JPS609125A - パターン焼付け装置 - Google Patents

パターン焼付け装置

Info

Publication number
JPS609125A
JPS609125A JP58115863A JP11586383A JPS609125A JP S609125 A JPS609125 A JP S609125A JP 58115863 A JP58115863 A JP 58115863A JP 11586383 A JP11586383 A JP 11586383A JP S609125 A JPS609125 A JP S609125A
Authority
JP
Japan
Prior art keywords
wafer
chuck
semiconductor wafer
etching
vertical movement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58115863A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6330781B2 (enExample
Inventor
Masayoshi Serizawa
芹澤　正芳
Minoru Ikeda
稔 池田
Yukio Kenbo
行雄 見坊
Nobuyuki Akiyama
秋山　伸幸
Tomohiro Kuji
久迩　朝宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58115863A priority Critical patent/JPS609125A/ja
Publication of JPS609125A publication Critical patent/JPS609125A/ja
Publication of JPS6330781B2 publication Critical patent/JPS6330781B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP58115863A 1983-06-29 1983-06-29 パターン焼付け装置 Granted JPS609125A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58115863A JPS609125A (ja) 1983-06-29 1983-06-29 パターン焼付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58115863A JPS609125A (ja) 1983-06-29 1983-06-29 パターン焼付け装置

Publications (2)

Publication Number Publication Date
JPS609125A true JPS609125A (ja) 1985-01-18
JPS6330781B2 JPS6330781B2 (enExample) 1988-06-21

Family

ID=14673009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58115863A Granted JPS609125A (ja) 1983-06-29 1983-06-29 パターン焼付け装置

Country Status (1)

Country Link
JP (1) JPS609125A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62279629A (ja) * 1986-05-28 1987-12-04 Hitachi Ltd プロキシミテイ方式の露光装置
JPH0183337U (enExample) * 1987-11-26 1989-06-02
JP2009212345A (ja) * 2008-03-05 2009-09-17 Nsk Ltd ワークチャック、露光装置及びフラットパネル製造方法
JP2009212344A (ja) * 2008-03-05 2009-09-17 Nsk Ltd ワークチャック、露光装置及びフラットパネル製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01312391A (ja) * 1988-06-10 1989-12-18 Matsushita Electric Ind Co Ltd 伝熱管

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5898941A (ja) * 1981-11-30 1983-06-13 テンコ−・インストルメンツ ウエ−ハ・チヤツク

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5898941A (ja) * 1981-11-30 1983-06-13 テンコ−・インストルメンツ ウエ−ハ・チヤツク

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62279629A (ja) * 1986-05-28 1987-12-04 Hitachi Ltd プロキシミテイ方式の露光装置
JPH0183337U (enExample) * 1987-11-26 1989-06-02
JP2009212345A (ja) * 2008-03-05 2009-09-17 Nsk Ltd ワークチャック、露光装置及びフラットパネル製造方法
JP2009212344A (ja) * 2008-03-05 2009-09-17 Nsk Ltd ワークチャック、露光装置及びフラットパネル製造方法

Also Published As

Publication number Publication date
JPS6330781B2 (enExample) 1988-06-21

Similar Documents

Publication Publication Date Title
JP7068378B2 (ja) 基板ホルダ、リソグラフィ装置およびデバイス製造方法
JP5524845B2 (ja) 静電クランプ、リソグラフィ装置および静電クランプを製造する方法
US20100296073A1 (en) Lithographic Apparatus, Substrate Table, and Method for Enhancing Substrate Release Properties
TWI527150B (zh) 靜電鉗、微影裝置及製造靜電鉗之方法
US10144156B2 (en) Imprint apparatus, imprint method, and method for producing device
JP2019144599A (ja) 基板支持体、基板支持ロケーションに基板を搭載するための方法、リソグラフィ装置、及びデバイス製造方法
TWI815329B (zh) 夾持基板至夾持系統之方法、基板固持器及基板支撐器
TWI698704B (zh) 修復一基板支撐件之系統、裝置及方法
US20210263418A1 (en) Tool for modifying a support surface
TW201331721A (zh) 清潔用於固持微影裝置中圖案化器件之支撐件
US20080100812A1 (en) Immersion lithography system and method having a wafer chuck made of a porous material
JPS609125A (ja) パターン焼付け装置
JP4398912B2 (ja) リソグラフィ装置
JPS6015147B2 (ja) 表裏両外面を有する基板ウェファの保持および平面化方法
KR20040055700A (ko) 리소그래피장치, 디바이스제조방법 및 기판홀더
US6806007B1 (en) EUV mask which facilitates electro-static chucking
JPH09148225A (ja) 基板ホルダーおよびそれを用いた微細加工装置
JP2012190827A (ja) インプリントモールド及びその作製方法、パターン形成体
US5459546A (en) Method and apparatus for accurate alignment of semiconductor wafers in photo printers
JPH03163848A (ja) 真空吸着台
US20040021843A1 (en) Method for producing an optical element from a quartz substrate
EP4318133A1 (en) System, apparatus and method for selective surface treatment
JP2019204895A (ja) 型を用いて基板上の組成物を成形する成形装置、成形方法、基板処理方法、および、物品製造方法
KR100781458B1 (ko) 웨이퍼 에지 노광장치
TW202417983A (zh) 防護膜框架、防護膜及帶防護膜的曝光原版、以及防護膜框架的製造方法、曝光方法、半導體裝置的製造方法以及液晶顯示面板的製造方法