JPS6086839A - テ−プキヤリア方式を用いた半導体装置の製造方法 - Google Patents
テ−プキヤリア方式を用いた半導体装置の製造方法Info
- Publication number
- JPS6086839A JPS6086839A JP58194894A JP19489483A JPS6086839A JP S6086839 A JPS6086839 A JP S6086839A JP 58194894 A JP58194894 A JP 58194894A JP 19489483 A JP19489483 A JP 19489483A JP S6086839 A JPS6086839 A JP S6086839A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- punching
- punched
- tape carrier
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000000034 method Methods 0.000 claims abstract description 20
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000004080 punching Methods 0.000 abstract description 19
- 239000000969 carrier Substances 0.000 abstract 1
- 238000003860 storage Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 5
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58194894A JPS6086839A (ja) | 1983-10-18 | 1983-10-18 | テ−プキヤリア方式を用いた半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58194894A JPS6086839A (ja) | 1983-10-18 | 1983-10-18 | テ−プキヤリア方式を用いた半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6086839A true JPS6086839A (ja) | 1985-05-16 |
| JPH0216009B2 JPH0216009B2 (enrdf_load_stackoverflow) | 1990-04-13 |
Family
ID=16332093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58194894A Granted JPS6086839A (ja) | 1983-10-18 | 1983-10-18 | テ−プキヤリア方式を用いた半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6086839A (enrdf_load_stackoverflow) |
-
1983
- 1983-10-18 JP JP58194894A patent/JPS6086839A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0216009B2 (enrdf_load_stackoverflow) | 1990-04-13 |
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