JPS61111568A - 半導体パツケ−ジ - Google Patents
半導体パツケ−ジInfo
- Publication number
- JPS61111568A JPS61111568A JP21249885A JP21249885A JPS61111568A JP S61111568 A JPS61111568 A JP S61111568A JP 21249885 A JP21249885 A JP 21249885A JP 21249885 A JP21249885 A JP 21249885A JP S61111568 A JPS61111568 A JP S61111568A
- Authority
- JP
- Japan
- Prior art keywords
- positioning
- package
- substrate
- ceramic
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21249885A JPS61111568A (ja) | 1985-09-27 | 1985-09-27 | 半導体パツケ−ジ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21249885A JPS61111568A (ja) | 1985-09-27 | 1985-09-27 | 半導体パツケ−ジ |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10915879A Division JPS5633865A (en) | 1979-08-29 | 1979-08-29 | Attachment of package |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61111568A true JPS61111568A (ja) | 1986-05-29 |
JPS6255300B2 JPS6255300B2 (enrdf_load_stackoverflow) | 1987-11-19 |
Family
ID=16623656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21249885A Granted JPS61111568A (ja) | 1985-09-27 | 1985-09-27 | 半導体パツケ−ジ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61111568A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6787791B2 (en) | 2000-11-10 | 2004-09-07 | Fuji Photo Film Co., Ltd. | Radiation image information read-out apparatus |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5067966A (enrdf_load_stackoverflow) * | 1973-10-20 | 1975-06-06 | ||
JPS529501A (en) * | 1975-07-11 | 1977-01-25 | Fuji Photo Film Co Ltd | Photoosensitive lithographic press plate material |
JPS5468526U (enrdf_load_stackoverflow) * | 1977-10-21 | 1979-05-15 |
-
1985
- 1985-09-27 JP JP21249885A patent/JPS61111568A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5067966A (enrdf_load_stackoverflow) * | 1973-10-20 | 1975-06-06 | ||
JPS529501A (en) * | 1975-07-11 | 1977-01-25 | Fuji Photo Film Co Ltd | Photoosensitive lithographic press plate material |
JPS5468526U (enrdf_load_stackoverflow) * | 1977-10-21 | 1979-05-15 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6787791B2 (en) | 2000-11-10 | 2004-09-07 | Fuji Photo Film Co., Ltd. | Radiation image information read-out apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPS6255300B2 (enrdf_load_stackoverflow) | 1987-11-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4033439B2 (ja) | 固体撮像ユニットおよびその製造方法、撮像機器 | |
US7084353B1 (en) | Techniques for mounting a circuit board component to a circuit board | |
JP3750276B2 (ja) | 固体撮像素子の搭載方法および固体撮像素子パッケージの装着方法 | |
WO2006068909A1 (en) | Single package design for 3-axis magnetic sensor | |
US5801374A (en) | Precision optical sensor packaging | |
JPS61111568A (ja) | 半導体パツケ−ジ | |
US20090021636A1 (en) | Image pickup module | |
JPS61281559A (ja) | 光検出装置 | |
JPH01217950A (ja) | 固体撮像装置 | |
JPS5910237A (ja) | 半導体装置およびその製造方法 | |
JPH07183993A (ja) | レンズホルダー及びこれを用いた読取装置 | |
JPS59226568A (ja) | 固体撮像装置 | |
JPH04370970A (ja) | 半導体装置 | |
JPH03181158A (ja) | Icパッケージ | |
JPH0520056Y2 (enrdf_load_stackoverflow) | ||
JPS6146997B2 (enrdf_load_stackoverflow) | ||
JP2581841Y2 (ja) | フレキシブル基板の位置決め装置 | |
JPS6150002A (ja) | 相対位置検出装置 | |
JPS588696Y2 (ja) | 電子部品の保持テ−プ | |
JP2722639B2 (ja) | 集積回路パッケージ | |
JPH0770856B2 (ja) | 混成集積回路基板の位置検出方法 | |
JP2563659Y2 (ja) | 半田付け検査用治具 | |
JPH0537260Y2 (enrdf_load_stackoverflow) | ||
JPH03225890A (ja) | 印刷配線基板 | |
JPH03229450A (ja) | 半導体パッケージ |