JPS63107566A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS63107566A JPS63107566A JP25411286A JP25411286A JPS63107566A JP S63107566 A JPS63107566 A JP S63107566A JP 25411286 A JP25411286 A JP 25411286A JP 25411286 A JP25411286 A JP 25411286A JP S63107566 A JPS63107566 A JP S63107566A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- common
- thermal head
- printed
- baked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 230000003014 reinforcing effect Effects 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 abstract description 14
- 239000000463 material Substances 0.000 abstract description 12
- 230000002787 reinforcement Effects 0.000 abstract description 9
- 239000000919 ceramic Substances 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 8
- 239000011521 glass Substances 0.000 abstract description 6
- 238000005530 etching Methods 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 14
- 239000010408 film Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000011888 foil Substances 0.000 description 3
- 239000010953 base metal Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000004460 silage Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、ファクシミリやフ゛リンタの感熱記録に使
用されるサーマルヘッドに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thermal head used for thermal recording in facsimiles and printers.
第８因は１例えば特開昭６０−１８８７５２号公報に示
された従来のサーマルヘッドを示す外観図であり。The eighth factor is 1, which is an external view of a conventional thermal head disclosed in, for example, Japanese Unexamined Patent Publication No. 188752/1982.
図において、 （１１）は選択リードパターン、四は発
熱抵抗素子群、ａａはセラミック基板、α４は放熱板。In the figure, (11) is a selected lead pattern, 4 is a heating resistor element group, aa is a ceramic substrate, and α4 is a heat sink.
銅はコモツリードパターン、ゆは金属フィμムである。Copper is Komotsu lead pattern, Yu is metal film.
第８図において１発熱抵抗素子群的の各々両端に、コモ
ンリードパターン■と選択リードパターンＯυを設ケ、
コモンリードパターン（７）に電圧を印加し１選択リー
ドパターンａ力の電位を変化させることにより１発熱抵
抗素子群四にジュール熱を与え、任意の発熱抵抗素子群
（支）を発熱させ１発熱抵抗素子群υ上の感熱紙（図示
せず）を発色させることができる。通常、これらのデバ
イスはサーマルヘッドと呼称し、セラミック基板Ｑ３ｈ
に、該コモンリードパターンや選択リードパターン、発
熱抵抗素子群、保護膜（図示せず〕等が構成要素となる
。サーマルヘッドは、大きな発熱を伴なうことが多く、
アルミ板等で構成された放熱板１１４上にセラミック基
板口を搭載する。また、駆動電流を比較的多く必要とす
るため、コモンリードパターンｅ３＋こ加え１本例の場
合、金属フィルム（ハ）を用いテコモン強化を計ってい
る。In Fig. 8, a common lead pattern ■ and a selection lead pattern Oυ are provided at both ends of each heating resistor element group.
By applying a voltage to the common lead pattern (7) and changing the potential of 1 selected lead pattern a, Joule heat is applied to 1 heating resistor element group 4, causing any heating resistor element group (support) to generate heat. Thermal paper (not shown) on the resistive element group υ can be colored. These devices are usually called thermal heads and are made of ceramic substrate Q3h.
The components include the common lead pattern, selective lead pattern, heating resistor element group, protective film (not shown), etc.Thermal heads often generate a large amount of heat;
A ceramic substrate port is mounted on a heat sink 114 made of an aluminum plate or the like. In addition, since a relatively large drive current is required, in the case of one common lead pattern e3+addition, a metal film (c) is used to strengthen the common lead pattern.
従来のサーマルヘッドは以上のように構成されているの
で、金属フィルムを使用しなければならず、そのために
は、接着をする必要があり、また。Since the conventional thermal head is constructed as described above, it is necessary to use a metal film, which requires adhesion.
金属フィルム箔等の薄いフィルムを使用しないと。Do not use thin films such as metal film foil.
発熱抵抗素子群に通常は近接して設置するため。Because it is usually installed close to a group of heat generating resistor elements.
上部に位置する１フテンローラと接触するという問題が
あった。加えて、金１４フィルム箔の接着強度が不安定
なために生ずる金属フィルム箔のはがれ等が大きな問題
となっていた。There was a problem that it came into contact with the 1st foot roller located at the top. In addition, peeling of the metal film foil caused by the unstable adhesive strength of the gold-14 film foil has become a major problem.
この発明は上記のような問題点を解消するためになされ
たもので１発熱素子群とコモン強化パターン部が近接し
ていても、コモン強化を容易に行なえると共に安価に構
成できるサーマルヘッドを得ることを目的としている。This invention has been made to solve the above-mentioned problems, and provides a thermal head that can easily strengthen the common and can be constructed at low cost even if one heating element group and the common reinforcement pattern are close to each other. The purpose is to
この発明に係るサーマルヘッドは、コモンリードパター
ンの端部に近接してＡｇからなるコモン強化パターンを
形成し、このコモン強化パターンとコモンリードパター
ンをＡｇ樹脂ペーストにて接続構成したものである。In the thermal head according to the present invention, a common reinforcing pattern made of Ag is formed close to the end of a common lead pattern, and the common reinforcing pattern and the common lead pattern are connected with Ag resin paste.
この発明におけるサーマルヘッドは、電気伝導率の高い
Ａｇパターンをコモン強ターントシているため、コモン
ロスが軽減され、大きなコモン電流に対しても、９圧降
下は低減され良好な印字画質を得る。In the thermal head according to the present invention, since the Ag pattern with high electrical conductivity is strongly rotated in the common direction, the common loss is reduced, and even with a large common current, the voltage drop is reduced and good print image quality is obtained.
以下、この発明の一実施例を図について説明する。第１
図、第２図において、（υはセラミック基板、（２）は
このセラミック基板（１）上に構成されたグレーズガラ
ス層であり、熱蓄積層とも称する。（３）はＡｇ材で構
成されたコモン強化パターン、 （４） （、ｔＡｕ材
で構成されたコモンパターン、（５〕はコモンパターン
（４）と同一工程で形成される配線リードパターンであ
る。（６）はコモンパターン（４）および配線リードパ
ターン（５）に接続される発熱抵抗素子群、（７）は発
熱抵抗素子群（６）を覆って形成するオーバーガラス層
であり、保護膜又は耐摩耗層とも称す、 （８）は隔離
して形成しであるコモン強化パターン（３）とコモンパ
ターン（４）の一部を接続するためにあけられた孔であ
り、（９）はこの孔に導電性樹脂を埋め込み。An embodiment of the present invention will be described below with reference to the drawings. 1st
In Fig. 2, (υ is a ceramic substrate, (2) is a glazed glass layer formed on this ceramic substrate (1), also called a heat storage layer. (3) is a layer made of Ag material. Common reinforcing pattern, (4) (, common pattern made of tAu material, (5) is a wiring lead pattern formed in the same process as common pattern (4), (6) is common pattern (4) and The heating resistor element group (7) is connected to the wiring lead pattern (5), and (7) is an over glass layer formed to cover the heating resistor element group (6), which is also called a protective film or a wear-resistant layer. This hole is made to connect a part of the common reinforcing pattern (3) and the common pattern (4), which are formed separately, and the hole (9) is filled with a conductive resin.
コモン強化パターン（３）とコモンパターン（４）とを
接続するための導電樹脂パターンである。This is a conductive resin pattern for connecting the common reinforcing pattern (3) and the common pattern (4).
次（ここの製造工程につき説明する。まずセラミック基
板（１）上に周知の工程でグレーズガラス層（２）を形
成する。次にＡｇ材をスクリーン印刷法で印刷し、焼成
し、コモン強化パターン（３）を形成する。Next (The manufacturing process here will be explained. First, a glaze glass layer (2) is formed on a ceramic substrate (1) by a well-known process. Next, an Ag material is printed by screen printing method, fired, and a common reinforced pattern is formed. (3) is formed.
次にコモン強化パターン（３）領域を除く全面にＡｕ材
で全面印刷し、焼成し、所定のマスクを用いて露光具ａ
、エツチングを行ないコモンパターン（４）ト配線’Ｊ
−）’パターン（５）を形成する。この場合、コモン
強化パターン（３）のＡｇ材はエツチング液であるＫｌ
−Ｉ、１等で侵されるため、コモン強化パター ン（３
）領域は、エツチング液が浸透しないようテープで覆っ
ておく。次１ζ発熱抵抗素子群（６）を印刷、焼成し、
その後オーバーガラス層を同様に印刷、焼成する。本例
は０周知の厚膜印刷技術で実施する。Next, the entire surface except for the common reinforcement pattern (3) area is printed with Au material, baked, and exposed using a prescribed mask.
, etching the common pattern (4)
-)' form pattern (5). In this case, the Ag material of the common reinforcement pattern (3) is etched with Kl, which is an etching liquid.
-I, 1 etc., so the common strengthening pattern (3
) area should be covered with tape to prevent the etching solution from penetrating. Next, 1ζ heating resistor element group (6) is printed and fired,
Thereafter, an overglass layer is printed and fired in the same manner. This example is carried out using well-known thick film printing technology.
ところでオーバーガラス層（７）の１部に孔（８）が形
成されており、孔（８）はコモン強化パターン（３）お
よびコモンパターン（４）にまたがっている。次にこの
孔＋８＞ ニ導？１ｍ！ 樹脂ペーストとしてＡｇ材と
エポ’ｑシｍ脂を混合したものを使用した物を使用し、
導電樹脂パターン（９）を形成する。膜７寸法として、
コモン強化パターン（３）は１６μｍ、コモンパターン
（４）および配線リードパターンは０．８〜３μｍ、発
熱抵抗素子群（６）は１０μｍ、オーバーガラス層（７
）は８μｍ、導？ｌｌＺ ｍＪ脂パターン（９）は５μ
Ｉｎ程度で形成する。なお導電樹脂パターンの形成法は
、導電防詣ペーストを所定パターンで印刷後、１５０℃
６０分乾燥されることにより、導電性のパターンを形成
することができる。By the way, a hole (8) is formed in a part of the overglass layer (7), and the hole (8) straddles the common reinforcing pattern (3) and the common pattern (4). Next, this hole +8> Ni lead? 1m! A resin paste made of a mixture of Ag material and Epo'q resin was used.
A conductive resin pattern (9) is formed. As the membrane 7 dimension,
The common reinforcement pattern (3) is 16 μm, the common pattern (4) and the wiring lead pattern are 0.8 to 3 μm, the heating resistor element group (6) is 10 μm, and the over glass layer (7
) is 8 μm, conductive? llZ mJ fat pattern (9) is 5μ
It is formed of about In. The method for forming the conductive resin pattern is to print the conductive protective paste in a predetermined pattern and then heat it at 150°C.
By drying for 60 minutes, a conductive pattern can be formed.
なおｔ記実施例では、コモン強化パターン（３）をコモ
ンパターン（４）および配線リードノ＜ ｐ −７（５
） ニ対して前工程にもってきたため、エツチング工程
で、コモン強化パターン（３）をテープで覆ったが。In the example described in t, the common reinforcing pattern (3) is connected to the common pattern (4) and the wiring lead no.
) On the other hand, since it was brought into the previous process, the common reinforcement pattern (3) was covered with tape in the etching process.
上記工程を逆に実施しても良い。The above steps may also be performed in reverse.
また上記実施例は厚膜サーマルヘッドに適用した場合に
ついて説明したが、コモン強化ノ（ターン（３） ヲ形
成後、蒸着、スパッタ法を用いて塗膜形成波ｉで、コモ
ンパターン（’） −配線！Ｊ −Ｆ ／（ｐ −ン（
５）１発熱抵抗素子Ｂ￥（６）、また、 Ｔａ２０Ｂ
、 ５ｉ０２を用いてオーバーガラス層（７）に相当す
る保護膜を形成しても良い。Furthermore, although the above embodiment has been described for the case where it is applied to a thick film thermal head, after forming the common reinforcing layer (turn (3)), the common pattern (') - Wiring!J-F/(p-n(
5) 1 heating resistance element B ¥ (6), also Ta20B
, 5i02 may be used to form a protective film corresponding to the overglass layer (7).
また、導′Ｒ，ｍ脂パターン（９）Ｊ：、に保護層とし
てフッ緊樹脂等を塗布して形成しても良いが、導電性を
必要とするのは、第２図において０部領域のみであるた
め、オーバーガラス層（７）より上部に位置する導電樹
脂パターン（９）は消失しても良い。In addition, conductive pattern (9) J: may be formed by applying a fluorocarbon resin or the like as a protective layer, but conductivity is required in the 0 area in FIG. Therefore, the conductive resin pattern (9) located above the overglass layer (7) may disappear.
また上記実施例では、孔（８）を設けたがスリット形状
でもよく、コモン強化パターン（３）および導電樹脂パ
ターン（９）はＡｇ材でなくてもＡｇ−Ｐｄ等他の金属
ペーストを使用しても同様の効果を奏する。Furthermore, although the hole (8) is provided in the above embodiment, it may be in the form of a slit, and the common reinforcing pattern (3) and the conductive resin pattern (9) may be made of other metal paste such as Ag-Pd instead of Ag material. The same effect can be achieved.
以上のように、この発明によれば、異穏金属同志の接合
によるマイ、グレージョンや合金化による導体抵抗アッ
プの不都合を除去するため、異毬金属同志の接合に、導
電樹脂材で導電接続するようにしたので、接合は安定に
行なわれ、且つ、従来はＡｕ材等を用いて構成されてい
たコモン強化パターンを卑金属で実現でき、スクリーン
印刷法のみで全て実施でき、また発熱抵抗素子群に近接
して。As described above, according to the present invention, in order to eliminate the inconvenience of increase in conductor resistance due to migration and gray silage and alloying caused by joining of dissimilar metals, conductive connection is made using a conductive resin material when joining dissimilar metals. As a result, the bonding is stable, and the common reinforcing pattern, which was conventionally constructed using Au material, can be realized with base metal, and can be performed entirely by screen printing, and the heat generating resistor element group can be realized using base metal. In close proximity to.
コモン強化パターン等を設置してもたとえプラテン等が
接触しても機能を全うすることができるという効果があ
る。Even if a common reinforcing pattern or the like is installed, there is an effect that the function can be fulfilled even if the platen or the like comes into contact.
第１図はこの発明の一実施例によるサーマルヘッドの外
観図１ｇ２図は第１図のＡ−Ａ断面を示す断面図、第８
図は従来のサーマルヘッドの外観図である。
図において、（ｌ］はセラミック基板、（２）はグレー
ズガラス層、（３）はコモン強化パターン、（４）はコ
モンパターン、（５）は配線リードパターン、（ａ）ハ
発熱抵抗素子群、（７）はオーバガラス層、（８）は孔
、（９）は導電樹脂パターンである。
なお１図中同一符号は同−又は相当部分を示す。FIG. 1 is an external view of a thermal head according to an embodiment of the present invention, and FIG.
The figure is an external view of a conventional thermal head. In the figure, (l) is a ceramic substrate, (2) is a glazed glass layer, (3) is a common reinforcing pattern, (4) is a common pattern, (5) is a wiring lead pattern, (a) is a heating resistor element group, (7) is an overglass layer, (8) is a hole, and (9) is a conductive resin pattern.In addition, the same reference numerals in FIG. 1 indicate the same or corresponding parts.
Claims (1)
形成されたサーマルヘッドにおいて、発熱抵抗素子群の
一方に共通に接続されたコモンパターンに近接してＡｕ
以外の金属を主成分とする厚膜導電ペーストを用いて形
成されたコモン強化パターンを有し、このコモン強化パ
ターンと上記コモンパターンとを導電樹脂ペーストを用
いて接続したことを特徴としたサーマルヘッド。 ２、コモン強化パターンに使用する厚膜導電ペーストは
Ａｇを主成分とすることを特徴とする特許請求範囲第１
項記載のサーマルヘッド。 ３、導電樹脂ペーストの塗布予定領域に孔又はスリット
が形成されるよう耐摩耗層を形成し、この形成された孔
又はスリットに導電樹脂ペーストを充填塗布したことを
特徴とする特許請求の範囲第１項または第２項記載のサ
ーマルヘッド。[Claims] 1. In a thermal head in which a large number of heat generating resistive elements are arranged in a line on an insulating substrate, an Au
A thermal head characterized in that it has a common reinforced pattern formed using a thick film conductive paste whose main component is a metal other than the above, and the common reinforced pattern and the common pattern are connected using a conductive resin paste. . 2. Claim 1, characterized in that the thick film conductive paste used for the common reinforcing pattern has Ag as its main component.
Thermal head described in section. 3. The wear-resistant layer is formed so that holes or slits are formed in the area where the conductive resin paste is to be applied, and the formed holes or slits are filled with the conductive resin paste. The thermal head according to item 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61254112A JPH0712694B2 (en) | 1986-10-23 | 1986-10-23 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61254112A JPH0712694B2 (en) | 1986-10-23 | 1986-10-23 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63107566A true JPS63107566A (en) | 1988-05-12 |
| JPH0712694B2 JPH0712694B2 (en) | 1995-02-15 |
Family
ID=17260390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61254112A Expired - Lifetime JPH0712694B2 (en) | 1986-10-23 | 1986-10-23 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0712694B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6436467A (en) * | 1987-07-31 | 1989-02-07 | Rohm Co Ltd | Thermal head |
| JPH047161A (en) * | 1990-04-24 | 1992-01-10 | Rohm Co Ltd | Thick film type thermal head |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6153060A (en) * | 1984-08-24 | 1986-03-15 | Nec Corp | Manufacture method of thermal head |
| JPS6154953A (en) * | 1984-08-27 | 1986-03-19 | Nec Corp | Thermal head |
-
1986
- 1986-10-23 JP JP61254112A patent/JPH0712694B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6153060A (en) * | 1984-08-24 | 1986-03-15 | Nec Corp | Manufacture method of thermal head |
| JPS6154953A (en) * | 1984-08-27 | 1986-03-19 | Nec Corp | Thermal head |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6436467A (en) * | 1987-07-31 | 1989-02-07 | Rohm Co Ltd | Thermal head |
| JPH0417795B2 (en) * | 1987-07-31 | 1992-03-26 | Rohm Kk | |
| JPH047161A (en) * | 1990-04-24 | 1992-01-10 | Rohm Co Ltd | Thick film type thermal head |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0712694B2 (en) | 1995-02-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |