2020-06-28 | 2021-12-28 | 银川隆基光伏科技有限公司 | 太阳能硅片的切割方法、设备及存储介质 |
Citations (6)
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US5893308A (en) * | 1994-05-19 | 1999-04-13 | Tokyo Seimitsu Co., Ltd. | Method of positioning work piece and system therefor |
JP2000000750A (ja) * | 1998-06-15 | 2000-01-07 | Toshiba Ceramics Co Ltd | マルチワイヤーソー |
JP2000296455A (ja) * | 1999-04-09 | 2000-10-24 | Tokyo Seimitsu Co Ltd | 固定砥粒マルチワイヤソー |
JP2002166416A (ja) * | 2000-11-29 | 2002-06-11 | Toshiba Ceramics Co Ltd | マルチワイヤソーおよびこれを用いた切断方法 |
CN101360592A (zh) * | 2006-10-20 | 2009-02-04 | 三菱电机株式会社 | 硅锭切割用浆料及用该浆料的硅锭切割方法 |
CN203046011U (zh) * | 2012-11-28 | 2013-07-10 | 天津市环欧半导体材料技术有限公司 | 一种八英寸硅单晶硅片多线切割机 |
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2012
- 2012-11-28 CN CN201210497214.5A patent/CN102990792B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5893308A (en) * | 1994-05-19 | 1999-04-13 | Tokyo Seimitsu Co., Ltd. | Method of positioning work piece and system therefor |
JP2000000750A (ja) * | 1998-06-15 | 2000-01-07 | Toshiba Ceramics Co Ltd | マルチワイヤーソー |
JP2000296455A (ja) * | 1999-04-09 | 2000-10-24 | Tokyo Seimitsu Co Ltd | 固定砥粒マルチワイヤソー |
JP2002166416A (ja) * | 2000-11-29 | 2002-06-11 | Toshiba Ceramics Co Ltd | マルチワイヤソーおよびこれを用いた切断方法 |
CN101360592A (zh) * | 2006-10-20 | 2009-02-04 | 三菱电机株式会社 | 硅锭切割用浆料及用该浆料的硅锭切割方法 |
CN203046011U (zh) * | 2012-11-28 | 2013-07-10 | 天津市环欧半导体材料技术有限公司 | 一种八英寸硅单晶硅片多线切割机 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103331828A (zh) * | 2013-05-31 | 2013-10-02 | 阳光硅谷电子科技有限公司 | 一种超大直径硅棒的切割工艺 |
CN103817810A (zh) * | 2014-03-11 | 2014-05-28 | 山西潞安太阳能科技有限责任公司 | 一种ntc-pv800硅片切割机硅片切割方法 |
CN103950121A (zh) * | 2014-04-16 | 2014-07-30 | 唐山晶玉科技有限公司 | 一种多线切割机专用挡砂装置 |
CN103950121B (zh) * | 2014-04-16 | 2016-01-20 | 唐山晶玉科技有限公司 | 一种多线切割机专用挡砂装置 |
CN104441288A (zh) * | 2014-10-31 | 2015-03-25 | 镇江环太硅科技有限公司 | 一种太阳能硅片加工切割设备和方法 |
CN106181590A (zh) * | 2016-07-27 | 2016-12-07 | 成都青洋电子材料有限公司 | 一种高纯硅晶体材料精度研磨工艺 |
CN106181590B (zh) * | 2016-07-27 | 2018-08-03 | 成都青洋电子材料有限公司 | 一种高纯硅晶体材料精度研磨工艺 |
CN107030908A (zh) * | 2017-05-15 | 2017-08-11 | 天津市环欧半导体材料技术有限公司 | 一种八英寸半导体硅片细线细砂化切割工艺 |
CN108437244A (zh) * | 2018-03-22 | 2018-08-24 | 山东大学 | 光伏多晶硅电池片的游离-固结磨粒复合线锯切割方法 |
CN113843904A (zh) * | 2020-06-28 | 2021-12-28 | 银川隆基光伏科技有限公司 | 太阳能硅片的切割方法、设备及存储介质 |
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