JPS609147A - 混合集積回路 - Google Patents
混合集積回路Info
- Publication number
- JPS609147A JPS609147A JP58115937A JP11593783A JPS609147A JP S609147 A JPS609147 A JP S609147A JP 58115937 A JP58115937 A JP 58115937A JP 11593783 A JP11593783 A JP 11593783A JP S609147 A JPS609147 A JP S609147A
- Authority
- JP
- Japan
- Prior art keywords
- insulating plates
- parts
- fixed
- metal substrate
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W90/00—
Landscapes
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58115937A JPS609147A (ja) | 1983-06-29 | 1983-06-29 | 混合集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58115937A JPS609147A (ja) | 1983-06-29 | 1983-06-29 | 混合集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS609147A true JPS609147A (ja) | 1985-01-18 |
| JPH035662B2 JPH035662B2 (enExample) | 1991-01-28 |
Family
ID=14674873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58115937A Granted JPS609147A (ja) | 1983-06-29 | 1983-06-29 | 混合集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS609147A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5096852A (en) * | 1988-06-02 | 1992-03-17 | Burr-Brown Corporation | Method of making plastic encapsulated multichip hybrid integrated circuits |
| JP2009099735A (ja) * | 2007-10-16 | 2009-05-07 | Toshiba Corp | 高周波半導体用パッケージ |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5612756A (en) * | 1979-07-11 | 1981-02-07 | Nec Corp | Integrated circuit device |
| JPS56165656A (en) * | 1980-05-21 | 1981-12-19 | Minamisenjiyu Seisakusho:Kk | Light loading method for continuous sheet |
| JPS57132448U (enExample) * | 1981-02-12 | 1982-08-18 | ||
| JPS591321A (ja) * | 1982-06-16 | 1984-01-06 | ピ−テル・メイン | 卵包装機 |
-
1983
- 1983-06-29 JP JP58115937A patent/JPS609147A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5612756A (en) * | 1979-07-11 | 1981-02-07 | Nec Corp | Integrated circuit device |
| JPS56165656A (en) * | 1980-05-21 | 1981-12-19 | Minamisenjiyu Seisakusho:Kk | Light loading method for continuous sheet |
| JPS57132448U (enExample) * | 1981-02-12 | 1982-08-18 | ||
| JPS591321A (ja) * | 1982-06-16 | 1984-01-06 | ピ−テル・メイン | 卵包装機 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5096852A (en) * | 1988-06-02 | 1992-03-17 | Burr-Brown Corporation | Method of making plastic encapsulated multichip hybrid integrated circuits |
| JP2009099735A (ja) * | 2007-10-16 | 2009-05-07 | Toshiba Corp | 高周波半導体用パッケージ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH035662B2 (enExample) | 1991-01-28 |
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