JPS6081647U - Mold for resin encapsulation of semiconductor devices - Google Patents

Mold for resin encapsulation of semiconductor devices

Info

Publication number
JPS6081647U
JPS6081647U JP17360683U JP17360683U JPS6081647U JP S6081647 U JPS6081647 U JP S6081647U JP 17360683 U JP17360683 U JP 17360683U JP 17360683 U JP17360683 U JP 17360683U JP S6081647 U JPS6081647 U JP S6081647U
Authority
JP
Japan
Prior art keywords
mold
semiconductor devices
resin encapsulation
resin
flow path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17360683U
Other languages
Japanese (ja)
Inventor
秀樹 栗原
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP17360683U priority Critical patent/JPS6081647U/en
Publication of JPS6081647U publication Critical patent/JPS6081647U/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、従来の金型の概略図であり、第２図は、本考
案の一実施例による金型の概略図である。 １．１’、２．２’、３．３’・・・・・・キャビティ
、４．４′・・・・・・シリンダー、５．５’、６．６
’。 ７．７′・・・・・・ランナー、８．８’、９．９’、
１０．１０’・・・・・；ゲート。FIG. 1 is a schematic diagram of a conventional mold, and FIG. 2 is a schematic diagram of a mold according to an embodiment of the present invention. 1.1', 2.2', 3.3'...Cavity, 4.4'...Cylinder, 5.5', 6.6
'. 7.7'...runner, 8.8', 9.9',
10.10'...;Gate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体装置を樹脂封止するために使用する金型において
、樹脂供給部から、樹脂の流路を通って、すべてのパッ
ケージ成形部までの距離が等しいことを特徴とする半導
体装置の樹脂封止用金型。A mold used for resin-sealing semiconductor devices, characterized in that the distance from the resin supply section to all package molding sections through the resin flow path is equal. Mold.
JP17360683U 1983-11-09 1983-11-09 Mold for resin encapsulation of semiconductor devices Pending JPS6081647U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17360683U JPS6081647U (en) 1983-11-09 1983-11-09 Mold for resin encapsulation of semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17360683U JPS6081647U (en) 1983-11-09 1983-11-09 Mold for resin encapsulation of semiconductor devices

Publications (1)

Publication Number Publication Date
JPS6081647U true JPS6081647U (en) 1985-06-06

Family

ID=30378154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17360683U Pending JPS6081647U (en) 1983-11-09 1983-11-09 Mold for resin encapsulation of semiconductor devices

Country Status (1)

Country Link
JP (1) JPS6081647U (en)

Similar Documents

Publication Publication Date Title
JPS6081647U (en) Mold for resin encapsulation of semiconductor devices
JPS6113952U (en) Lead frame for semiconductor devices
JPS60125730U (en) Resin sealing mold for semiconductor devices
JPS58440U (en) plastic packaging
JPS60109336U (en) Lead frame for semiconductor devices
JPS5967944U (en) Resin-encapsulated semiconductor device
JPS5853157U (en) lead frame
JPS594644U (en) Resin mold semiconductor device
JPS5956757U (en) Resin-encapsulated semiconductor device
JPS5911441U (en) Mold for semiconductor package
JPS58140647U (en) lead frame
JPS59151446U (en) semiconductor equipment
JPS5889931U (en) lead frame
JPS59123344U (en) Resin-encapsulated semiconductor device
JPS59109155U (en) electronic components
JPS5829847U (en) Resin-encapsulated semiconductor device
JPS6016553U (en) Resin-encapsulated semiconductor device
JPS58195434U (en) Mold for semiconductor resin encapsulation equipment
JPS58138350U (en) lead frame
JPS59195751U (en) Resin-encapsulated semiconductor device
JPS5958939U (en) Resin molding equipment for electronic parts
JPS6387843U (en)
JPS60187020U (en) Sprues for injection molds
JPS5918439U (en) Resin-encapsulated semiconductor device
JPS58109247U (en) Transfer molding machine