JPS63267564A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS63267564A JPS63267564A JP10257987A JP10257987A JPS63267564A JP S63267564 A JPS63267564 A JP S63267564A JP 10257987 A JP10257987 A JP 10257987A JP 10257987 A JP10257987 A JP 10257987A JP S63267564 A JPS63267564 A JP S63267564A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- protective film
- thermal head
- glaze
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective effect Effects 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract description 12
- 238000005299 abrasion Methods 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract 3
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
（ａ）産業上の利用分野
この発明は、感熱記録装置に用いられるサーマルヘッド
に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Industrial Application Field The present invention relates to a thermal head used in a thermal recording device.
（ｂｌ従来の技術
サーマルヘッドに形成された抵抗体に通電してジュール
熱を発生させ、この熱を熱転写リボンに伝達することに
より記録を行う感熱記録装置においては、熱転写リボン
のインクが用紙表面に確実に転写されるように、一般に
表面の滑らかな専用の用紙が用いられている。しかし、
表面がそれほど滑らかでない通常の用紙に対して記録を
行う場合は、ポリエステルフィルムなどのベースにリリ
ース層を介在させて樹脂系のインクを塗布した３層構造
の熱転写リボンが用いられる。このような樹脂系のイン
クを用いた熱転写リボンを使用する場合は、樹脂インク
同士が再融着しないように、用紙に転写した後短時間の
うちに大きな角度で引き剥がす必要がある。そのため、
この種の熱転写リボンに適合するサーマルヘッドは、従
来よりヘッドの端部付近に発熱部を形成したものが用い
られている。(bl Conventional Technology) In a thermal recording device that performs recording by energizing a resistor formed in a thermal head to generate Joule heat and transmitting this heat to a thermal transfer ribbon, the ink on the thermal transfer ribbon is applied to the surface of the paper. To ensure reliable transfer, special paper with a smooth surface is generally used.However,
When recording on ordinary paper whose surface is not very smooth, a three-layer thermal transfer ribbon is used, which is a base such as a polyester film coated with resin-based ink with a release layer interposed therebetween. When using a thermal transfer ribbon using such a resin-based ink, it is necessary to peel it off at a large angle within a short time after transferring it to the paper so that the resin ink does not re-fuse with each other. Therefore,
A thermal head suitable for this type of thermal transfer ribbon has conventionally been used in which a heat generating portion is formed near the end of the head.
第５図と第６図は上述の従来のサーマルヘッドの構造を
表す図であり、第５図は熱転写リボンに接する面の平面
、第６図は端部付近の断面を表している０図においてｌ
は絶縁性の基板であり、第６図に示すように基板ｌの端
部に蒲鉾状のグレーズ層２が形成されていて、基板１お
よびグレーズ層２の上部に抵抗体層３．リード電極５．
コモン電極６および保護膜８が形成されている。第５図
に示すようにコモン電極６を共通にして各リード電極に
選択的に信号を印加することによりリード電極とコモン
電極間の抵抗体層３が発熱し、この熱が熱転写リボンに
伝達される。このようにサーマルヘッドの端部付近に発
熱部を形成することにより、樹脂系インクが用紙に転写
された直後、熱転写リボンが用紙から大きな角度で引き
剥がされる。Figures 5 and 6 are diagrams showing the structure of the conventional thermal head described above. Figure 5 is a plane of the surface in contact with the thermal transfer ribbon, and Figure 6 is a cross section near the end. l
is an insulating substrate, and as shown in FIG. 6, a semicircular glaze layer 2 is formed at the end of the substrate 1, and a resistor layer 3. is formed on the top of the substrate 1 and the glaze layer 2. Lead electrode5.
A common electrode 6 and a protective film 8 are formed. As shown in FIG. 5, by using the common electrode 6 in common and selectively applying a signal to each lead electrode, the resistor layer 3 between the lead electrode and the common electrode generates heat, and this heat is transferred to the thermal transfer ribbon. Ru. By forming the heat generating portion near the end of the thermal head in this manner, the thermal transfer ribbon is peeled off from the paper at a large angle immediately after the resin-based ink is transferred to the paper.
（Ｃ）発明が解決しようとする問題点
第６図に示した保護膜８は発熱部の酸化および膜はグレ
ーズおよび基板との密着性が悪くしかも高硬度であるた
め、使用中にサーマルヘッドの端部からクラックが入り
保護膜が徐々に剥がれることがあった。これにより防湿
性が低下し、コモン電極が水分により腐食し、導通不良
に至るという問題があった。(C) Problems to be solved by the invention The protective film 8 shown in FIG. Cracks sometimes appeared from the edges and the protective film gradually peeled off. This caused a problem in that the moisture resistance deteriorated and the common electrode was corroded by moisture, resulting in poor conductivity.
この発明の目的は特にヘッド端部にグレーズ層が形成さ
れたタイプにおいても保護膜の剥がれを防止して、耐摩
耗性および耐湿性を向上させたサーマルヘッドを提供す
ることにある。An object of the present invention is to provide a thermal head in which peeling of a protective film is prevented even in a type in which a glaze layer is formed at the end of the head, and the abrasion resistance and moisture resistance are improved.
ｆｄ１問題点を解決するための手段
この発明のサーマルヘッドは、基板上にグレーズ層、導
体層、保護膜がこの順に形成されたサーマルヘッドにお
いて、上記基板の端部でかつグレーズ層と保護膜との間
に、グレーズと保護膜に対する接着性の高い接合層を形
成したことを特徴としている。Means for Solving the FD1 Problem The thermal head of the present invention has a thermal head in which a glaze layer, a conductor layer, and a protective film are formed in this order on a substrate, and the glaze layer and the protective film are formed at the edge of the substrate. It is characterized by forming a bonding layer with high adhesiveness between the glaze and the protective film.
（ｅ）作用
この発明のサーマルヘッドにおいては、基板の端部で、
かつグレーズ層と保護膜との間にグレーズと保護膜に対
する接着性の高い接合層を形成したことにより、保護膜
は基板の端部において上記接合層を介してグレーズ層に
確実に接合される。(e) Function In the thermal head of the present invention, at the end of the substrate,
Furthermore, by forming a bonding layer with high adhesiveness to the glaze and the protective film between the glaze layer and the protective film, the protective film is reliably bonded to the glaze layer at the edge of the substrate via the bonding layer.
ｉｆ）実施例
第１図はこの発明の実施例であるサーマルヘッドの構造
を表す平面図、第２図はその端部付近の部分断面図であ
る。図において１はアルミナセラミクスなどの絶縁性の
基板を表し、この基板１に対して端部付近にグレーズ層
２が形成されている。基板１およびグレーズ層２の上部
には抵抗体層３．４が形成され、その上部に金属！５．
６．７が形成され、さらにその表面に保護膜８が全面に
被覆されている。従来例として第５図および第６図に示
したサーマルヘッドと異なる点は、ヘッドの端部に接合
層としてダミーの抵抗体層４および金属層７を形成して
いる点である。具体的には次のようにして製造すること
ができる。先ず、基板１上にグレーズ２をスクリーン印
刷し焼成した後、全面に抵抗体層とＡｌなどの金属膜を
スパッタリングにより形成し、レジストプロセスとエツ
チングプロセスを２回行って抵抗体層と／１層をバクー
ン化する。その後全面に窒化膜をスパッタリングするこ
とにより構成することができ、さらにヘッドの極端部に
発熱部を形成する場合はヘッド端部をグラインダなとに
よって研削する。if) Embodiment FIG. 1 is a plan view showing the structure of a thermal head according to an embodiment of the present invention, and FIG. 2 is a partial cross-sectional view of the vicinity of the end thereof. In the figure, 1 represents an insulating substrate such as alumina ceramics, and a glaze layer 2 is formed near the end of this substrate 1. A resistor layer 3.4 is formed on the substrate 1 and the glaze layer 2, and a metal! 5.
6.7 is formed, and the entire surface thereof is further covered with a protective film 8. The difference from the conventional thermal head shown in FIGS. 5 and 6 is that a dummy resistor layer 4 and a metal layer 7 are formed as bonding layers at the ends of the head. Specifically, it can be manufactured as follows. First, after screen printing glaze 2 on substrate 1 and baking it, a resistor layer and a metal film such as Al are formed on the entire surface by sputtering, and a resist process and an etching process are performed twice to form the resistor layer and /1 layer. Bakunize. After that, it can be constructed by sputtering a nitride film over the entire surface, and furthermore, if a heat generating part is to be formed at the extreme end of the head, the end of the head is ground with a grinder or the like.
以上のようにして基板の端部で、かつグレーズ層と保護
膜との間に抵抗体層４とＡｌの金属層７が介在されたサ
ーマルヘッドが構成される。金属膜７の表面はポーラス
状であるため保護膜８との接着性が高く、また金属層７
．抵抗体層４およびグレーズ層２間も接着性が高い。こ
のため保護膜８がヘッド端部から剥がれることがなく耐
摩耗性、耐湿性の優れたサーマルヘッドが構成される。As described above, a thermal head is constructed in which the resistor layer 4 and the Al metal layer 7 are interposed at the end of the substrate and between the glaze layer and the protective film. Since the surface of the metal film 7 is porous, it has high adhesion with the protective film 8, and the surface of the metal layer 7 is porous.
．． The adhesiveness between the resistor layer 4 and the glaze layer 2 is also high. Therefore, the protective film 8 does not peel off from the end of the head, and a thermal head with excellent wear resistance and moisture resistance is constructed.
上記実施例は熱転写リボンが用紙から引き剥がされる側
のヘッド端部にのみ接合層を形成した例であったが、例
えば第３図に示すようにヘッドの上端など他の端部にも
接合層を形成することによって保護膜全体の接合強度を
高めることも可能である。In the above embodiment, the bonding layer was formed only at the end of the head on the side where the thermal transfer ribbon is peeled off from the paper, but as shown in FIG. It is also possible to increase the bonding strength of the entire protective film by forming.
上記例は何れも発熱部を形成するための抵抗体層とリー
ド電極およびコモン電極とは別個に接合層を形成した例
であったが、例えば第４図に示すように抵抗体層とコモ
ン電極をヘッド端部まで形成しておくことによって端部
付近の抵抗体層とコモン電極をこの発明における接合層
として兼用することができる。In all of the above examples, a bonding layer was formed separately from the resistor layer for forming the heat generating part, the lead electrode, and the common electrode, but for example, as shown in FIG. By forming the resistor layer up to the end of the head, the resistor layer near the end and the common electrode can be used as the bonding layer in the present invention.
なお、実施例は何れもセラミクス基板の端部付近にのみ
グレーズ層を形成した例であったが、例えば、金属基板
の全面にグレーズ層を焼成したものを基板として用いた
サーマルヘッドに適用することができる。Note that in all of the examples, the glaze layer was formed only near the edges of the ceramic substrate, but for example, the present invention may be applied to a thermal head using a metal substrate with a glaze layer baked on the entire surface as the substrate. Can be done.
（ｇ）発明の効果
以上のようにこの発明によれば、基板端部における保護
膜の剥がれを防止することができ、耐摩耗性、耐湿性の
高い信頼性に優れたサーマルヘッドを構成することがで
きる。(g) Effects of the Invention As described above, according to the present invention, it is possible to prevent the protective film from peeling off at the edge of the substrate, and to construct a highly reliable thermal head with high wear resistance and moisture resistance. Can be done.
第１図はこの発明の実施例に係るサーマルヘッドの平面
図、第２図はその部分断面図、第３図と第４図は他の実
施例に係るサーマルヘッドの平面図、第５図は従来のサ
ーマルヘッドの構造を表す平面図、第６図はその部分断
面図である。
１一基板、２−グレーズ層、
３−抵抗体層（発熱部）、
４−抵抗体層、
５−リード電極、
６−コモン電極、
７−金属層、
（４，７）−接合層、
８−保護膜。FIG. 1 is a plan view of a thermal head according to an embodiment of the present invention, FIG. 2 is a partial sectional view thereof, FIGS. 3 and 4 are plan views of a thermal head according to another embodiment, and FIG. FIG. 6 is a plan view showing the structure of a conventional thermal head, and a partial sectional view thereof. 1 - substrate, 2 - glaze layer, 3 - resistor layer (heat generating part), 4 - resistor layer, 5 - lead electrode, 6 - common electrode, 7 - metal layer, (4,7) - bonding layer, 8 -Protective film.
Claims (1)
形成されたサーマルヘッドにおいて、上記基板の端部で
かつグレーズ層と保護膜との間に、グレーズと保護膜に
対する接着性の高い接合層を形成したことを特徴とする
サーマルヘッド。(1) In a thermal head in which a glaze layer, a conductor layer, and a protective film are formed in this order on a substrate, high adhesion between the glaze layer and the protective film is provided at the edge of the substrate and between the glaze layer and the protective film. A thermal head characterized by forming a bonding layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62102579A JPH0626913B2 (en) | 1987-04-24 | 1987-04-24 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62102579A JPH0626913B2 (en) | 1987-04-24 | 1987-04-24 | Thermal head |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3301854A Division JPH0661945B2 (en) | 1991-11-18 | 1991-11-18 | Thermal head |
| JP3301853A Division JPH0712697B2 (en) | 1991-11-18 | 1991-11-18 | Method of manufacturing thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63267564A true JPS63267564A (en) | 1988-11-04 |
| JPH0626913B2 JPH0626913B2 (en) | 1994-04-13 |
Family
ID=14331139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62102579A Expired - Fee Related JPH0626913B2 (en) | 1987-04-24 | 1987-04-24 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0626913B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5317341A (en) * | 1991-01-24 | 1994-05-31 | Rohm Co., Ltd. | Thermal head and method of making the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52142528A (en) * | 1976-05-21 | 1977-11-28 | Matsushita Electric Ind Co Ltd | Heating elements for printing letters |
| JPS52150967A (en) * | 1976-06-11 | 1977-12-15 | Hitachi Ltd | Semiconductor device |
-
1987
- 1987-04-24 JP JP62102579A patent/JPH0626913B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52142528A (en) * | 1976-05-21 | 1977-11-28 | Matsushita Electric Ind Co Ltd | Heating elements for printing letters |
| JPS52150967A (en) * | 1976-06-11 | 1977-12-15 | Hitachi Ltd | Semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5317341A (en) * | 1991-01-24 | 1994-05-31 | Rohm Co., Ltd. | Thermal head and method of making the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0626913B2 (en) | 1994-04-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |