JPS6063367A - スパツタリング装置 - Google Patents

スパツタリング装置

Info

Publication number
JPS6063367A
JPS6063367A JP17044883A JP17044883A JPS6063367A JP S6063367 A JPS6063367 A JP S6063367A JP 17044883 A JP17044883 A JP 17044883A JP 17044883 A JP17044883 A JP 17044883A JP S6063367 A JPS6063367 A JP S6063367A
Authority
JP
Japan
Prior art keywords
matching
cathode
output
capacitor
high frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17044883A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0229748B2 (enrdf_load_stackoverflow
Inventor
Noboru Kuriyama
昇 栗山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuda Seisakusho Co Ltd
Original Assignee
Tokuda Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuda Seisakusho Co Ltd filed Critical Tokuda Seisakusho Co Ltd
Priority to JP17044883A priority Critical patent/JPS6063367A/ja
Priority to PCT/JP1984/000442 priority patent/WO1985001301A1/ja
Publication of JPS6063367A publication Critical patent/JPS6063367A/ja
Publication of JPH0229748B2 publication Critical patent/JPH0229748B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3444—Associated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP17044883A 1983-09-14 1983-09-14 スパツタリング装置 Granted JPS6063367A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP17044883A JPS6063367A (ja) 1983-09-14 1983-09-14 スパツタリング装置
PCT/JP1984/000442 WO1985001301A1 (en) 1983-09-14 1984-09-13 Sputtering apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17044883A JPS6063367A (ja) 1983-09-14 1983-09-14 スパツタリング装置

Publications (2)

Publication Number Publication Date
JPS6063367A true JPS6063367A (ja) 1985-04-11
JPH0229748B2 JPH0229748B2 (enrdf_load_stackoverflow) 1990-07-02

Family

ID=15905113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17044883A Granted JPS6063367A (ja) 1983-09-14 1983-09-14 スパツタリング装置

Country Status (2)

Country Link
JP (1) JPS6063367A (enrdf_load_stackoverflow)
WO (1) WO1985001301A1 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS624864A (ja) * 1985-06-28 1987-01-10 Matsushita Electric Ind Co Ltd バイアススパツタリング装置
JPH08319564A (ja) * 1988-01-11 1996-12-03 Tadahiro Omi 薄膜形成装置のスパッタリング制御装置
JP2011120699A (ja) * 2009-12-10 2011-06-23 Senju Sprinkler Kk スプリンクラーヘッド付属品着脱工具

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56138879U (enrdf_load_stackoverflow) * 1980-03-24 1981-10-20

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4036723A (en) * 1975-08-21 1977-07-19 International Business Machines Corporation RF bias sputtering method for producing insulating films free of surface irregularities
JPS5558371A (en) * 1978-10-25 1980-05-01 Hitachi Ltd Sputtering apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56138879U (enrdf_load_stackoverflow) * 1980-03-24 1981-10-20

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS624864A (ja) * 1985-06-28 1987-01-10 Matsushita Electric Ind Co Ltd バイアススパツタリング装置
JPH08319564A (ja) * 1988-01-11 1996-12-03 Tadahiro Omi 薄膜形成装置のスパッタリング制御装置
JP2011120699A (ja) * 2009-12-10 2011-06-23 Senju Sprinkler Kk スプリンクラーヘッド付属品着脱工具

Also Published As

Publication number Publication date
WO1985001301A1 (en) 1985-03-28
JPH0229748B2 (enrdf_load_stackoverflow) 1990-07-02

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