JPS6089950A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS6089950A JPS6089950A JP59192505A JP19250584A JPS6089950A JP S6089950 A JPS6089950 A JP S6089950A JP 59192505 A JP59192505 A JP 59192505A JP 19250584 A JP19250584 A JP 19250584A JP S6089950 A JPS6089950 A JP S6089950A
- Authority
- JP
- Japan
- Prior art keywords
- tab
- resin
- leads
- package
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W70/421—
-
- H10W74/111—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59192505A JPS6089950A (ja) | 1984-09-17 | 1984-09-17 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59192505A JPS6089950A (ja) | 1984-09-17 | 1984-09-17 | 半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57097668A Division JPS6034268B2 (ja) | 1982-06-09 | 1982-06-09 | Ic用リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6089950A true JPS6089950A (ja) | 1985-05-20 |
| JPH038112B2 JPH038112B2 (esLanguage) | 1991-02-05 |
Family
ID=16292409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59192505A Granted JPS6089950A (ja) | 1984-09-17 | 1984-09-17 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6089950A (esLanguage) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58162A (ja) * | 1982-06-09 | 1983-01-05 | Hitachi Ltd | Ic用リ−ドフレ−ム |
| JPS59192507A (ja) * | 1983-04-15 | 1984-10-31 | 松下電工株式会社 | 人工化粧単板の製法 |
-
1984
- 1984-09-17 JP JP59192505A patent/JPS6089950A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58162A (ja) * | 1982-06-09 | 1983-01-05 | Hitachi Ltd | Ic用リ−ドフレ−ム |
| JPS59192507A (ja) * | 1983-04-15 | 1984-10-31 | 松下電工株式会社 | 人工化粧単板の製法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH038112B2 (esLanguage) | 1991-02-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20040217450A1 (en) | Leadframe-based non-leaded semiconductor package and method of fabricating the same | |
| JPH0878723A (ja) | 光結合器用パッケージ・リードフレームおよびその方法 | |
| US6703694B2 (en) | Frame for semiconductor package including plural lead frames having thin parts or hollows adjacent the terminal roots | |
| JP2517691B2 (ja) | 半導体装置及びその製造方法 | |
| JPS6089950A (ja) | 半導体装置 | |
| JPS6034268B2 (ja) | Ic用リ−ドフレ−ム | |
| JP3016661B2 (ja) | リードフレーム | |
| JPS6084853A (ja) | Ic用リードフレーム | |
| JPH0233961A (ja) | リードフレーム | |
| KR0167292B1 (ko) | 반도체 다핀 패키지 및 그 제조방법 | |
| JPH0219627B2 (esLanguage) | ||
| JP3036339B2 (ja) | 半導体装置 | |
| JPH04317363A (ja) | ダイパッドレス樹脂封止型半導体装置とその製造方法 | |
| JPH04284656A (ja) | 樹脂封止形半導体装置およびリードフレーム | |
| KR200148634Y1 (ko) | 반도체 패키지 | |
| JPS55127032A (en) | Plastic molded type semiconductor device | |
| KR100239685B1 (ko) | 반도체 패키지 구조 및 그 제작방법 | |
| KR200159002Y1 (ko) | 적층내부 리드리드 프레임 | |
| KR200155051Y1 (ko) | 리드 프레임(Lead Frame) | |
| JPS63287041A (ja) | 半導体素子収納パッケ−ジの製造方法 | |
| JPH06232304A (ja) | フルモールドパッケージ用リードフレーム | |
| JPS63181362A (ja) | リ−ドフレ−ム | |
| JPS6353006A (ja) | 成形装置 | |
| JPH05243464A (ja) | リードフレーム及びこれを用いた樹脂封止型半導体装置 | |
| KR100192329B1 (ko) | 반도체소자 패키지 공정용 리드 프레임 |