JPS6089569A - 合金薄膜の形成方法 - Google Patents

合金薄膜の形成方法

Info

Publication number
JPS6089569A
JPS6089569A JP19617283A JP19617283A JPS6089569A JP S6089569 A JPS6089569 A JP S6089569A JP 19617283 A JP19617283 A JP 19617283A JP 19617283 A JP19617283 A JP 19617283A JP S6089569 A JPS6089569 A JP S6089569A
Authority
JP
Japan
Prior art keywords
substrate
target
sputtering
targets
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19617283A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0470392B2 (esLanguage
Inventor
Masato Sugiyama
杉山　征人
Kimio Kinoshita
木下　公夫
Takashi Tomie
崇 冨江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teijin Ltd
Original Assignee
Teijin Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teijin Ltd filed Critical Teijin Ltd
Priority to JP19617283A priority Critical patent/JPS6089569A/ja
Publication of JPS6089569A publication Critical patent/JPS6089569A/ja
Publication of JPH0470392B2 publication Critical patent/JPH0470392B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP19617283A 1983-10-21 1983-10-21 合金薄膜の形成方法 Granted JPS6089569A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19617283A JPS6089569A (ja) 1983-10-21 1983-10-21 合金薄膜の形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19617283A JPS6089569A (ja) 1983-10-21 1983-10-21 合金薄膜の形成方法

Publications (2)

Publication Number Publication Date
JPS6089569A true JPS6089569A (ja) 1985-05-20
JPH0470392B2 JPH0470392B2 (esLanguage) 1992-11-10

Family

ID=16353394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19617283A Granted JPS6089569A (ja) 1983-10-21 1983-10-21 合金薄膜の形成方法

Country Status (1)

Country Link
JP (1) JPS6089569A (esLanguage)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60145342A (ja) * 1984-01-05 1985-07-31 Mitsubishi Electric Corp 成分濃度勾配を有する合金
FR2739631A1 (fr) * 1995-10-05 1997-04-11 Europ Gas Turbines Sa Revetement de surface anticorrosion de type mcraly, procede de depot d'un tel revetement, aube monocristalline de turbine a gaz pourvue d'un tel revetement
WO2014185403A1 (ja) * 2013-05-13 2014-11-20 大日本印刷株式会社 電子部品を作製するために用いられる積層体および積層体製造方法、フィルムセンサおよびフィルムセンサを備えるタッチパネル装置、並びに、濃度勾配型の金属層を成膜する成膜方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5855566A (ja) * 1981-09-29 1983-04-01 Teijin Ltd 対向タ−ゲツト式スパツタ装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5855566A (ja) * 1981-09-29 1983-04-01 Teijin Ltd 対向タ−ゲツト式スパツタ装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60145342A (ja) * 1984-01-05 1985-07-31 Mitsubishi Electric Corp 成分濃度勾配を有する合金
FR2739631A1 (fr) * 1995-10-05 1997-04-11 Europ Gas Turbines Sa Revetement de surface anticorrosion de type mcraly, procede de depot d'un tel revetement, aube monocristalline de turbine a gaz pourvue d'un tel revetement
WO2014185403A1 (ja) * 2013-05-13 2014-11-20 大日本印刷株式会社 電子部品を作製するために用いられる積層体および積層体製造方法、フィルムセンサおよびフィルムセンサを備えるタッチパネル装置、並びに、濃度勾配型の金属層を成膜する成膜方法
JP2014222419A (ja) * 2013-05-13 2014-11-27 大日本印刷株式会社 電子部品を作製するために用いられる積層体および積層体製造方法、フィルムセンサおよびフィルムセンサを備えるタッチパネル装置、並びに、濃度勾配型の金属層を成膜する成膜方法
KR20160006676A (ko) * 2013-05-13 2016-01-19 다이니폰 인사츠 가부시키가이샤 전자 부품을 제작하기 위하여 사용되는 적층체 및 적층체 제조 방법, 필름 센서 및 필름 센서를 구비하는 터치 패널 장치 및 농도 구배형의 금속층을 성막하는 성막 방법

Also Published As

Publication number Publication date
JPH0470392B2 (esLanguage) 1992-11-10

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