JPS609343B2 - 電子部品製造法 - Google Patents

電子部品製造法

Info

Publication number
JPS609343B2
JPS609343B2 JP49120505A JP12050574A JPS609343B2 JP S609343 B2 JPS609343 B2 JP S609343B2 JP 49120505 A JP49120505 A JP 49120505A JP 12050574 A JP12050574 A JP 12050574A JP S609343 B2 JPS609343 B2 JP S609343B2
Authority
JP
Japan
Prior art keywords
temperature
bonded
molten metal
electronic component
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP49120505A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5146072A (enExample
Inventor
学 盆子原
好雄 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP49120505A priority Critical patent/JPS609343B2/ja
Publication of JPS5146072A publication Critical patent/JPS5146072A/ja
Publication of JPS609343B2 publication Critical patent/JPS609343B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP49120505A 1974-10-18 1974-10-18 電子部品製造法 Expired JPS609343B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49120505A JPS609343B2 (ja) 1974-10-18 1974-10-18 電子部品製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49120505A JPS609343B2 (ja) 1974-10-18 1974-10-18 電子部品製造法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP60263373A Division JPS61190954A (ja) 1985-11-22 1985-11-22 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5146072A JPS5146072A (enExample) 1976-04-20
JPS609343B2 true JPS609343B2 (ja) 1985-03-09

Family

ID=14787845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49120505A Expired JPS609343B2 (ja) 1974-10-18 1974-10-18 電子部品製造法

Country Status (1)

Country Link
JP (1) JPS609343B2 (enExample)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5537868B2 (enExample) * 1972-11-09 1980-09-30
FR2205800B1 (enExample) * 1972-11-09 1976-08-20 Honeywell Bull Soc Ind

Also Published As

Publication number Publication date
JPS5146072A (enExample) 1976-04-20

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