CN102990792B - 一种八英寸硅单晶硅片切割方法 - Google Patents
一种八英寸硅单晶硅片切割方法 Download PDFInfo
- Publication number
- CN102990792B CN102990792B CN201210497214.5A CN201210497214A CN102990792B CN 102990792 B CN102990792 B CN 102990792B CN 201210497214 A CN201210497214 A CN 201210497214A CN 102990792 B CN102990792 B CN 102990792B
- Authority
- CN
- China
- Prior art keywords
- workbench
- single crystal
- silicon single
- cutting
- sheave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 54
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 46
- 239000010703 silicon Substances 0.000 title claims abstract description 46
- 238000005520 cutting process Methods 0.000 title claims abstract description 40
- 239000013078 crystal Substances 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000004570 mortar (masonry) Substances 0.000 claims abstract description 29
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052742 iron Inorganic materials 0.000 claims abstract description 5
- 239000004744 fabric Substances 0.000 claims abstract description 4
- 239000002173 cutting fluid Substances 0.000 claims description 7
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims 6
- 235000012431 wafers Nutrition 0.000 abstract 2
- 230000009286 beneficial effect Effects 0.000 abstract 1
- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210497214.5A CN102990792B (zh) | 2012-11-28 | 2012-11-28 | 一种八英寸硅单晶硅片切割方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210497214.5A CN102990792B (zh) | 2012-11-28 | 2012-11-28 | 一种八英寸硅单晶硅片切割方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102990792A CN102990792A (zh) | 2013-03-27 |
CN102990792B true CN102990792B (zh) | 2015-11-04 |
Family
ID=47920162
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210497214.5A Active CN102990792B (zh) | 2012-11-28 | 2012-11-28 | 一种八英寸硅单晶硅片切割方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102990792B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103331828A (zh) * | 2013-05-31 | 2013-10-02 | 阳光硅谷电子科技有限公司 | 一种超大直径硅棒的切割工艺 |
CN103817810B (zh) * | 2014-03-11 | 2015-10-14 | 山西潞安太阳能科技有限责任公司 | 一种ntc-pv800硅片切割机硅片切割方法 |
CN103950121B (zh) * | 2014-04-16 | 2016-01-20 | 唐山晶玉科技有限公司 | 一种多线切割机专用挡砂装置 |
CN104441288B (zh) * | 2014-10-31 | 2016-08-31 | 镇江环太硅科技有限公司 | 一种太阳能硅片加工切割设备和方法 |
CN106181590B (zh) * | 2016-07-27 | 2018-08-03 | 成都青洋电子材料有限公司 | 一种高纯硅晶体材料精度研磨工艺 |
CN107030908A (zh) * | 2017-05-15 | 2017-08-11 | 天津市环欧半导体材料技术有限公司 | 一种八英寸半导体硅片细线细砂化切割工艺 |
CN108437244B (zh) * | 2018-03-22 | 2019-09-24 | 山东大学 | 光伏多晶硅电池片的游离-固结磨粒复合线锯切割方法 |
CN113843904B (zh) * | 2020-06-28 | 2022-09-06 | 银川隆基光伏科技有限公司 | 太阳能硅片的切割方法、设备及存储介质 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5893308A (en) * | 1994-05-19 | 1999-04-13 | Tokyo Seimitsu Co., Ltd. | Method of positioning work piece and system therefor |
JP2000000750A (ja) * | 1998-06-15 | 2000-01-07 | Toshiba Ceramics Co Ltd | マルチワイヤーソー |
JP2000296455A (ja) * | 1999-04-09 | 2000-10-24 | Tokyo Seimitsu Co Ltd | 固定砥粒マルチワイヤソー |
JP2002166416A (ja) * | 2000-11-29 | 2002-06-11 | Toshiba Ceramics Co Ltd | マルチワイヤソーおよびこれを用いた切断方法 |
CN101360592A (zh) * | 2006-10-20 | 2009-02-04 | 三菱电机株式会社 | 硅锭切割用浆料及用该浆料的硅锭切割方法 |
CN203046011U (zh) * | 2012-11-28 | 2013-07-10 | 天津市环欧半导体材料技术有限公司 | 一种八英寸硅单晶硅片多线切割机 |
-
2012
- 2012-11-28 CN CN201210497214.5A patent/CN102990792B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5893308A (en) * | 1994-05-19 | 1999-04-13 | Tokyo Seimitsu Co., Ltd. | Method of positioning work piece and system therefor |
JP2000000750A (ja) * | 1998-06-15 | 2000-01-07 | Toshiba Ceramics Co Ltd | マルチワイヤーソー |
JP2000296455A (ja) * | 1999-04-09 | 2000-10-24 | Tokyo Seimitsu Co Ltd | 固定砥粒マルチワイヤソー |
JP2002166416A (ja) * | 2000-11-29 | 2002-06-11 | Toshiba Ceramics Co Ltd | マルチワイヤソーおよびこれを用いた切断方法 |
CN101360592A (zh) * | 2006-10-20 | 2009-02-04 | 三菱电机株式会社 | 硅锭切割用浆料及用该浆料的硅锭切割方法 |
CN203046011U (zh) * | 2012-11-28 | 2013-07-10 | 天津市环欧半导体材料技术有限公司 | 一种八英寸硅单晶硅片多线切割机 |
Also Published As
Publication number | Publication date |
---|---|
CN102990792A (zh) | 2013-03-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102990792B (zh) | 一种八英寸硅单晶硅片切割方法 | |
CN207327166U (zh) | 一种pcb板加工用快速钻孔装置 | |
CN102574226A (zh) | 线锯工件支撑装置、支撑间隔件及其使用方法 | |
CN203046011U (zh) | 一种八英寸硅单晶硅片多线切割机 | |
CN106079126A (zh) | 一种半导体单晶硅多线切割夹紧装置及方法 | |
CN113752402B (zh) | 一种大尺寸硅片提料划伤亮线的解决方法 | |
CN111590769A (zh) | 一种高台速金刚线快速切割工艺 | |
CN106313353A (zh) | 一种多线切割机线网线弓在线监测装置及方法 | |
CN206952525U (zh) | 一种钻孔攻牙机 | |
CN102229213A (zh) | 一种硅块线锯机床及其硅块固定装置 | |
CN201800144U (zh) | 一种用于切断单晶硅棒料的组合夹具 | |
CN112060378B (zh) | 一种ic用大直径硅切片金刚线切割工艺 | |
CN202045516U (zh) | 用于铜板机的夹具 | |
CN102059750A (zh) | 太阳能电池用硅片的钻石线切割设备及工艺 | |
CN204278268U (zh) | pv600切片机倾斜式线网切割装置 | |
CN202412490U (zh) | 一种硅锭切割锯床 | |
CN213730862U (zh) | 一种链条生产用去毛刺装置 | |
CN204449520U (zh) | 一种汽车泵盖专用直角双攻机 | |
JPH07106288A (ja) | 半導体基板の形成方法 | |
CN210880355U (zh) | 用于硅片加工的倒角机 | |
CN104441280A (zh) | 多线切割机及工作方法 | |
CN107570820A (zh) | 一种关于磁性材料多线切割加工工艺的方法 | |
CN207844341U (zh) | 仓储货架生产用的自动化分离传输装置 | |
CN206373754U (zh) | 一种钛合金抛光设备 | |
CN205385014U (zh) | 引线框架夹具 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240124 Address after: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region after: China Address before: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Park (outside the ring) Hai Tai Road 12 Patentee before: TIANJIN HUANOU SEMICONDUCTOR MATERIAL TECHNOLOGY Co.,Ltd. Country or region before: China |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240129 Address after: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 inside. Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region after: China Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Address before: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region before: China |
|
TR01 | Transfer of patent right |