JPS6063175A - Thermal printing head - Google Patents

Abstract

PURPOSE:To obtain leads with a desired length even when the leads are provided in an irregular manner, by providing taking-out leads extending continuously from the surfaces of lead taking-out parts not coated with a protective layer to the surface of the protective layer. CONSTITUTION:After vapor-depositing a lead material 9 onto a head 5, photo- etching is conducted to provide the leads 8. The leads 8 are extended from the lead taking-out parts 4 to the surface of the protective layer 7. Even when the leads 8 are provided with a length not smaller than a required length, it is unnecessary to enlarge the base 1 or to enhance close adhesion in masking. Since the leads 8 are not provided by sputtering or the like, leads with a desired length can be securely obtained.

Description

[Detailed description of the invention] The present invention relates to a thermal print head.

As is well known, the Therma V print terminal is connected to the board. In step 1, it is common practice to coat the surface of the dot with a protective film, except for the heating dot part and the lead extraction part.

Figure 1 shows the situation during footing of this protective film, where 1 is the substrate, 2 is the heating dome,
is the lead extraction section - the head 5 configured in this way is
The lead extraction part 4 is covered with a mask 6 made of ceramic ink, stainless steel, etc., and a protective film material (for example, S10+ and Ta) is used.
, 05) will be covered next time.

FIG. 2 shows a sputtered film 5 with a protective film of 7%. Shizu 11 - Konosuno Substrate 1 Tomask 6J - is accurately adhered to the layer and the sputtered particle force (7 when weighted, specifically, as shown in the figure, the edge of the M retention film The edge 'IA 7'lζ will sag towards the lead extraction part 4 side.
1 + )" Lead extraction part 4-value! Because it is covered with the mask 6, it becomes shorter than the 1 square part. (leads, etc.) K, which are the books that should be connected by overlapping, etc., have a length of a predetermined value Km, but in reality they are covered with the mask 6 as described above. In order to maintain the lead extraction portion 4 at a predetermined value, the portion covered by the mask 6 must be made shorter than the predetermined value. If you do this, the board 1 and therefore the head 5 will be longer than necessary along the longitudinal direction of the lead extraction part 4 (if you don't make fjj, this will be too long) 5 This causes the size to increase.

The purpose of this invention is to maintain a high precision lead extraction part without changing the size of the silicon substrate and the high adhesion of masking.

This invention is not coated with a protective film.
'The lead for extraction is formed by overlapping the surface of the extraction part and continuously by a predetermined distance over the surface of the protective film.

Embodiments of the present invention will be explained with reference to FIG. 8 and subsequent figures. FIG. 8 shows a head b constructed in the conventional manner described above. This is the same configuration as in FIG. However, in masking during sputtering to form the protective film 7, the close contact between the mask and the head is a little rough, so there is no problem with this invention. A lead 8 for extraction is provided on the surface of the protective film 7.
Form by overlapping. This formation can be done, for example, by photo-etching.

Therefore, for the head shown in the 8th session, as shown in FIG. 4, K vapor-deposited lead material 9 on the surface of head b and photo-etched the large and required portions. As a result, the leads 8 are formed as shown in FIG. Since the leads 8 are not formed by sputtering or the like, they can be formed with high dimensional accuracy.

1. Therefore, the desired length can be reliably obtained.

Of course, since the lead 8 is formed to extend over the four lead extraction parts and the surface of the protective film 7, it is easy to form the lead 8 to be longer than necessary for overlapping with the lead of the external circuit. , even if it is formed longer than this required length,
As the board 1, use a large book 21-Nanachina I, Jl
There is no reason why. The lead 8 is made slightly wider than the lead 4.

The lead 8 is overlapped with the lead of an external circuit, for example, the lead of a flexible cape V, and connected.

This overlapping part may be mechanically pressed together, but in some cases it may be soldered.

For this purpose, the surface of the lead 8 has a metal layer lO that can be soldered.
Take off the whole shape. When the lead 4 is made of aluminum, for example, it may be formed by plating with a metal plate or silver. Plating the surface of the main lead will remove dandruff, which has been done in the past, but 41. If the surface of the lead 4 is plated in the l- state, as shown in FIG.
In one meeting. Therefore, the boundary part 111'1. c-Moisture = fi-/+ (When it invades, there is J-A! I, -A, l
- After forming the lead 8 as in the present invention, the metal layer l is formed.
Forming O by plating 1. 41-Lee) 4 and protective film 7
Since a metal layer 1073 is formed at the boundary between K and F, a wet basin (7) at the boundary is formed. %The person stands up and speaks with a cover so as to cover the peripheral end face of the lead 8. The metal layer 10 is preferably a solder layer.

As detailed above, according to the present invention, even if the length of the lead extraction part connected to the two heating dot parts is uneven due to inconvenience of masking when forming the protective film, the lead can be formed on the surface. 1. Even if the leads are formed unevenly due to breakage, the desired length can be obtained without causing any trouble, and the lead can be protected. There is no problem with masking even if the masking is a little rough when forming the film, and a metal layer is formed on the surface of the Otsutori Small Use I+-)' by metal plating or soldering, so the leads are protected in a solderable state. When this happens, it has a special effect.

[Brief explanation of drawings]

Figure 1 shows the masking state during the formation of the protective film, Figure 2 is a plan view of the head with the protective film formed, and Figures 8 and 4 show the formation of the lead for extraction according to the present invention. A plan view showing the process, FIG. 6 is a plan view showing an embodiment of the invention,
FIG. 6 is an enlarged sectional view of the main part, and FIG. 7 is an enlarged sectional view of the structure according to the present invention. l...° Substrate-2...Heating dot part%
8...Lead, 4...Lead extraction part, ? ...Protective film, 8...Removal lead-
lO・・・・・・Kin-O layer

Claims (4)

[Claims] (1) A heat-generating dot part and a lead connected to the heat-generating dot part IC are provided on the surface of the board, and a protective film is provided on the surface of the board, leaving part of the lead extraction part and 1-1 the IJ-F extraction part. A thermal print head having a diameter of 1"Kblm and having an extraction lead extending from the surface of the lead extraction part to the surface of the protective film. (2) A thermal print comprising a heat-generating dot portion and a lead connected to the heat-generating dot portion on the surface of a substrate, a part of the lead serving as a lead extraction portion, and a protective film provided on the surface K while leaving the lead extraction portion. A thermal print head in which a lead for extraction is provided on the surface of the lead extraction portion and the surface of the protective film, and a solderable metal layer is provided on a part of the surface of the lead for removing the pre-fertilizer. . (3) The thermal print head according to claim 2, wherein the gold d layer is a plating layer. (4) The thermal V print according to claim 2, wherein the metal layer is a solder layer.