JPS6111480B2 - - Google Patents

Info

Publication number

JPS6111480B2

JPS6111480B2 JP12042279A JP12042279A JPS6111480B2 JP S6111480 B2 JPS6111480 B2 JP S6111480B2 JP 12042279 A JP12042279 A JP 12042279A JP 12042279 A JP12042279 A JP 12042279A JP S6111480 B2 JPS6111480 B2 JP S6111480B2

Authority

JP

Japan

Prior art keywords

electroless plating

metal

catalyst

entire surface

copper

Prior art date

1979-09-18

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 229910052751 metal Inorganic materials 0.000 claims description 13
• 239000002184 metal Substances 0.000 claims description 13
• 238000007772 electroless plating Methods 0.000 claims description 10
• 239000003054 catalyst Substances 0.000 claims description 7
• 238000000034 method Methods 0.000 claims description 7
• 239000004020 conductor Substances 0.000 claims description 6
• 238000004519 manufacturing process Methods 0.000 claims description 6
• 239000000758 substrate Substances 0.000 claims description 6
• 229920005989 resin Polymers 0.000 claims description 2
• 239000011347 resin Substances 0.000 claims description 2
• 239000000976 ink Substances 0.000 description 8
• 239000000243 solution Substances 0.000 description 5
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
• 239000000853 adhesive Substances 0.000 description 4
• 230000001070 adhesive effect Effects 0.000 description 4
• 238000006243 chemical reaction Methods 0.000 description 4
• 229910052802 copper Inorganic materials 0.000 description 4
• 239000010949 copper Substances 0.000 description 4
• 239000000463 material Substances 0.000 description 4
• 238000007639 printing Methods 0.000 description 4
• HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
• QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
• 239000007788 liquid Substances 0.000 description 3
• 239000000203 mixture Substances 0.000 description 3
• WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
• KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
• 230000015572 biosynthetic process Effects 0.000 description 2
• 230000003197 catalytic effect Effects 0.000 description 2
• 239000011248 coating agent Substances 0.000 description 2
• 238000000576 coating method Methods 0.000 description 2
• 238000005553 drilling Methods 0.000 description 2
• 239000003822 epoxy resin Substances 0.000 description 2
• 238000007747 plating Methods 0.000 description 2
• 229920000647 polyepoxide Polymers 0.000 description 2
• PTKWYSNDTXDBIZ-UHFFFAOYSA-N 9,10-dioxoanthracene-1,2-disulfonic acid Chemical compound C1=CC=C2C(=O)C3=C(S(O)(=O)=O)C(S(=O)(=O)O)=CC=C3C(=O)C2=C1 PTKWYSNDTXDBIZ-UHFFFAOYSA-N 0.000 description 1
• KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
• 239000004593 Epoxy Substances 0.000 description 1
• DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
• 239000004640 Melamine resin Substances 0.000 description 1
• 229920000877 Melamine resin Polymers 0.000 description 1
• WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
• 239000002253 acid Substances 0.000 description 1
• ODWXUNBKCRECNW-UHFFFAOYSA-M bromocopper(1+) Chemical compound Br[Cu+] ODWXUNBKCRECNW-UHFFFAOYSA-M 0.000 description 1
• KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
• JZULKTSSLJNBQJ-UHFFFAOYSA-N chromium;sulfuric acid Chemical compound [Cr].OS(O)(=O)=O JZULKTSSLJNBQJ-UHFFFAOYSA-N 0.000 description 1
• 238000007796 conventional method Methods 0.000 description 1
• LPAFSORAXBYKGJ-UHFFFAOYSA-J copper disodium tetraacetate Chemical compound C(C)(=O)[O-].[Cu+2].[Na+].[Na+].C(C)(=O)[O-].C(C)(=O)[O-].C(C)(=O)[O-] LPAFSORAXBYKGJ-UHFFFAOYSA-J 0.000 description 1
• 239000003984 copper intrauterine device Substances 0.000 description 1
• 229910000365 copper sulfate Inorganic materials 0.000 description 1
• ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000004070 electrodeposition Methods 0.000 description 1
• AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
• 239000011521 glass Substances 0.000 description 1
• 238000001746 injection moulding Methods 0.000 description 1
• 230000001678 irradiating effect Effects 0.000 description 1
• 239000002923 metal particle Substances 0.000 description 1
• 229910052763 palladium Inorganic materials 0.000 description 1
• 239000004033 plastic Substances 0.000 description 1
• 239000000843 powder Substances 0.000 description 1
• 239000010970 precious metal Substances 0.000 description 1
• 238000006722 reduction reaction Methods 0.000 description 1
• 238000007650 screen-printing Methods 0.000 description 1
• 229910052708 sodium Inorganic materials 0.000 description 1
• 239000011734 sodium Substances 0.000 description 1
• 239000000126 substance Substances 0.000 description 1
• 229920001187 thermosetting polymer Polymers 0.000 description 1
• 238000005303 weighing Methods 0.000 description 1