JPS6080231A - 半導体素子のボンデイング装置におけるリ−ドフレ−ムの自動送り位置決め機構 - Google Patents

半導体素子のボンデイング装置におけるリ−ドフレ−ムの自動送り位置決め機構

Info

Publication number
JPS6080231A
JPS6080231A JP58187128A JP18712883A JPS6080231A JP S6080231 A JPS6080231 A JP S6080231A JP 58187128 A JP58187128 A JP 58187128A JP 18712883 A JP18712883 A JP 18712883A JP S6080231 A JPS6080231 A JP S6080231A
Authority
JP
Japan
Prior art keywords
lead frame
land
circuit
bonding
position detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58187128A
Other languages
English (en)
Japanese (ja)
Other versions
JPH045266B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Masafumi Masuda
増田　眞文
Akio Nakamura
昭夫 中村
Motoi Takagi
基 高木
Masanori Izumi
泉　正則
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sokuhan Co Ltd
Original Assignee
Tokyo Sokuhan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sokuhan Co Ltd filed Critical Tokyo Sokuhan Co Ltd
Priority to JP58187128A priority Critical patent/JPS6080231A/ja
Publication of JPS6080231A publication Critical patent/JPS6080231A/ja
Publication of JPH045266B2 publication Critical patent/JPH045266B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP58187128A 1983-10-07 1983-10-07 半導体素子のボンデイング装置におけるリ−ドフレ−ムの自動送り位置決め機構 Granted JPS6080231A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58187128A JPS6080231A (ja) 1983-10-07 1983-10-07 半導体素子のボンデイング装置におけるリ−ドフレ−ムの自動送り位置決め機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58187128A JPS6080231A (ja) 1983-10-07 1983-10-07 半導体素子のボンデイング装置におけるリ−ドフレ−ムの自動送り位置決め機構

Publications (2)

Publication Number Publication Date
JPS6080231A true JPS6080231A (ja) 1985-05-08
JPH045266B2 JPH045266B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-01-30

Family

ID=16200605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58187128A Granted JPS6080231A (ja) 1983-10-07 1983-10-07 半導体素子のボンデイング装置におけるリ−ドフレ−ムの自動送り位置決め機構

Country Status (1)

Country Link
JP (1) JPS6080231A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5297712A (en) * 1987-10-06 1994-03-29 Kabushiki Kaisha Toshiba System for feeding and positioning articles being processed
WO2010044287A1 (ja) * 2008-10-16 2010-04-22 株式会社新川 基板搬送装置及び基板搬送方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753950A (ja) * 1980-09-17 1982-03-31 Fujitsu Ltd Peretsutobondeingusochi

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753950A (ja) * 1980-09-17 1982-03-31 Fujitsu Ltd Peretsutobondeingusochi

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5297712A (en) * 1987-10-06 1994-03-29 Kabushiki Kaisha Toshiba System for feeding and positioning articles being processed
WO2010044287A1 (ja) * 2008-10-16 2010-04-22 株式会社新川 基板搬送装置及び基板搬送方法
CN102177574A (zh) * 2008-10-16 2011-09-07 株式会社新川 基板运送装置及基板运送方法
KR101096485B1 (ko) 2008-10-16 2011-12-20 가부시키가이샤 신가와 기판 반송 장치 및 기판 반송 방법

Also Published As

Publication number Publication date
JPH045266B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-01-30

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