JPH035662B2 - - Google Patents

Info

Publication number
JPH035662B2
JPH035662B2 JP58115937A JP11593783A JPH035662B2 JP H035662 B2 JPH035662 B2 JP H035662B2 JP 58115937 A JP58115937 A JP 58115937A JP 11593783 A JP11593783 A JP 11593783A JP H035662 B2 JPH035662 B2 JP H035662B2
Authority
JP
Japan
Prior art keywords
metal substrate
bonded
insulating
insulating plate
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58115937A
Other languages
English (en)
Japanese (ja)
Other versions
JPS609147A (ja
Inventor
Tatsuo Yamazaki
Masatami Miura
Yoichi Nakajima
Hirohiko Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Minebea Power Semiconductor Device Inc
Original Assignee
Hitachi Ltd
Hitachi Haramachi Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Haramachi Electronics Ltd filed Critical Hitachi Ltd
Priority to JP58115937A priority Critical patent/JPS609147A/ja
Publication of JPS609147A publication Critical patent/JPS609147A/ja
Publication of JPH035662B2 publication Critical patent/JPH035662B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/00—

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58115937A 1983-06-29 1983-06-29 混合集積回路 Granted JPS609147A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58115937A JPS609147A (ja) 1983-06-29 1983-06-29 混合集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58115937A JPS609147A (ja) 1983-06-29 1983-06-29 混合集積回路

Publications (2)

Publication Number Publication Date
JPS609147A JPS609147A (ja) 1985-01-18
JPH035662B2 true JPH035662B2 (enExample) 1991-01-28

Family

ID=14674873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58115937A Granted JPS609147A (ja) 1983-06-29 1983-06-29 混合集積回路

Country Status (1)

Country Link
JP (1) JPS609147A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5096852A (en) * 1988-06-02 1992-03-17 Burr-Brown Corporation Method of making plastic encapsulated multichip hybrid integrated circuits
JP5100302B2 (ja) * 2007-10-16 2012-12-19 株式会社東芝 高周波半導体用パッケージ

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612756A (en) * 1979-07-11 1981-02-07 Nec Corp Integrated circuit device
JPS56165656A (en) * 1980-05-21 1981-12-19 Minamisenjiyu Seisakusho:Kk Light loading method for continuous sheet
JPS57132448U (enExample) * 1981-02-12 1982-08-18
NL8202431A (nl) * 1982-06-16 1984-01-16 Meyn Pieter Machine voor het verpakken van eieren.

Also Published As

Publication number Publication date
JPS609147A (ja) 1985-01-18

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