JPS6063943U - 半導体ウエハ用マウントフレ−ム - Google Patents

半導体ウエハ用マウントフレ−ム

Info

Publication number
JPS6063943U
JPS6063943U JP15658483U JP15658483U JPS6063943U JP S6063943 U JPS6063943 U JP S6063943U JP 15658483 U JP15658483 U JP 15658483U JP 15658483 U JP15658483 U JP 15658483U JP S6063943 U JPS6063943 U JP S6063943U
Authority
JP
Japan
Prior art keywords
opening
semiconductor wafer
mount frame
adhered
adhesive tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15658483U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6322676Y2 (enrdf_load_html_response
Inventor
小野　喬利
Original Assignee
株式会社デイスコ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社デイスコ filed Critical 株式会社デイスコ
Priority to JP15658483U priority Critical patent/JPS6063943U/ja
Publication of JPS6063943U publication Critical patent/JPS6063943U/ja
Application granted granted Critical
Publication of JPS6322676Y2 publication Critical patent/JPS6322676Y2/ja
Granted legal-status Critical Current

Links

JP15658483U 1983-10-07 1983-10-07 半導体ウエハ用マウントフレ−ム Granted JPS6063943U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15658483U JPS6063943U (ja) 1983-10-07 1983-10-07 半導体ウエハ用マウントフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15658483U JPS6063943U (ja) 1983-10-07 1983-10-07 半導体ウエハ用マウントフレ−ム

Publications (2)

Publication Number Publication Date
JPS6063943U true JPS6063943U (ja) 1985-05-07
JPS6322676Y2 JPS6322676Y2 (enrdf_load_html_response) 1988-06-22

Family

ID=30345467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15658483U Granted JPS6063943U (ja) 1983-10-07 1983-10-07 半導体ウエハ用マウントフレ−ム

Country Status (1)

Country Link
JP (1) JPS6063943U (enrdf_load_html_response)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007053162A (ja) * 2005-08-16 2007-03-01 Shin Etsu Polymer Co Ltd 半導体ウェーハのダイシング用フレーム
JP2007335706A (ja) * 2006-06-16 2007-12-27 Shin Etsu Polymer Co Ltd キャリア治具
JP2012109338A (ja) * 2010-11-16 2012-06-07 Disco Abrasive Syst Ltd ワークの加工方法及びダイシングテープ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007053162A (ja) * 2005-08-16 2007-03-01 Shin Etsu Polymer Co Ltd 半導体ウェーハのダイシング用フレーム
JP2007335706A (ja) * 2006-06-16 2007-12-27 Shin Etsu Polymer Co Ltd キャリア治具
JP2012109338A (ja) * 2010-11-16 2012-06-07 Disco Abrasive Syst Ltd ワークの加工方法及びダイシングテープ

Also Published As

Publication number Publication date
JPS6322676Y2 (enrdf_load_html_response) 1988-06-22

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