JPS61117882A - プリント基板 - Google Patents

プリント基板

Info

Publication number
JPS61117882A
JPS61117882A JP23990384A JP23990384A JPS61117882A JP S61117882 A JPS61117882 A JP S61117882A JP 23990384 A JP23990384 A JP 23990384A JP 23990384 A JP23990384 A JP 23990384A JP S61117882 A JPS61117882 A JP S61117882A
Authority
JP
Japan
Prior art keywords
optical
printed circuit
circuit board
light
converter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23990384A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0438154B2 (enExample
Inventor
小寺　孝兵
博夫 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP23990384A priority Critical patent/JPS61117882A/ja
Publication of JPS61117882A publication Critical patent/JPS61117882A/ja
Publication of JPH0438154B2 publication Critical patent/JPH0438154B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
JP23990384A 1984-11-14 1984-11-14 プリント基板 Granted JPS61117882A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23990384A JPS61117882A (ja) 1984-11-14 1984-11-14 プリント基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23990384A JPS61117882A (ja) 1984-11-14 1984-11-14 プリント基板

Publications (2)

Publication Number Publication Date
JPS61117882A true JPS61117882A (ja) 1986-06-05
JPH0438154B2 JPH0438154B2 (enExample) 1992-06-23

Family

ID=17051565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23990384A Granted JPS61117882A (ja) 1984-11-14 1984-11-14 プリント基板

Country Status (1)

Country Link
JP (1) JPS61117882A (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01124788A (ja) * 1987-02-06 1989-05-17 Matsushita Electric Works Ltd 光センサ
US5408568A (en) * 1992-12-03 1995-04-18 International Computers Limited Electronic circuit board with internal optically transmissive layer forming optical bus
JP2000347052A (ja) * 1999-04-02 2000-12-15 Toppan Printing Co Ltd 光・電気配線基板及びその製造方法並びに実装基板
JP2000347051A (ja) * 1999-03-30 2000-12-15 Toppan Printing Co Ltd 光・電気配線基板及びその製造方法並びに実装基板
JP2001166167A (ja) * 1999-12-10 2001-06-22 Toppan Printing Co Ltd 光配線層及びその製造方法並びに光・電気配線基板及びその製造法並びに実装基板
WO2003083543A1 (en) * 2002-04-01 2003-10-09 Ibiden Co., Ltd. Ic chip mounting substrate, ic chip mounting substrate manufacturing method, optical communication device, and optical communication device manufacturing method
JP2006078606A (ja) * 2004-09-07 2006-03-23 Tokai Univ 光接続装置の製造法及びその光接続装置
US7070207B2 (en) 2003-04-22 2006-07-04 Ibiden Co., Ltd. Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication
JP2007505517A (ja) * 2003-09-08 2007-03-08 コニンクリユケ フィリップス エレクトロニクス エヌ．ブイ． 本体および電子装置
JP2008257237A (ja) * 2007-03-30 2008-10-23 Denshi Buhin Kenkyuin 発光素子アレイと光導波路アレイとが直接的に光接続可能な光電変換モジュールおよびその光電変換モジュールの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58140184A (ja) * 1982-02-15 1983-08-19 松下電工株式会社 光信号用印刷配線板
JPS6139736A (ja) * 1984-07-31 1986-02-25 Nec Corp 伝送装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58140184A (ja) * 1982-02-15 1983-08-19 松下電工株式会社 光信号用印刷配線板
JPS6139736A (ja) * 1984-07-31 1986-02-25 Nec Corp 伝送装置

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01124788A (ja) * 1987-02-06 1989-05-17 Matsushita Electric Works Ltd 光センサ
US5408568A (en) * 1992-12-03 1995-04-18 International Computers Limited Electronic circuit board with internal optically transmissive layer forming optical bus
JP2000347051A (ja) * 1999-03-30 2000-12-15 Toppan Printing Co Ltd 光・電気配線基板及びその製造方法並びに実装基板
JP2000347052A (ja) * 1999-04-02 2000-12-15 Toppan Printing Co Ltd 光・電気配線基板及びその製造方法並びに実装基板
JP2001166167A (ja) * 1999-12-10 2001-06-22 Toppan Printing Co Ltd 光配線層及びその製造方法並びに光・電気配線基板及びその製造法並びに実装基板
US8076782B2 (en) 2002-04-01 2011-12-13 Ibiden Co., Ltd. Substrate for mounting IC chip
WO2003083543A1 (en) * 2002-04-01 2003-10-09 Ibiden Co., Ltd. Ic chip mounting substrate, ic chip mounting substrate manufacturing method, optical communication device, and optical communication device manufacturing method
US8120040B2 (en) 2002-04-01 2012-02-21 Ibiden Co., Ltd. Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication
US7070207B2 (en) 2003-04-22 2006-07-04 Ibiden Co., Ltd. Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication
US7693382B2 (en) 2003-04-22 2010-04-06 Ibiden Co., Ltd. Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication
JP2007505517A (ja) * 2003-09-08 2007-03-08 コニンクリユケ フィリップス エレクトロニクス エヌ．ブイ． 本体および電子装置
JP2006078606A (ja) * 2004-09-07 2006-03-23 Tokai Univ 光接続装置の製造法及びその光接続装置
JP2008257237A (ja) * 2007-03-30 2008-10-23 Denshi Buhin Kenkyuin 発光素子アレイと光導波路アレイとが直接的に光接続可能な光電変換モジュールおよびその光電変換モジュールの製造方法

Also Published As

Publication number Publication date
JPH0438154B2 (enExample) 1992-06-23

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