JPS6086840A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS6086840A
JPS6086840A JP58195644A JP19564483A JPS6086840A JP S6086840 A JPS6086840 A JP S6086840A JP 58195644 A JP58195644 A JP 58195644A JP 19564483 A JP19564483 A JP 19564483A JP S6086840 A JPS6086840 A JP S6086840A
Authority
JP
Japan
Prior art keywords
electrodes
gold
protruding electrodes
electrode
protruding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58195644A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0469427B2 (cg-RX-API-DMAC10.html
Inventor
Shuji Kondo
修司 近藤
Isamu Kitahiro
北広　勇
Hiroshi Takahashi
弘 高橋
Minoru Hirai
平井　稔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58195644A priority Critical patent/JPS6086840A/ja
Publication of JPS6086840A publication Critical patent/JPS6086840A/ja
Publication of JPH0469427B2 publication Critical patent/JPH0469427B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P72/74—
    • H10W72/012—
    • H10W72/01204—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/251—

Landscapes

  • Wire Bonding (AREA)
JP58195644A 1983-10-19 1983-10-19 半導体装置の製造方法 Granted JPS6086840A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58195644A JPS6086840A (ja) 1983-10-19 1983-10-19 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58195644A JPS6086840A (ja) 1983-10-19 1983-10-19 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6086840A true JPS6086840A (ja) 1985-05-16
JPH0469427B2 JPH0469427B2 (cg-RX-API-DMAC10.html) 1992-11-06

Family

ID=16344597

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58195644A Granted JPS6086840A (ja) 1983-10-19 1983-10-19 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6086840A (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0218946A (ja) * 1988-07-06 1990-01-23 Rohm Co Ltd Ｉｃの実装方法および実装装置
US5456003A (en) * 1992-06-18 1995-10-10 Matsushita Electric Industrial Co., Ltd. Method for packaging a semiconductor device having projected electrodes

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4869471A (cg-RX-API-DMAC10.html) * 1971-12-22 1973-09-20
JPS57152147A (en) * 1981-03-16 1982-09-20 Matsushita Electric Ind Co Ltd Formation of metal projection on metal lead

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4869471A (cg-RX-API-DMAC10.html) * 1971-12-22 1973-09-20
JPS57152147A (en) * 1981-03-16 1982-09-20 Matsushita Electric Ind Co Ltd Formation of metal projection on metal lead

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0218946A (ja) * 1988-07-06 1990-01-23 Rohm Co Ltd Ｉｃの実装方法および実装装置
US5456003A (en) * 1992-06-18 1995-10-10 Matsushita Electric Industrial Co., Ltd. Method for packaging a semiconductor device having projected electrodes

Also Published As

Publication number Publication date
JPH0469427B2 (cg-RX-API-DMAC10.html) 1992-11-06

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