JPS61105846A - 清浄表面の形成方法 - Google Patents
清浄表面の形成方法Info
- Publication number
- JPS61105846A JPS61105846A JP59226770A JP22677084A JPS61105846A JP S61105846 A JPS61105846 A JP S61105846A JP 59226770 A JP59226770 A JP 59226770A JP 22677084 A JP22677084 A JP 22677084A JP S61105846 A JPS61105846 A JP S61105846A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- molecular beam
- contaminants
- nisi2
- sample
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
Landscapes
- ing And Chemical Polishing (AREA)
- Electrodes Of Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59226770A JPS61105846A (ja) | 1984-10-30 | 1984-10-30 | 清浄表面の形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59226770A JPS61105846A (ja) | 1984-10-30 | 1984-10-30 | 清浄表面の形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61105846A true JPS61105846A (ja) | 1986-05-23 |
| JPH0481857B2 JPH0481857B2 (cg-RX-API-DMAC7.html) | 1992-12-25 |
Family
ID=16850335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59226770A Granted JPS61105846A (ja) | 1984-10-30 | 1984-10-30 | 清浄表面の形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61105846A (cg-RX-API-DMAC7.html) |
-
1984
- 1984-10-30 JP JP59226770A patent/JPS61105846A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0481857B2 (cg-RX-API-DMAC7.html) | 1992-12-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |