JPH0712694B2 - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH0712694B2 JPH0712694B2 JP61254112A JP25411286A JPH0712694B2 JP H0712694 B2 JPH0712694 B2 JP H0712694B2 JP 61254112 A JP61254112 A JP 61254112A JP 25411286 A JP25411286 A JP 25411286A JP H0712694 B2 JPH0712694 B2 JP H0712694B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- common
- thermal head
- element group
- glaze layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、フアクシミリやプリンタの感熱記録に使用
されるサーマルヘツドに関するものである。The present invention relates to a thermal head used for thermal recording of facsimiles and printers.
第３図は、例えば特開昭60−183752号公報に示された従
来のサーマルヘツドを示す外観図であり、図において、
(11)は選択リードパターン、(12)は発熱抵抗素子群、(1
3)はセラミツク基板、(14)は放熱板、(20)はコモンリー
ドパターン、(21)は金属フイルムである。FIG. 3 is an external view showing a conventional thermal head disclosed in, for example, JP-A-60-183752.
(11) is the selected lead pattern, (12) is the heating resistor element group, (1
3) is a ceramic substrate, (14) is a heat sink, (20) is a common lead pattern, and (21) is a metal film.
第３図において、発熱抵抗素子群(12)の各々両端に、コ
モンリードパターン(20)と選択リードパターン(11)を設
け、コモンリードパターン(20)に電圧を印加し、選択リ
ードパターン(11)の電位を変化させることにより、発熱
抵抗素子群(12)にジユール熱を与え、任意の発熱抵抗素
子群(12)を発熱させ、発熱抵抗素子群(12)上の感熱紙
（図示せず）を発色させることができる。通常、これら
のデバイスはサーマルヘツドと呼称し、セラミツク基板
(13)上に、該コモンリードパターンや選択リードパター
ン、発熱抵抗素子群、保護膜（図示せず）等が構成要素
となる。サーマルヘツドは、大きな発熱を伴なうことが
多く、アルミ板等で構成された放熱板(14)上にセラミツ
ク基板(13)を搭載する。また、駆動電流を比較的多く必
要とするため、コモンリードパターン(20)に加え、本例
の場合、金属フイルム(21)を用いてコモン強化を計つて
いる。In FIG. 3, a common lead pattern (20) and a selection lead pattern (11) are provided at both ends of the heating resistance element group (12), and a voltage is applied to the common lead pattern (20) to select the selection lead pattern (11). ) Is applied to the heating resistor element group (12) to generate jule heat, causing any heating resistor element group (12) to generate heat, and a thermal paper (not shown) on the heating resistor element group (12). ) Can be colored. These devices are usually called thermal heads, and
The common lead pattern, the selected lead pattern, the heating resistance element group, the protective film (not shown), and the like are components on the (13). The thermal head is often accompanied by large heat generation, and the ceramic board (13) is mounted on the heat dissipation plate (14) made of an aluminum plate or the like. Further, since a relatively large drive current is required, in addition to the common lead pattern (20), the metal film (21) is used in the present example to measure the common reinforcement.
従来のサーマルヘツドは以上のように構成されているの
で、金属フイルムを使用しなければならず、そのために
は、接着をする必要があり、また、金属フイルム箔等の
薄いフイルムを使用しないと、発熱抵抗素子群に通常は
近接して設置するため、上部に位置するプラテンローラ
と接触するという問題があつた。加えて、金属フイルム
箔の接着強度が不安定なために生ずる金属フイルム箔の
はがれ等が大きな問題となつていた。Since the conventional thermal head is configured as described above, it is necessary to use a metal film, for that purpose, it is necessary to bond, and unless a thin film such as a metal film foil is used, Since it is usually installed close to the heating resistance element group, there is a problem that it comes into contact with the platen roller located above. In addition, peeling of the metal film foil caused by unstable adhesive strength of the metal film foil has been a serious problem.
この発明は上記のような問題点を解消するためになされ
たもので、発熱素子群とコモン強化パターン部が近接し
ていても、コモン強化を容易に行なえると共に安価に構
成できるサーマルヘツドを得ることを目的としている。The present invention has been made to solve the above problems, and provides a thermal head that can easily perform common strengthening and can be configured at low cost even if the heating element group and the common strengthening pattern portion are close to each other. Is intended.
この発明に係るサーマルヘツドは、コモンリードパター
ンの端部に近接してAgからなるコモン強化パターンを形
成し、このコモン強化パターンとコモンリードパターン
をAg樹脂ペーストにて接続構成したものである。In the thermal head according to the present invention, a common reinforcing pattern made of Ag is formed close to the end of the common lead pattern, and the common reinforcing pattern and the common lead pattern are connected by an Ag resin paste.
この発明におけるサーマルヘツドは、電気伝導率の高い
Agパターンをコモンパターンとしているため、コモンロ
スが軽減され、大きなコモン電流に対しても、電圧降下
は低減され良好な印字画質を得る。The thermal head in this invention has high electric conductivity.
Since the Ag pattern is used as the common pattern, the common loss is reduced, and the voltage drop is reduced even with a large common current, and good print quality is obtained.
以下、この発明の一実施例を図について説明する。第１
図、第２図において、(1)はセラミツク基板、(2)はこの
セラミツク基板(1)上に構成されたグレーズガラス層で
あり、熱蓄積層とも称する。(3)はAg材で構成されたコ
モン強化パターン、(4)はAu材で構成されたコモンパタ
ーン、(5)はコモンパターン(4)と同一工程で形成される
配線リードパターンである。(6)はコモンパターン(4)お
よび配線リードパターン(5)に接続される発熱抵抗素子
群、(7)は発熱抵抗素子群(6)を覆つて形成するオーバー
ガラス層であり、保護膜又は耐摩耗層とも称す。(8)は
隔離して形成してあるコモン強化パターン(3)とコモン
パターン(4)の一部を接続するためにあけられた孔であ
り、(9)はこの孔に導電性樹脂を埋め込み、コモン強化
パターン(3)とコモンパターン(4)とを接続するための導
電樹脂パターンである。An embodiment of the present invention will be described below with reference to the drawings. First
In FIG. 2 and FIG. 2, (1) is a ceramic substrate, and (2) is a glaze glass layer formed on the ceramic substrate (1), which is also referred to as a heat storage layer. (3) is a common reinforcing pattern made of Ag material, (4) is a common pattern made of Au material, and (5) is a wiring lead pattern formed in the same step as the common pattern (4). (6) is a heating resistance element group connected to the common pattern (4) and the wiring lead pattern (5), (7) is an overglass layer formed to cover the heating resistance element group (6), a protective film or Also referred to as a wear resistant layer. (8) is a hole opened to connect the common reinforcing pattern (3) and part of the common pattern (4) that are formed separately, and (9) is a conductive resin embedded in this hole. , A conductive resin pattern for connecting the common reinforcing pattern (3) and the common pattern (4).
次にこの製造工程につき説明する。まずセラミツク基板
(1)上に周知の工程でグレーズガラス層(2)を形成する。
次にAg材をスクリーン印刷法で印刷し、焼成し、コモン
強化パターン(3)を形成する。次にコモン強化パターン
(3)領域を除く全面にAu材で全面印刷し、焼成し、所定
のマスクを用いて露光現象、エツチングを行ないコモン
パターン(4)と配線リードパターン(5)を形成する。この
場合、コモン強化パターン(3)のAg材はエツチング液で
あるKI-I2等で侵されるため、コモン強化パターン(3)領
域は、エツチング液が浸透しないようテープで覆つてお
く。次に発熱抵抗素子群(6)を印刷、焼成し、その後オ
ーバーガラス層を同様に印刷、焼成する。本例は、周知
の厚膜印刷技術で実施する。ところでオーバーガラス層
(7)の１部に孔(8)が形成されており、孔(8)はコモン強
化パターン(3)およびコモンパターン(4)にまたがつてい
る。次にこの孔(8)に導電樹脂ペーストとしてAg材とエ
ポキシ樹脂を混合したものを使用した物を使用し、導電
樹脂パターン(9)を形成する。膜厚寸法として、コモン
強化パターン(3)は15μｍ、コモンパターン(4)および配
線リードパターンは0.3〜３μｍ、発熱抵抗素子群(6)は
10μｍ、オーバーガラス層(7)は８μｍ、導電樹脂パタ
ーン(9)は５μｍで形成する。なお導電樹脂パターンの
形成法は、導電樹脂ペーストを所定パターンで印刷後、
150℃60分乾燥されることにより、導電性のパターンを
形成することができる。Next, this manufacturing process will be described. First, the ceramic board
A glaze glass layer (2) is formed on (1) by a known process.
Next, the Ag material is printed by a screen printing method and baked to form a common reinforcing pattern (3). Next, common strengthening pattern
(3) The entire surface except the region is printed with Au material, baked, and exposed to light and etched using a predetermined mask to form a common pattern (4) and a wiring lead pattern (5). In this case, since the Ag material of the common strengthening pattern (3) is attacked by KI-I 2 or the like as the etching liquid, the area of the common strengthening pattern (3) is covered with tape to prevent the etching liquid from penetrating. Next, the heating resistance element group (6) is printed and fired, and then the overglass layer is similarly printed and fired. This example is implemented by the well-known thick film printing technique. By the way, overglass layer
A hole (8) is formed in a part of (7), and the hole (8) straddles the common reinforcing pattern (3) and the common pattern (4). Next, a conductive resin pattern (9) is formed in the hole (8) by using a mixture of Ag material and epoxy resin as a conductive resin paste. The thickness of the common reinforcing pattern (3) is 15 μm, the common pattern (4) and the wiring lead pattern are 0.3 to 3 μm, and the heating resistor element group (6) is
The overglass layer (7) is formed with a thickness of 10 μm, the conductive resin pattern (9) is formed with a thickness of 5 μm. The method for forming the conductive resin pattern is that after printing the conductive resin paste in a predetermined pattern,
A conductive pattern can be formed by drying at 150 ° C. for 60 minutes.
なお上記実施例では、コモン強化パターン(3)をコモン
パターン(4)および配線リードパターン(5)に対して前工
程にもつてきたため、エツチング工程で、コモン強化パ
ターン(3)をテープで覆つたが、上記工程を逆に実施し
ても良い。In the above example, since the common reinforcing pattern (3) was brought to the previous process for the common pattern (4) and the wiring lead pattern (5), the common reinforcing pattern (3) was covered with tape in the etching process. However, the above steps may be performed in reverse.
また上記実施例は厚膜サーマルヘツドに適用した場合に
ついて説明したが、コモン強化パターン(3)を形成後、
蒸着、スパツタ法を用いて塗膜形成技術で、コモンパタ
ーン(4)、配線リードパターン(5)、発熱抵抗素子群
(6)、また、Ta2O5,SiO2を用いてオーバーガラス層(7)に
相当する保護膜を形成しても良い。In addition, although the above-mentioned embodiment has been described as applied to the thick film thermal head, after forming the common strengthening pattern (3),
Common pattern (4), wiring lead pattern (5), heating resistor element group by coating film formation technology using vapor deposition and sputtering method
(6) Alternatively, Ta 2 O 5 or SiO 2 may be used to form a protective film corresponding to the overglass layer (7).
また、導電樹脂パターン(9)上に保護層としてフツ素樹
脂等を塗布して形成しても良いが、導電性を必要とする
のは、第２図において部領域のみであるため、オーバ
ーガラス層(7)より上部に位置する導電樹脂パターン(9)
は消失しても良い。Further, a fluorine resin or the like may be applied as a protective layer on the conductive resin pattern (9), but since it is only the partial region in FIG. Conductive resin pattern (9) located above layer (7)
May disappear.
また上記実施例では、孔(8)を設けたがスリツト形状で
もよく、コモン強化パターン(3)および導電樹脂パター
ン(9)はAg材でなくてもAg−Pd等他の金属ペーストを使
用しても同様の効果を奏する。Further, in the above embodiment, the hole (8) is provided, but it may be a slit shape, and the common reinforcing pattern (3) and the conductive resin pattern (9) are not Ag material but other metal paste such as Ag-Pd is used. However, the same effect is obtained.
以上のように、この発明によれば、異種金属同志の接合
によるマイグレーシヨンや合金化による導体抵抗アツプ
の不都合を除去するため、異種金属同志の接合に、導電
樹脂材で導電接続するようにしたので、接合は安定に行
なわれ、且つ、従来はAu材等を用いて構成されていたコ
モン強化パターンを卑金属で実現でき、スクリーン印刷
法のみで全て実施でき、また発熱抵抗素子群に近接し
て、コモン強化パターン等を設置してもたとえプラテン
等が接触しても機能を全うすることができるという効果
がある。As described above, according to the present invention, in order to eliminate the inconvenience of migration due to the joining of dissimilar metals or alloy resistance and up of the conductor resistance due to alloying, conductive connection is made to the dissimilar metal joints. Therefore, the bonding is performed stably, and the common strengthening pattern, which was conventionally configured using Au material or the like, can be realized with the base metal, and all can be performed only by the screen printing method. Even if the common strengthening pattern is installed, the function can be fulfilled even if the platen or the like comes into contact.
第１図はこの発明の一実施例によるサーマルヘツドの外
観図、第２図は第１図のＡ−Ａ断面を示す断面図、第３
図は従来のサーマルヘツドの外観図である。 図において、(1)はセラミツク基板、(2)はグレーズガラ
ス層、(3)はコモン強化パターン、(4)はコモンパター
ン、(5)は配線リードパターン、(6)は発熱抵抗素子群、
(7)はオーバガラス層、(8)は孔、(9)は導電樹脂パター
ンである。 なお、図中同一符号は同一又は相当部分を示す。FIG. 1 is an external view of a thermal head according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing the AA cross section of FIG. 1, and FIG.
The figure is an external view of a conventional thermal head. In the figure, (1) is a ceramic substrate, (2) is a glaze glass layer, (3) is a common reinforcing pattern, (4) is a common pattern, (5) is a wiring lead pattern, (6) is a heating resistor element group,
(7) is an overglass layer, (8) is a hole, and (9) is a conductive resin pattern. The same reference numerals in the drawings indicate the same or corresponding parts.
Claims (1)
れたグレーズ層と、このグレーズ層上に設けられ、一方
側が発熱抵抗素子群に接続されたAu材を含むコモンパタ
ーンと、このコモンパターンの他方側に上記コモンパタ
ーンと離隔して上記グレーズ層上に設けられ、Ag材を含
むコモン強化パターンと、このコモン強化パターンと上
記コモンパターンに亙ってこれらコモンパターン及びコ
モン強化パターン上に設けられ、上記コモンパターンと
上記コモン強化パターンとの間に形成された上記グレー
ズ層上の離隔する部分に達する貫通孔が形成されたガラ
ス層と、上記貫通孔を介して上記離隔する部分に充填し
て上記コモンパターン及び上記コモン強化パターンを接
合するAg材及びエポキシ樹脂ペーストを含む導電樹脂パ
ターンとを備えたことを特徴とするサーマルヘッド。1. A common pattern including an insulating substrate, a glaze layer provided on the insulating substrate, an Au material provided on the glaze layer, and one side of which is connected to a heating resistor element group, On the other side of the common pattern, provided on the glaze layer apart from the common pattern, a common reinforcement pattern including Ag material, and on the common reinforcement pattern and the common pattern, on the common pattern and the common reinforcement pattern. And a glass layer having a through hole reaching the separated portion on the glaze layer formed between the common pattern and the common strengthening pattern, and the separated portion through the through hole. A conductive resin pattern including an Ag material and an epoxy resin paste, which is filled to join the common pattern and the common reinforcing pattern, is provided. The thermal head according to claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61254112A JPH0712694B2 (en) | 1986-10-23 | 1986-10-23 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61254112A JPH0712694B2 (en) | 1986-10-23 | 1986-10-23 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63107566A JPS63107566A (en) | 1988-05-12 |
| JPH0712694B2 true JPH0712694B2 (en) | 1995-02-15 |
Family
ID=17260390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61254112A Expired - Lifetime JPH0712694B2 (en) | 1986-10-23 | 1986-10-23 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0712694B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6436467A (en) * | 1987-07-31 | 1989-02-07 | Rohm Co Ltd | Thermal head |
| JP2571864B2 (en) * | 1990-04-24 | 1997-01-16 | ローム株式会社 | Thick film type thermal head |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6153060A (en) * | 1984-08-24 | 1986-03-15 | Nec Corp | Manufacture method of thermal head |
| JPS6154953A (en) * | 1984-08-27 | 1986-03-19 | Nec Corp | Thermal head |
-
1986
- 1986-10-23 JP JP61254112A patent/JPH0712694B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63107566A (en) | 1988-05-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |